CN102240870A - Multielement rare-earth silver solder - Google Patents
Multielement rare-earth silver solder Download PDFInfo
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- CN102240870A CN102240870A CN2011101319646A CN201110131964A CN102240870A CN 102240870 A CN102240870 A CN 102240870A CN 2011101319646 A CN2011101319646 A CN 2011101319646A CN 201110131964 A CN201110131964 A CN 201110131964A CN 102240870 A CN102240870 A CN 102240870A
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Abstract
The invention relates to a multielement rare-earth silver solder which contains elements, such as manganese, indium, tin and the like. The multielement rare-earth silver solder is suitable for soldering metallic materials, such as red copper, brass, carbon steel, hard alloy, stainless steel and the like. The multielement rare-earth silver solder consists of the following components in percentage by weight: 23-29 wt% of Ag, 32-42 wt% of Cu, 0.5-2 wt% of Sn, 0.5-2.0 wt% of In, 0.5-2.2 wt% of Mn, 0.01-0.1 wt% of mischmetal, 0.01-0.1 wt% of Si, 0.01-0.1 wt% of Ni, 0.01-0.1 wt% of Li, 0.01-0.1 wt% of Ga and the balance of Zn. The multielement rare-earth silver solder has the advantages of high cost performance, capability of replacing BAg50CuZnSnNi and BAg50CuZnCd, exclusion of cadmium (Cd), lower melting temperature and good soldering property.
Description
Technical field
The present invention relates to a kind of multicomponent rare earth silver solder that contains elements such as manganese, indium, tin, be specially adapted to the soldering of red copper, brass, carbon steel, carbide alloy and stainless steel and other metal materials, can be widely used in freezing, in the soldering of industry such as machinery, electromechanics, belong to a kind of middle temperature brazing material.
Background technology
At the soldering between different metal material such as copper and the ferroalloy, consider solder to the wetability of soldering mother metal and the relevant mechanical property of soldered fitting, people mostly select for use silver content greater than 40% high silver solder.Common BAg50CuZnSnNi, BAg50CuZnCd can be used for brazed copper and copper alloy, stainless steel, carbon steel, carbide alloy.But along with rising steadily of non-ferrous raw material price, the particularly rise of noble metal silver price, cause and use high silver solder to come the producer of soldering to face huge cost pressure, under intense market competition, weakened use BAg50CuZnSnNi greatly, silver solder Enterprises'Competitiveness such as BAg50CuZnCd.
The patent No. is that 200610041024.7 Chinese patent has just been announced following silver solder, advantage be have that the good wetability to mother metal, spreadability, brazed seam mechanical property fusing point good, the principal component alloy are low, plasticity and comprehensive mechanical property ideal; No longer contain cadmium element in the composition, can guarantee operator's safety and avoid influence environment.Its topmost problem is exactly the cost height.
Some enterprises reduce silver content by the content that increases Cd, the adding of Cd, reduced the fusion temperature of solder significantly, promoted brazing property, but Cd itself is poisonous element, be unfavorable for the healthy of operator and there is pollution in environment, do not meet the RoHS of European Union instruction, along with people will inevitably be replaced by other harmless elements the attention further of environmental protection.
However, discover that the adding of single-element is not enough to and contains cadmium brazing silver alloy and compare according to existing, adding as Sn in the Ag-Cu-Zn-Sn solder can effectively improve flowability, wetability, reduce solid, liquid phase line temperature, reduce melting region, but its machinability is often relatively poor; The adding of In can reduce solid, liquid phase line temperature more significantly in the Ag-Cu-Zn-In solder, reduces melting region, improves mobilely, but itself solid solubility in silver, copper is less and price is higher, only can be used as trace element and adds; The interpolation of Ni can improve the wetability and the strength of joint of solder in the Ag-Cu-Zn-Ni solder, to purification crystal boundary, raising plasticity, the effect preferably of having gained in strength, and can improve processing characteristics, is easy to be processed into band, but can improves the liquidus temperature of solder; The adding of Ga can make the homogenization of composition of solder in the Ag-Cu-Zn-Ga solder, and refinement solder tissue suppresses the growth of intermetallic compound, the solder microscopic structure densification after the gas brazing, evenly, the mechanical property excellence, but its cost often is higher than and contains cadmium brazing silver alloy.
Chinese patent application number is that 201010132507.4 patent application has been announced a kind of rare earth silver solder, and the cost performance of this invention compares higher, and the solder fusion temperature is lower, wetability and good fluidity, and soldered fitting mechanical strength height, the soldering processes performance is good.But his performance can only replace the silver solder of 45B, can not replace silver solders such as BAg50CuZnSnNi, BAg50CuZnCd, still can not reach requirement on performance, and the consumption of silver is also still on the high side, the cost height.
Therefore; research and develop out a kind of RoHS of European Union command request that both met; in brazing material, do not contain harmful chemical element Cd; has good soldering processes performance again; fusion temperature is lower; the higher novel silver solder of cost performance substitutes silver solders such as BAg50CuZnSnNi, BAg50CuZnCd, has the positive effect of important economic value and reality protection environment.
Summary of the invention
It is reasonable in design that technical problem to be solved by this invention provides a kind of prescription, the cost performance height, can replace BAg50CuZnSnNi, BAg50CuZnCd, do not contain cadmium element, the solder fusion temperature is lower, wetability and good fluidity, soldered fitting mechanical strength height, the multicomponent rare earth silver solder that the soldering processes performance is good.
It is this multicomponent rare earth silver solder that the present invention solves the problems of the technologies described above the technical scheme that is adopted, its composition is: be made up of Ag, Cu, Sn, In, Mn, Si, Ni, Li, Ga, mishmetal and Zn, the percentage by weight of described each component is respectively: the Ag of 23-29wt%, the Cu of 32-42wt%, the Sn of 0.5-2wt%, the In of 0.5-2.0wt%, the Mn of 0.5-2.2wt%, the mishmetal of 0.01-0.1wt%, content among Si, Ni, Li and the Ga is all at 0.01-0.1 wt%, surplus is Zn, and described mishmetal is made up of lanthanum and cerium.Under the consumption situation still less of Ag, can realize more performance, can realize substituting silver solders such as BAg50CuZnSnNi, BAg50CuZnCd; Cost performance is higher, and prescription is formed more rationally, progress; Do not contain poisonous elements such as cadmium element.
As preferably, mishmetal of the present invention is made up of lanthanum and/or cerium.Lanthanum and cerium can be that arbitrary proportion mixes and the mishmetal formed, because the Rare-Earth Ce of the rare earth La of simple substance and simple substance is the same to the effect that solder of the present invention played separately, so La and Ce can adopt arbitrary proportion to mix, the effect of the rare earth La of both mixed effects and simple substance or the Rare-Earth Ce of simple substance all is the same, because the price of the mishmetal of La and Ce is cheaply more a lot of than the Rare-Earth Ce of the rare earth La of simple substance and simple substance, so preferentially select the mishmetal of La and Ce on the cost performance for use, thereby can reduce production costs greatly, improve the utilization rate of resource.But the tissue of the interpolation refinement brazing filler metal alloy of mishmetal La and Ce improves the mechanical property of solder, improves the intensity and the toughness of soldered fitting.
As preferably, the percentage by weight of each component of the present invention is respectively: the Ag of 25-27wt%, the Cu of 36-38wt%, the Sn of 0.9-1.5wt%, the In of 1.0-1.8wt%, the Mn of 1.5-2.2wt%, the mishmetal of 0.03-0.08wt%, content among Si, Ni, Li and the Ga is all at 0.03-0.08 wt%, and surplus is Zn.The solder in this proportioning interval, cost is low, cost performance is high, and very high industrial applicibility is arranged.
As preferably, the percentage by weight of each component of the present invention is respectively: the Ag of 25.5 %, 36.9% Cu, 1.2% Sn, 1.4% In, 2% Mn, 0.03% Li, 0.05% Si, 0.06% Ni, 0.03% Ga, 0.05% mishmetal, surplus is Zn.
The present invention compares with existing technology, have the following advantages and characteristics: the noble metal silver that 1, contains is less, reduce silver content about 24% than silver solders such as BAg50CuZnSnNi, greatly reduce production cost, saved the consumption of noble metal silver, compare Chinese patent application and number be 201010132507.4 patent application, the content of silver also still less, whole proportioning is also more reasonable; Has good mechanical performance when 2, soldering red copper, brass, carbon steel, carbide alloy and stainless steel, be that other cadmium-free silver brazing alloy is incomparable, feedback soldering processes performance is good after the client uses, steady quality, process performance index is suitable with the BAg50CuZnSnNi silver solder, compare Chinese patent application and number be 201010132507.4 patent application, performance is greatly improved; 3, the plasticity of this solder is good, can be processed into welding rod, welding wire, weld-ring, strip, weld tabs of all size, size etc.; 4, the tensile strength of solder can reach 580 ~ 635MPa; Its tensile strength of brazed copper joint is 250 ~ 275MPa, and shearing strength is 176 ~ 205MPa; Its joint tensile strength of workpiece such as soldering carbide alloy can reach 365 ~ 425MPa, and shearing strength is 290 ~ 315MPa; 5, can be widely used in freezing, resistance brazing, gas brazing and the high-frequency induction brazing of industry such as machinery, electromechanics, electrical equipment, compressor.
Add the fusion temperature that chemical element Sn is used to reduce solder among the present invention, improve the wetability and the flowability of brazing filler metal alloy, but the content of Sn can not be too high, surpasses 2.5% and form Ag3Sn, Cu41Sn11 frangible compounds easily, and solder plasticity and soldered fitting intensity are descended.The solid solubility of chemical element Mn in Ag, Cu is bigger, adds the elevated temperature strength that Mn can improve solder among the present invention, can reduce simultaneously brazing filler metal alloy the solid-liquid phase line temperature, improve wettability, have the function of secondary deoxidation during soldering.The interpolation of a small amount of Si, can effectively suppress the volatilization of Zn steam, when melting, reduce the loss of Zn, improve the qualification rate of product, but the tissue of refinement solder alloy on the other hand, and when follow-up each operation heating anneal carries out dynamic recrystallization, can stop growing up of crystal grain, improve the plasticity of solder, restrain the generation of fragility phase, improve the processing characteristics of solder, thereby can make solder carry out deep processing.
Interpolation chemical element Li plays the effect from brazing flux among the present invention; and Li can not form frangible compounds mutually with silver again; because Li is very active chemical element; it is a kind of surfactant; the oxide Li2O of Li can form low-melting complex chemical compound with many metal oxides during soldering; thereby reduce brazing temperature greatly; and lithia is very big to the affinity of water; it is with the water effect in the surrounding environment; the formation fusing point is 450 ℃ LiOH, and the LiOH of this layer fusing almost can dissolve all oxides, and it is the film shape and covers on the metal surface; play a protective role, and then improve the wetability of solder.Add chemical element Ni among the present invention, can improve the wettability of solder significantly to stainless steel and carbide alloy, and improve brazed seam plasticity, and improve the bonding strength of soldered fitting by the approach that increases spreading area, can also improve the resistance to corrosion of soldered fitting simultaneously.Add chemical element In among the present invention, can reduce the fusion temperature of solder and wetability and the joint filling that improves solder.The adding of a small amount of Ga can reduce the fusing point of solder of the present invention, can improve the wetability of the present invention on red copper, brass, carbon steel, stainless steel and nickel alloy.
Add mixed with little amount rare earth La and Ce among the present invention and reduce objectionable impurities elements Pb in the silver solder, Bi is to the harmful effect of solder, La and Ce energy and Pb, Bi forms LaPb, CePb, LaBi, the CeBi compound, suppress Pb simple substance phase and the formation mutually of Bi simple substance, that eliminates low melting point simple substance phase liquates out phenomenon earlier, thereby dispeled impurity Pb, Bi sprawls silver solder, the illeffects of wettability, in addition, but the tissue of the interpolation refinement brazing filler metal alloy of mishmetal La and Ce, improve the mechanical property of solder, improve the intensity and the toughness of soldered fitting, La in the mishmetal of the present invention and Ce can mix by arbitrary proportion, thereby can reduce production cost of the present invention greatly, improve the utilization rate of resource.
The specific embodiment
The present invention is described in further detail below in conjunction with embodiment, and following examples are explanation of the invention and the present invention is not limited to following examples.
Embodiment 1:
Concrete parameter among each embodiment is referring to table 1-table 4, table 1 is embodiment of the invention 1-embodiment 6 data table related, table 2 is embodiment of the invention 7-embodiment 12 data table related, table 3 is embodiment of the invention 13-embodiment 18 data table related, table 4 is embodiment of the invention 19-embodiment 24 data table related, and each shows specific as follows.
Table 1 embodiment 1-embodiment 6 data table related
Table 2 embodiment 7-embodiment 12 data table related
Table 3 embodiment 13-embodiment 18 data table related
Table 4 embodiment 19-embodiment 24 data table related
Prescription of the present invention is reasonable in design, production cost is low, and the cost performance height is during metal materials such as soldering copper and copper alloy, carbide alloy, carbon steel, stainless steel and nickel-base alloy, the solder fusion temperature is suitable, wetability, good fluidity, soldered fitting any surface finish, mechanical strength height, the soldering processes performance is good, steady quality, high conformity, every brazing property index is suitable with BAg50CuZnSnNi, BAg50CuZnCd.
Silver solder among the present invention contains Ag usually between 23-29%, contain Cu between 32-42%, contain Sn between 0.5-2.0%, contain In between 0.5-2.0%, contain Mn between 0.5-2.2%, contain content among Li, Si, Ni and the Ga all between 0.01-0.1%, contain and mix rare earth between 0.01-0.1%, surplus is Zn; The Ag of the preferred 25-27% of silver solder of the present invention, the Cu of 36-38%, the Sn of 0.9-1.5%, the In of 1.0-1.8%, the Mn of 1.5-2.2% contains content among Li, Si, Ni and the Ga all between 0.03-0.08%, the mishmetal of 0.03-0.08%, surplus is Zn; Best composition is the Ag of 25.5 %, 36.9% Cu, and 1.2% Sn, 1.4% In, 2% Mn, 0.03% Li, 0.05% Si, 0.06% Ni, 0.03% Ga, 0.05% mishmetal, surplus is Zn.
Need to prove that percentage composition used among the present invention all is weight percentage, this is common practise to one skilled in the art.Mishmetal among the present invention is made up of lanthanum and cerium, lanthanum and cerium can be that arbitrary proportion mixes and the mishmetal formed, because the Rare-Earth Ce of the rare earth La of simple substance and simple substance is the same to the effect that solder of the present invention played separately, so La and Ce can adopt arbitrary proportion to mix, the effect of the rare earth La of both mixed effects and simple substance or the Rare-Earth Ce of simple substance all is the same, because the price of the mishmetal of La and Ce is cheaply more a lot of than the Rare-Earth Ce of the rare earth La of simple substance and simple substance, so preferentially select the mishmetal of La and Ce on the cost performance for use, thereby can reduce production costs greatly, improve the utilization rate of resource.But the tissue of the interpolation refinement brazing filler metal alloy of mishmetal La and Ce improves the mechanical property of solder, improves the intensity and the toughness of soldered fitting.
Allly conceive equivalence or the simple change that described structure, feature and principle are done, be included in the protection domain of patent of the present invention according to patent of the present invention.The technical staff of the technical field of the invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment; only otherwise depart from structure of the present invention or surmount the defined scope of these claims, all should belong to protection scope of the present invention.
Though the present invention with embodiment openly as above; but it is not in order to limit protection scope of the present invention; any technical staff who is familiar with this technology, change and the retouching done in not breaking away from design of the present invention and scope all should belong to protection scope of the present invention.
Claims (4)
1. multicomponent rare earth silver solder, it is characterized in that: form by Ag, Cu, Sn, In, Mn, Si, Ni, Li, Ga, mishmetal and Zn, the percentage by weight of described each component is respectively: the Ag of 23-29wt%, the Cu of 32-42wt%, the Sn of 0.5-2wt%, the In of 0.5-2.0wt%, the Mn of 0.5-2.2wt%, the mishmetal of 0.01-0.1wt%, the content among Si, Ni, Li and the Ga are all at 0.01-0.1 wt%, and surplus is Zn.
2. multicomponent rare earth silver solder according to claim 1, it is characterized in that: described mishmetal is made up of lanthanum and/or cerium.
3. multicomponent rare earth silver solder according to claim 1 and 2, it is characterized in that: the percentage by weight of described each component is respectively: the Ag of 25-27wt%, the Cu of 36-38wt%, the Sn of 0.9-1.5wt%, the In of 1.0-1.8wt%, the Mn of 1.5-2.2wt%, the mishmetal of 0.03-0.08wt%, content among Si, Ni, Li and the Ga is all at 0.03-0.08 wt%, and surplus is Zn.
4. multicomponent rare earth silver solder according to claim 1 and 2, it is characterized in that: the percentage by weight of described each component is respectively: the Ag of 25.5 %, 36.9% Cu, 1.2% Sn, 1.4% In, 2% Mn, 0.03% Li, 0.05% Si, 0.06% Ni, 0.03% Ga, 0.05% mishmetal, surplus is Zn.
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| CN2011101319646A CN102240870A (en) | 2011-05-20 | 2011-05-20 | Multielement rare-earth silver solder |
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| CN102554504A (en) * | 2011-12-28 | 2012-07-11 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
| CN102773628A (en) * | 2012-06-26 | 2012-11-14 | 上海大学 | High-temperature resistant silver-copper-lithium-oxygen metal sealing material and application method thereof |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103192203A (en) * | 2013-01-10 | 2013-07-10 | 昆明贵千新型材料技术研究有限公司 | Process method for preparing silver solder |
| CN103252595A (en) * | 2013-05-28 | 2013-08-21 | 安徽众汇制冷有限公司 | Brazing filler metal for connecting copper and stainless steel, application of brazing filler metal and method for welding silencer |
| CN103909363A (en) * | 2014-04-01 | 2014-07-09 | 金华市三环焊接材料有限公司 | Cadmium-free low-silver solder containing tin, manganese and indium |
| US20140290931A1 (en) * | 2013-04-01 | 2014-10-02 | University Of Maryland, College Park | High Temperature Solder For Downhole Components |
| CN104321450A (en) * | 2012-05-23 | 2015-01-28 | 勒戈尔集团股份公司 | Alloy for braze welding |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN104439753A (en) * | 2014-11-13 | 2015-03-25 | 杭州华光焊接新材料股份有限公司 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
| CN104551434A (en) * | 2014-11-17 | 2015-04-29 | 浙江亚通焊材有限公司 | Cadmium-free silver-based medium-temperature solder and preparation method thereof |
| CN104907723A (en) * | 2015-05-25 | 2015-09-16 | 郑州机械研究所 | Flux-cored silver brazing filler metal with toughening alloy |
| CN105081608A (en) * | 2015-09-15 | 2015-11-25 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN106736016A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Cadmium-free low-silver medium-temperature solder for welding hard alloy and steel |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN108857138A (en) * | 2018-07-17 | 2018-11-23 | 浙江亚通焊材有限公司 | A kind of dissimilar metal connection low silver-colored cadmium-free silver-base solder and preparation method thereof |
| US10180035B2 (en) | 2013-04-01 | 2019-01-15 | Schlumberger Technology Corporation | Soldered components for downhole use |
| CN111889917A (en) * | 2020-07-17 | 2020-11-06 | 昆明贵研新材料科技有限公司 | Composite brazing filler metal for brazing hard alloy cutter and preparation method thereof |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
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| CN102554504B (en) * | 2011-12-28 | 2013-11-06 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
| CN102554504A (en) * | 2011-12-28 | 2012-07-11 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
| CN104321450A (en) * | 2012-05-23 | 2015-01-28 | 勒戈尔集团股份公司 | Alloy for braze welding |
| CN102773628A (en) * | 2012-06-26 | 2012-11-14 | 上海大学 | High-temperature resistant silver-copper-lithium-oxygen metal sealing material and application method thereof |
| CN103111770A (en) * | 2012-12-19 | 2013-05-22 | 杭州华光焊接新材料股份有限公司 | Polybasic silver solder |
| CN103111770B (en) * | 2012-12-19 | 2015-11-04 | 杭州华光焊接新材料股份有限公司 | A kind of Polybasic silver solder |
| CN103056551A (en) * | 2013-01-04 | 2013-04-24 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN103056551B (en) * | 2013-01-04 | 2015-04-29 | 西安交通大学 | Novel tin-and-indium-containing multi-component cadmium-and-silver-free brazing filler metal |
| CN103192203A (en) * | 2013-01-10 | 2013-07-10 | 昆明贵千新型材料技术研究有限公司 | Process method for preparing silver solder |
| CN103192203B (en) * | 2013-01-10 | 2015-06-17 | 昆明贵千新型材料技术研究有限公司 | Process method for preparing silver solder |
| CN104411450A (en) * | 2013-01-18 | 2015-03-11 | 优美科股份公司及两合公司 | Alloys |
| CN104411450B (en) * | 2013-01-18 | 2018-06-15 | 优美科股份公司及两合公司 | Alloy |
| US20140290931A1 (en) * | 2013-04-01 | 2014-10-02 | University Of Maryland, College Park | High Temperature Solder For Downhole Components |
| US10180035B2 (en) | 2013-04-01 | 2019-01-15 | Schlumberger Technology Corporation | Soldered components for downhole use |
| CN103252595A (en) * | 2013-05-28 | 2013-08-21 | 安徽众汇制冷有限公司 | Brazing filler metal for connecting copper and stainless steel, application of brazing filler metal and method for welding silencer |
| CN103909363A (en) * | 2014-04-01 | 2014-07-09 | 金华市三环焊接材料有限公司 | Cadmium-free low-silver solder containing tin, manganese and indium |
| CN104439753A (en) * | 2014-11-13 | 2015-03-25 | 杭州华光焊接新材料股份有限公司 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
| CN104551434A (en) * | 2014-11-17 | 2015-04-29 | 浙江亚通焊材有限公司 | Cadmium-free silver-based medium-temperature solder and preparation method thereof |
| CN104907723B (en) * | 2015-05-25 | 2017-08-25 | 郑州机械研究所 | Carry the medicine core silver solder of increasing tougheness alloy |
| CN104907723A (en) * | 2015-05-25 | 2015-09-16 | 郑州机械研究所 | Flux-cored silver brazing filler metal with toughening alloy |
| CN105081608B (en) * | 2015-09-15 | 2017-05-03 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN105081608A (en) * | 2015-09-15 | 2015-11-25 | 江苏师范大学 | Self-fluxing silver solder containing Eu, Li, Al and nano-Mo |
| CN106001991A (en) * | 2016-06-30 | 2016-10-12 | 杭州华光焊接新材料股份有限公司 | Indium containing low-silver multi-element brazing filler metal and preparation method thereof |
| CN107662063A (en) * | 2016-07-29 | 2018-02-06 | 金华市三环焊接材料有限公司 | A kind of formula of high-strength environment-friendly section silver solder |
| CN106736016A (en) * | 2016-11-30 | 2017-05-31 | 安徽华众焊业有限公司 | Cadmium-free low-silver medium-temperature solder for welding hard alloy and steel |
| CN106825987A (en) * | 2016-12-29 | 2017-06-13 | 安徽华众焊业有限公司 | A kind of silver-based brazing alloy and preparation method thereof |
| CN108857138A (en) * | 2018-07-17 | 2018-11-23 | 浙江亚通焊材有限公司 | A kind of dissimilar metal connection low silver-colored cadmium-free silver-base solder and preparation method thereof |
| CN111889917A (en) * | 2020-07-17 | 2020-11-06 | 昆明贵研新材料科技有限公司 | Composite brazing filler metal for brazing hard alloy cutter and preparation method thereof |
| CN111889917B (en) * | 2020-07-17 | 2021-10-22 | 昆明贵研新材料科技有限公司 | Composite brazing filler metal for brazing hard alloy cutter and preparation method thereof |
| CN114161026A (en) * | 2021-12-29 | 2022-03-11 | 杭州华光焊接新材料股份有限公司 | Silver-saving brazing filler metal special for hard alloy brazing and preparation method thereof |
| CN114378481A (en) * | 2022-02-11 | 2022-04-22 | 江苏省徐州技师学院 | Nickel-based brazing material and preparation method thereof |
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Application publication date: 20111116 |