CN1962159A - Cadmium-free silver based solder containing gallium, indium and cerium - Google Patents
Cadmium-free silver based solder containing gallium, indium and cerium Download PDFInfo
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- CN1962159A CN1962159A CN 200610097767 CN200610097767A CN1962159A CN 1962159 A CN1962159 A CN 1962159A CN 200610097767 CN200610097767 CN 200610097767 CN 200610097767 A CN200610097767 A CN 200610097767A CN 1962159 A CN1962159 A CN 1962159A
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Abstract
The invention relates to a non-cadmium silver base solder with gallium, indium and cerium, wherein it comprises that 26.0%-35.0% copper, 20.0%-33.0% zinc, 0.001%-0.5% gallium, 0.001%-0.3% indium, 0.002%-0.10% cerium, and the left is silver. The invention has the advantages that: it can replace the solders as BAg45CuZnCd and BAg45CuZn. And it can reduce the fusion point by added gallium and indium, and it has cerium to refine the crystal of solder, to improve its property.
Description
Technical field
The present invention relates to a kind of cadmium-free silver-base solder that contains gallium, indium and cerium, particularly a kind of cadmium-free silver-base solder that is applicable to metal material solderings such as red copper, brass, carbon steel, stainless steel and nickel-base alloy belongs to the brazing material of class of metal materials and field of metallurgy.
Background technology
Present silver solder BAg45CuZnCd, the BAg45CuZn that uses, silver content is about 45% in its chemical composition.Though the BAg45CuZnCd function admirable along with European Union " ROHS " instructs in the enforcement on July 1st, 2006, contains cadmium material and just progressively bans use of, because cadmium has contaminative to influential the reaching of operator's health safety to environment.Therefore; research and development have good brazing property, suitable solid-liquid phase line temperature and have compare favourably to the combination property of traditional BAg45CuZnCd solder in addition more excellent, silver content quite or similar brazing material to substitute BAg45CuZnCd, BAg45CuZn solder, have the positive effect of the protection environment of important economic value and reality.
Summary of the invention
Task of the present invention be to provide a kind of can the welding position in brazing process and after the soldering do not have fully poisonous element cadmium, brazing property is good, have the combination property suitable with traditional BAg45CuZnCd solder and the cadmium-free silver-base solder that contains gallium, indium and cerium of silver content.
Task of the present invention is finished like this, a kind of cadmium-free silver-base solder that contains gallium, indium and cerium, its chemical composition by the mass percent proportioning is: 26.0%～35.0% copper (Cu), 20.0%～33.0% zinc (Zn), 0.001%～0.5% gallium (Ga), 0.001%～0.3% indium (In), 0.002%～0.10% cerium (Ce), all the other are silver (Ag).
The advantage that the present invention has: 1) because of not containing poisonous cadmium element in the composition, so can guarantee operator's health safety and avoid environment is exerted an influence; 2) alternative BAg45CuZnCd, BAg45CuZn solder are owing to by optimizing the content of gallium, indium and cerium and silver, copper, three kinds of host elements of zinc, make solder of the present invention have good wetability, good, the brazed seam mechanical property (σ of spreadability to mother metal
b, τ); 3) owing to added an amount of gallium (Ga) and indium (In), therefore the cost of raw material is being increased the fusing point that can reduce solder of the present invention under few situation; And can improve the wetability of solder of the present invention on red copper, brass, carbon steel, stainless steel and nickel-base alloy, add rare-earth element cerium (Ce) simultaneously,, improve the plasticity and the comprehensive mechanical property of solder of the present invention with the crystal grain of refinement new invention solder.
The specific embodiment
1), use commercially available silver, cathode copper, zinc ingot metal, gallium, indium metal, metallic cerium, by said ratio, adopt that conventional intermediate frequency smelting furnace is smelted, casting, by extruding, drawing, promptly obtain needed solder wire material then; 2), according to producing needs, gallium, indium metal, metallic cerium can be smelted into alloy respectively in advance, add then in silver-copper-zinc alloy smelt, casting, by extruding, drawing, promptly obtain needed solder wire material again.The solidus temperature of resulting solder wire material at 650 ℃～665 ℃ scopes, liquidus temperature 730 ℃～745 ℃ scopes; Cooperate FB102 (QJ102) brazing flux, brazing material is following combination: when red copper-brass, brass-carbon steel, stainless steel-nickel-base alloy, the brazed seam mechanical property is respectively: σ
b=185～365MPa, τ=180～355MPa.
Adopt conventional intermediate frequency smelting furnace to smelt, cast, by extruding, drawing, promptly obtain needed solder wire material then; The cadmium-free silver-base solder that contains gallium, indium and cerium of the present invention is that 45% solder is an object of reference with silver content, cooperate FB102 silver brazing flux (QJ102 silver brazing flux), during combinations of materials such as soldering red copper-brass, brass-carbon steel, stainless steel-nickel-base alloy, wetability, spreadability to mother metal are suitable with it, the suitable with it (σ of brazed seam mechanical property
b=185～365MPa, τ=180～355MPa scope).The cadmium-free silver-base solder that contains gallium, indium and cerium of the present invention does not have the harmful element cadmium fully, has protected operator's health safety effectively, has eliminated the pollution to environment.The brazed seam mechanical performance index of solder and BAg45CuZnCd, BAg45CuZn solder are suitable.Therefore, solder of the present invention can be used as fully the substitute of BAg45CuZn solder and is applied to metal material and field of metallurgy.
The specific embodiment
According to the mass percent proportioning that contains the cadmium-free silver-base solder of gallium, indium and cerium of the present invention, narration the specific embodiment of the present invention.
The specific embodiment one:
Press the mass percent proportioning, its composition is: 26.0% bronze medal (Cu), and 33.0% zinc (Zn), 0.5% gallium (Ga), 0.001% indium (In), 0.002% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 730 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment two:
Press the mass percent proportioning, its composition is: 35.0% bronze medal (Cu), and 20.0% zinc (Zn), 0.001% gallium (Ga), 0.3% indium (In), 0.10% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment three:
Press the mass percent proportioning, its composition is: 30.0% bronze medal (Cu), and 25.0% zinc (Zn), 0.001% gallium (Ga), 0.001% indium (In), 0.10% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 665 ℃, liquidus temperature (considered experimental error) about 745 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment four:
Press the mass percent proportioning, its composition is: 30.0% bronze medal (Cu), and 25.0% zinc (Zn), 0.01% gallium (Ga), 0.01% indium (In), 0.002% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 665 ℃, liquidus temperature (considered experimental error) about 745 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment five:
Press the mass percent proportioning, its composition is: 26.0% bronze medal (Cu), and 29.0% zinc (Zn), 0.1% gallium (Ga), 0.1% indium (In), 0.02% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 655 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment six:
Press the mass percent proportioning, its composition is: 28.0% bronze medal (Cu), and 31.0% zinc (Zn), 0.5% gallium (Ga), 0.3% indium (In), 0.10% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 730 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment seven:
Press the mass percent proportioning, its composition is: 34.0% bronze medal (Cu), and 30.0% zinc (Zn), 0.5% gallium (Ga), 0.001% indium (In), 0.006% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 655 ℃, liquidus temperature (considered experimental error) about 745 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment eight:
Press the mass percent proportioning, its composition is: 31.0% bronze medal (Cu), and 26.0% zinc (Zn), 0.05% gallium (Ga), 0.1% indium (In), 0.06% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 660 ℃, liquidus temperature (considered experimental error) about 745 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment nine:
Press the mass percent proportioning, its composition is: 28.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.05% gallium (Ga), 0.05% indium (In), 0.03% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 660 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment ten:
Press the mass percent proportioning, its composition is: 29.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.15% gallium (Ga), 0.15% indium (In), 0.03% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 655 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 11:
Press the mass percent proportioning, its composition is: 34.0% bronze medal (Cu), and 22.0% zinc (Zn), 0.15% gallium (Ga), 0.3% indium (In), 0.05% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 12:
Press the mass percent proportioning, its composition is: 27.0% bronze medal (Cu), and 28.0% zinc (Zn), 0.35% gallium (Ga), 0.1% indium (In), 0.01% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 13:
Press the mass percent proportioning, its composition is: 28.0% bronze medal (Cu), and 27.0% zinc (Zn), 0.35% gallium (Ga), 0.12% indium (In), 0.1% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 14:
Press the mass percent proportioning, its composition is: 32.0% bronze medal (Cu), and 23.0% zinc (Zn), 0.45% gallium (Ga), 0.2% indium (In), 0.08% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 735 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 15:
Press the mass percent proportioning, its composition is: 34.2% bronze medal (Cu), and 21.5% zinc (Zn), 0.15% gallium (Ga), 0.28% indium (In), 0.006% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 660 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 16:
Press the mass percent proportioning, its composition is: 29.0% bronze medal (Cu), and 24.4% zinc (Zn), 0.25% gallium (Ga), 0.2% indium (In), 0.04% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 650 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 17:
Press the mass percent proportioning, its composition is: 26.5% bronze medal (Cu), and 28.4% zinc (Zn), 0.2% gallium (Ga), 0.1% indium (In), 0.006% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 660 ℃, liquidus temperature (considered experimental error) about 740 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
The specific embodiment 18:
Press the mass percent proportioning, its composition is: 29.5% bronze medal (Cu), and 24.8% zinc (Zn), 0.002% gallium (Ga), 0.003% indium (In), 0.004% cerium (Ce), all the other are silver (Ag).
" cadmium-free silver-base solder that contains gallium, indium and cerium " solidus temperature that the mentioned component proportioning obtains about 665 ℃, liquidus temperature (considered experimental error) about 745 ℃, cooperate FB102 (QJ102) brazing flux, the brazed seam intensity when the soldering mother metal is following the combination is seen data in the bracket: red copper-brass (σ
b=210 ± 25MPa, τ=200 ± 30MPa), brass-carbon steel (σ
b=330 ± 25MPa, τ=325 ± 30MPa), stainless steel-nickel-base alloy (σ
b=350 ± 15MPa, τ=260 ± 10MPa).
By the gallium that contains of the present invention, the cadmium-free silver-base solder of indium and cerium is a copper at soldering mother metal purple, brass, carbon steel, stainless steel, during nickel-base alloy, all has good wettability respectively, any the contain gallium of the above-mentioned specific embodiment one to the specific embodiment 18, the cadmium-free silver-base solder of indium and cerium, in soldering red copper-red copper, red copper-brass, brass-carbon steel, brass-stainless steel, carbon steel-stainless steel, carbon steel-nickel-base alloy, stainless steel-nickel-base alloy, red copper-nickel-base alloy, during different combined material (mother metal) such as brass-nickel-base alloy, combined material (mother metal) to institute's soldering all has good wetability, and soldered fitting has good comprehensive mechanical properties.
Claims (1)
1, a kind of cadmium-free silver-base solder that contains gallium, indium and cerium, it is characterized in that its chemical composition by the mass percent proportioning is: 26.0%～35.0% copper (Cu), 20.0%～33.0% zinc (Zn), 0.001%～0.5% gallium (Ga), 0.001%～0.3% indium (In), 0.002%～0.10% cerium (Ce), all the other are silver (Ag).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100977676A CN100420538C (en) | 2006-11-26 | 2006-11-26 | Cadmium-free silver based solder containing gallium, indium and cerium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100977676A CN100420538C (en) | 2006-11-26 | 2006-11-26 | Cadmium-free silver based solder containing gallium, indium and cerium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1962159A true CN1962159A (en) | 2007-05-16 |
| CN100420538C CN100420538C (en) | 2008-09-24 |
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ID=38081474
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|---|---|---|---|
| CNB2006100977676A Active CN100420538C (en) | 2006-11-26 | 2006-11-26 | Cadmium-free silver based solder containing gallium, indium and cerium |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| DE4323227C1 (en) * | 1993-07-12 | 1994-07-28 | Degussa | Cadmium-free silver alloy used as solder at temps. below 630 deg.C. |
| DE19940115A1 (en) * | 1999-08-24 | 2001-03-01 | Degussa | Cadmium-free brazing alloys |
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| CN100408255C (en) * | 2006-04-19 | 2008-08-06 | 南京航空航天大学 | Cadmium-free silver solder containing indium and cerium |
-
2006
- 2006-11-26 CN CNB2006100977676A patent/CN100420538C/en active Active
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| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN106392368A (en) * | 2016-11-28 | 2017-02-15 | 江苏阳明船舶装备制造技术有限公司 | High-temperature Zn-based soft solder for soldering aluminum and copper and welding method |
| CN106736022A (en) * | 2016-12-15 | 2017-05-31 | 金华市金钟焊接材料有限公司 | A kind of low cadmium brazing silver alloy of low melting point containing rare earth element |
| CN106736003A (en) * | 2016-12-15 | 2017-05-31 | 常熟市华银焊料有限公司 | The low cadmium brazing silver alloy of low melting point |
| CN106624427A (en) * | 2016-12-15 | 2017-05-10 | 金华市金钟焊接材料有限公司 | Low-melting-point and low-cadmium silver brazing filler metal with excellent wetting property |
| CN106736003B (en) * | 2016-12-15 | 2019-01-22 | 常熟市华银焊料有限公司 | The low cadmium brazing silver alloy of low melting point |
| CN106736022B (en) * | 2016-12-15 | 2019-12-13 | 金华市金钟焊接材料有限公司 | Low-melting-point low-cadmium silver solder containing rare earth elements |
| CN106624427B (en) * | 2016-12-15 | 2019-12-13 | 金华市金钟焊接材料有限公司 | Low-cadmium silver solder with low melting point and excellent wettability |
| CN107971652A (en) * | 2017-11-23 | 2018-05-01 | 贵研铂业股份有限公司 | A kind of electrovacuum solder and preparation method thereof |
| CN108161274A (en) * | 2017-11-24 | 2018-06-15 | 北京有色金属与稀土应用研究所 | It is a kind of for sealing-in solder of electron tube and preparation method thereof |
| CN110170766A (en) * | 2019-05-29 | 2019-08-27 | 新乡市七星钎焊科技有限公司 | 30 silver medal solders containing indium of one kind and its preparation process |
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