CN102962600A - Multi-element alloy lead-free soldering flux - Google Patents

Multi-element alloy lead-free soldering flux Download PDF

Info

Publication number
CN102962600A
CN102962600A CN2012105443651A CN201210544365A CN102962600A CN 102962600 A CN102962600 A CN 102962600A CN 2012105443651 A CN2012105443651 A CN 2012105443651A CN 201210544365 A CN201210544365 A CN 201210544365A CN 102962600 A CN102962600 A CN 102962600A
Authority
CN
China
Prior art keywords
tin
lead
silver
indium
gallium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012105443651A
Other languages
Chinese (zh)
Inventor
吴坚
祝文琦
王俊杰
韦习成
吴念祖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Huaqing Welding Material Technology Co Ltd
Original Assignee
Shanghai Huaqing Welding Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Huaqing Welding Material Technology Co Ltd filed Critical Shanghai Huaqing Welding Material Technology Co Ltd
Priority to CN2012105443651A priority Critical patent/CN102962600A/en
Publication of CN102962600A publication Critical patent/CN102962600A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a multi-element alloy lead-free soldering flux, which comprises the following elements: 0-1 percent of silver, 0.3-0.9 percent of copper, 0.03-0.05 percent of nickel, 0.01-0.02 percent of erbium, 0.002-0.01 percent of phosphorus, 0.002-0.02 of germanium, 0.002-0.02 percent of indium, 0.0005-0.005 percent of gallium and tin in balancing amount. The multi-element alloy lead-free soldering flux has the benefits as follows: better oxidation resistance, wetting property and mechanical property are achieved; the improvement on the oxidation resistance, the wetting property and the flow property is facilitated by the use of phosphorus, germanium, indium and gallium; and the multi-element alloy lead-free soldering flux is completely suitable for wave soldering, has better wetting property, oxidation resistance and mechanical property, reduces tin oxide slag and is a novel environment-friendly energy-saving oxidation-resistant low-silver lead-free soldering flux.

Description

A kind of multicomponent alloy lead-free solder and preparation method thereof
Technical field
The invention belongs to electronic material lead-free solder preparation field, be applicable to electronic product printed board Electronic Assemblies wave soldering.
Background technology
Used in electronic industry tin-lead solder existing five more than ten years are historical, in order to reduce plumbous pollution on environment and on the impact of human health, countries in the world are developed various lead-free solders in succession, such as lead-free solders such as tin silver system, tin copper system, tin bismuth system, tin zinc systems.
The main flow alloy composition of first generation Sn-Ag-Cu lead-free scolder is tin 96.5%, silver 3%, copper 0.5%, its fusing point is the 217-219 degree, have preferably welding performance and mechanical property, but because the silver content higher price is expensive, and cause a large amount of consumption of silver-colored resource and the energy, countries in the world are developed the low silver-colored Sn-Ag-Cu lead-free scolder of the second generation in succession in recent years for this reason, its main flow alloying component is tin 99%, silver 0.3%, copper 0.7%, because its silver content is 1/10th of first generation Sn-Ag-Cu lead-free scolder, therefore have preferably cost performance, and be used widely.But its fusing point is the 217-227 degree, is higher than first generation Sn-Ag-Cu lead-free scolder.When wave-soldering, will produce more oxidation scruff, and affect welding quality, simultaneously because the minimizing of silver content might cause the decline of mechanical property.Therefore, develop a kind of environment-friendly energy-saving oxidation resistant lead-free solder and just become trend of the times.
In sum, there is different problems in above-mentioned two kinds of first generation with second generation Sn-Ag-Cu lead-free solder alloy: although such as first generation lead-free solder preferably welding performance is arranged, cost is high, and antioxygenic property is poor, although and second generation lead-free solder cost performance is high, antioxygenic property is poorer.Therefore develop the R﹠D direction that a kind of novel energy-saving environment-friendly oxidation resistant low-silver lead-free solder just becomes lead-free solder.
Summary of the invention
Be to solve the problem that exists in the aforementioned background art, high such as the unleaded SAC scolder of first generation cost, the problem such as antioxygenic property is poor, and second generation lead-free solder antioxygenic property and mechanical property are poorer.
The invention discloses a kind of multicomponent alloy lead-free solder with better antioxygenic property, wettability and mechanical property and preparation method thereof, and can be widely used in electronic product printed board Electronic Assemblies wave soldering.
A kind of multicomponent alloy lead-free solder provided by the invention is to be comprised of elements such as reaching tin, silver, copper, nickel, erbium, phosphorus, germanium, indium, gallium.The composition of this multicomponent alloy lead-free solder is silver-colored 0-1%, copper 0.3-0.9%, and nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin.All tin, silver, copper, nickel, erbium, phosphorus, germanium, indium, gallium element purity are all more than 99.95%.
Described element comprises: silver 0.3%, copper 0.6-0.8%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin, and described element purity is all more than 99.95%.
Described element comprises: silver-colored 0.9-1%, copper 0.6-0.8%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin, and all elements purity is all more than 99.95%.
The preparation method of described a kind of multicomponent alloy lead-free solder, it is melted up to 400 degree with tin, then add tin silver 20% intermediate alloy, tin copper 10% intermediate alloy, tin nickel 5% intermediate alloy, tin erbium 10% intermediate alloy, tin phosphorus 5% intermediate alloy, tin germanium 1% intermediate alloy, tin indium 1% intermediate alloy, tin gallium 1% intermediate alloy, after all melting, cool the temperature to about 330 degree, be cast into multicomponent alloy lead-free solder product.
The invention is characterized in, at second generation Sn-Ag-Cu lead-free scolder argentiferous 0-1%, copper 0.3-0.9%, surplus is to add nickel 0.03-0.05% on the basis of tin, its effect is that nickel can crystal grain thinning and form the gun-metal barrier layer, improves soldering reliability.
Another feature of the present invention is to add erbium 0.01-0.02% on above-mentioned multicomponent alloy basis, and its effect is that rare earth erbium has high activity, can play purification and crystal grain thinning, thereby improves the mechanical property of alloy.
Another feature of the present invention is to add phosphorus 0.002-0.01% on above-mentioned multicomponent alloy basis, its effect is that P elements and oxygen element form ultimate attainment close oxide layer, and the further oxidation of prevention Sn-Ag-Cu lead-free scolder, and play good antioxidation, but its less stable.
Another feature of the present invention is to add germanium 0.002-0.02% on above-mentioned multicomponent alloy basis, its effect is that Ge element and oxygen element form ultimate attainment close oxide layer, and the further oxidation of prevention Sn-Ag-Cu lead-free scolder, well play the antioxidation collaborative with P elements, and have splendid stability.
Another feature of the present invention is to add indium 0.002-0.02% on above-mentioned multicomponent alloy basis, its effect is the low melting point characteristic of utilizing indium, therefore be conducive to improve flowability and the solderability of Sn-Ag-Cu lead-free scolder, have at low temperatures the effect of non-oxidizability simultaneously.
Another feature of the present invention is to add gallium 0.0005-0.005% on above-mentioned multicomponent alloy basis, its effect is that gallium is a kind ofly very easily to form ultimate attainment close oxide layer with oxygen, can not only produce antioxidation at 300 degree, and still have splendid antioxygenic property at 400 degree.
The present invention also provides a kind of preparation method of multicomponent alloy lead-free solder, it is characterized in that comprising following preparation process:
1. pure tin is melted up to 400 degree, then add tin silver 20% intermediate alloy, tin copper 10% intermediate alloy, tin nickel 5% intermediate alloy, tin erbium 10% intermediate alloy, tin phosphorus 5% intermediate alloy, tin germanium 1% intermediate alloy, tin indium 1% intermediate alloy, tin gallium 1% intermediate alloy, after all melting, cool the temperature to 330 degree, be cast into multicomponent alloy lead-free solder product.
2. the preparation process of tin silver 20% intermediate alloy is that tin is heated to 1000 degree in intermediate frequency furnace, then adds in proportion silver, after all melting, is cast into 20% tin silver intermediate alloy.
3. the preparation process of tin copper 10% intermediate alloy is that tin is heated to 1000 degree in intermediate frequency furnace, then adds in proportion copper, after all melting, is cast into 10% tin copper intermediate alloy.
4. the preparation process of tin nickel 5% intermediate alloy is heated to 1400 degree with tin in intermediate frequency furnace, then adds in proportion nickel, after all melting, is cast into 5% tin nickel intermediate alloy.
5. the preparation process of the intermediate alloy of tin erbium 10% is that tin is heated to 1400 degree in intermediate frequency furnace, then adds in proportion erbium, after all melting, is cast into 10% tin nickel intermediate alloy.
The preparation process of tin phosphorus 5% intermediate alloy be the ratio of pure tin 95% and pure phosphorus 5% is mixed and thereon the covering protection fused salt put into seal box, then put into Muffle furnace and be heated to 600 degree, after all melting, be cooled to 5% tin phosphorus intermediate alloy.
7. the preparation process of tin germanium 1% intermediate alloy is that tin is heated to 1000 degree in intermediate frequency furnace, then adds in proportion germanium, after all melting, is cast into 1% tin germanium intermediate alloy.
8. the preparation process of tin indium 1% intermediate alloy is that tin is heated to 300 degree in resistance furnace, then adds in proportion indium, after all melting, is cast into 1% tin indium intermediate alloy.
9. the preparation process of tin gallium 1% intermediate alloy is that tin is heated to 300 degree in resistance furnace, then adds in proportion gallium, after all melting, is cast into 1% tin gallium intermediate alloy.
The invention has the beneficial effects as follows and invented a kind of multicomponent alloy lead-free solder, silver-colored 0-1% wherein, copper 0.3-0.9%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.02%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is that tin forms.Nickel, the erbium that the present invention uses is conducive to crystal grain thinning and improves mechanical property.Phosphorus, germanium, indium, gallium that the present invention uses are conducive to improve antioxygenic property, wettability, mobile performance.The prepared multicomponent alloy lead-free solder of the present invention is applicable to wave soldering fully, and have preferably wetability, non-oxidizability and mechanical property and reduce the oxidation scruff, be a kind of environment-friendly energy-saving oxidation resistant low-silver lead-free solder.
The specific embodiment:
Below the invention will be further described.
The present invention relates to a kind of multicomponent alloy lead-free solder and preparation method, be applicable to the welding of electronic product printed board Electronic Assemblies.
The prepared multicomponent alloy lead-free solder of the present invention has better non-oxidizability, wetability and mechanical property, is a kind of novel energy-saving environment-friendly low silver oxidation resistance lead-free solder that Wave crest Welding is used that is applicable to.
The multicomponent alloy lead-free solder system that the present invention relates to is comprised of elements such as tin, silver, copper, nickel, erbium, phosphorus, germanium, indium, galliums.This multicomponent alloy lead-free solder constituent is that silver-colored 0-1%, copper 0.3-0.9%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium are that 0.002-0.02%, indium are 0.002-0.02%, gallium 0.0005-0.005%, and surplus is tin.All tin, silver, copper, nickel, erbium, phosphorus, germanium, indium, gallium element purity are all more than 99.95%.
Multicomponent alloy lead-free solder its preparation method of the present invention is: tin heating and melting to 400 is spent, then adding makes its alloying component reach intermediate alloy Xi-Yin 20% of silver content 0-1%, adding after all melting makes its alloying component reach intermediate alloy tin-copper 10% of copper content 0.3-0.9% again, adding after all melting makes its alloying component reach the intermediate alloy tin-nickel 5% of nickel content 0.03-0.05% again, after all melting, add again the intermediate alloy tin-erbium 10% that its alloying component is reached contain erbium amount 0.01-0.02%, adding after all melting makes its alloying component reach intermediate alloy tin-phosphorus 5% of phosphorus content 0.002-0.02% again, adding after all melting makes its alloying component reach intermediate alloy tin-germanium 1% of germanic amount 0.002-0.02% again, after all melting, add again the intermediate alloy tin-indium 1% that its alloying component is reached contain indium amount 0.002-0.02%, after all melting, add again the intermediate alloy tin-gallium 1% that its alloying component is reached contain gallium amount 0.0005-0.005%, after the whole thawings of all intermediate alloys, cool the temperature to 330 degree, be cast into a kind of multicomponent alloy without the slicker solder material.
The present invention has been prepared into six kinds of lead-free solders (table 1) according to different proportion, and compares (table 2).
Table 1 multicomponent alloy lead-free solder composition:
Alloying component Example 1 Example 2 Example 3 Example 4 Ratio 1 Ratio 2
Ag 0.3 0.3 0.9 1.0 0.3 0.9
Cu 0.6 0.8 0.8 0.6 0.7 0.7
Ni 0.03 0.05 0.03 0.05 0 0
Er 0.01 0.02 0.01 0.02 0 0
p 0.002 0.01 0.002 0.01 0 0
Ge 0.002 0.020 0.002 0.020 0 0
In 0.002 0.020 0.002 0.020 0 0
Ga 0.0005 0.005 0.0005 0.005 0 0
Sn Surplus Surplus Surplus Surplus Surplus Surplus
Table 2 results of comparison table
Experimental result Example 1 Example 2 Example 3 Example 4 Comparative example 1 Comparative example 2
Fusing point 217-225 217-224 217-223 217-221 217-227 217-224
Grain size Less Less Less Less Larger Larger
Non-oxidizability Good Good Good Good Poor Poor
Solderability Good Good Good Good Poor Good
Annotate: 1, the less crystallite dimension that means of crystal grain means more greatly the crystal grain greater than 50 μ m at the crystal grain that is not more than 40 μ m; 2, good in oxidation resistance means nondiscolouring in 8 hours under 300 degree molten conditions, and the slag yield of oxidizing slag is less than 0.3%.3, solderability meant well in the wetting time of 260 degree under the molten conditions less than 1 second.
From upper table result as seen, the example 1 of scolder that the present invention chats and example 2 fusing points are a little less than comparing 1 and relatively 2.The grain size of example 1 and example 2, antioxygenic property and wettability all are better than comparison 1 and compare 2.
In sum, a kind of multicomponent alloy lead-free solder of the present invention, silver-colored 0-1% wherein, copper 0.3-0.9%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.02%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is that tin forms.Its fusing point of multicomponent alloy lead-free solder of the present invention is at the 217-225 degree.The present invention is owing to added rare earth erbium, nickel, phosphorus, germanium, indium, the contour low-temperature trace metallic element of gallium, and wherein nickel, erbium are conducive to the lead-free solder crystal grain thinning and improve mechanical property.Wherein phosphorus, germanium, indium, gallium are conducive to improve antioxygenic property, wettability, mobile performance.Therefore the prepared multicomponent alloy lead-free solder of the present invention has preferably wetability, non-oxidizability and mechanical property and reduces the oxidation scruff, is a kind of novel energy-saving environment-friendly oxidation resistant low-silver lead-free solder that is applicable to the lead-free solder wave-soldering fully.
Those of ordinary skill in the art will be appreciated that, above embodiment illustrates purpose of the present invention, and be not as limitation of the invention, as long as in essential scope of the present invention, all will drop in the scope of claim of the present invention variation, the modification of the above embodiment.

Claims (4)

1. multicomponent alloy lead-free solder, it is characterized in that: described lead-free solder comprises tin, silver, copper, nickel, erbium, phosphorus, germanium, indium, gallium, and wherein said content is silver-colored 0-1%, copper 0.3-0.9%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin, and described element purity is all more than 99.95%.
2. a kind of multicomponent alloy lead-free solder as claimed in claim 1, it is characterized in that: described element comprises: silver 0.3%, copper 0.6-0.8%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin, and described element purity is all more than 99.95%.
3. a kind of multicomponent alloy lead-free solder as claimed in claim 1, it is characterized in that: described element comprises: silver-colored 0.9-1%, copper 0.6-0.8%, nickel 0.03-0.05%, erbium 0.01-0.02%, phosphorus 0.002-0.01%, germanium 0.002-0.02%, indium 0.002-0.02%, gallium 0.0005-0.005%, surplus is tin, and all elements purity is all more than 99.95%.
4. such as the preparation method of the arbitrary described a kind of multicomponent alloy lead-free solder of claim 1-3, it is characterized in that: tin is melted up to 400 degree, then add tin silver 20% intermediate alloy, tin copper 10% intermediate alloy, tin nickel 5% intermediate alloy, tin erbium 10% intermediate alloy, tin phosphorus 5% intermediate alloy, tin germanium 1% intermediate alloy, tin indium 1% intermediate alloy, tin gallium 1% intermediate alloy, after all melting, cool the temperature to about 330 degree, be cast into multicomponent alloy lead-free solder product.
CN2012105443651A 2012-12-14 2012-12-14 Multi-element alloy lead-free soldering flux Pending CN102962600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012105443651A CN102962600A (en) 2012-12-14 2012-12-14 Multi-element alloy lead-free soldering flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012105443651A CN102962600A (en) 2012-12-14 2012-12-14 Multi-element alloy lead-free soldering flux

Publications (1)

Publication Number Publication Date
CN102962600A true CN102962600A (en) 2013-03-13

Family

ID=47793190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012105443651A Pending CN102962600A (en) 2012-12-14 2012-12-14 Multi-element alloy lead-free soldering flux

Country Status (1)

Country Link
CN (1) CN102962600A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103978319A (en) * 2014-05-14 2014-08-13 张海鹏 Lead-free solder used for manufacturing piezoresistor and preparation method of lead-free solder
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN109366037A (en) * 2018-11-05 2019-02-22 东莞市千岛金属锡品有限公司 Copper corrosion resistant high-temperature lead-free solder and preparation method thereof
CN110102931A (en) * 2019-05-29 2019-08-09 华南理工大学 A kind of improved microelectronics Packaging low silver Sn-Ag-Cu solder and preparation method thereof
CN112322929A (en) * 2020-10-28 2021-02-05 云南锡业集团(控股)有限责任公司研发中心 Intermediate alloy for improving oxidation resistance of solder
CN114855004A (en) * 2022-03-24 2022-08-05 北京理工大学 Preparation method of Sn binary alloy with high yield strength

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080159903A1 (en) * 2005-08-24 2008-07-03 Fry's Metals, Inc. Solder alloy
CN101716703A (en) * 2009-11-30 2010-06-02 南京达迈科技实业有限公司 Low-silver SnAgCuBi series lead-free solder alloy and preparation method thereof
CN101831574A (en) * 2010-05-26 2010-09-15 南京达迈科技实业有限公司 Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof
CN102500946A (en) * 2011-10-19 2012-06-20 上海大学 Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080159903A1 (en) * 2005-08-24 2008-07-03 Fry's Metals, Inc. Solder alloy
CN101716703A (en) * 2009-11-30 2010-06-02 南京达迈科技实业有限公司 Low-silver SnAgCuBi series lead-free solder alloy and preparation method thereof
CN101831574A (en) * 2010-05-26 2010-09-15 南京达迈科技实业有限公司 Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof
CN102500946A (en) * 2011-10-19 2012-06-20 上海大学 Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103978319A (en) * 2014-05-14 2014-08-13 张海鹏 Lead-free solder used for manufacturing piezoresistor and preparation method of lead-free solder
CN103978319B (en) * 2014-05-14 2016-06-22 张海鹏 A kind of lead-free solder for making piezoresistor
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN108555472B (en) * 2017-12-29 2020-12-01 西安泰力松新材料股份有限公司 Photovoltaic solder strip alloy solder and preparation method thereof
CN109366037A (en) * 2018-11-05 2019-02-22 东莞市千岛金属锡品有限公司 Copper corrosion resistant high-temperature lead-free solder and preparation method thereof
CN110102931A (en) * 2019-05-29 2019-08-09 华南理工大学 A kind of improved microelectronics Packaging low silver Sn-Ag-Cu solder and preparation method thereof
CN112322929A (en) * 2020-10-28 2021-02-05 云南锡业集团(控股)有限责任公司研发中心 Intermediate alloy for improving oxidation resistance of solder
CN114855004A (en) * 2022-03-24 2022-08-05 北京理工大学 Preparation method of Sn binary alloy with high yield strength

Similar Documents

Publication Publication Date Title
CN101417375B (en) Leadless welding alloy for welding electronic elements
CN102962600A (en) Multi-element alloy lead-free soldering flux
CN101780607B (en) Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof
CN105195915A (en) Low-temperature lead-free solder alloy
CN102240870A (en) Multielement rare-earth silver solder
CN102699563A (en) Low-silver lead-free soft solder
CN101348875A (en) Tin, bismuth and copper type low temperature lead-free solder alloy
CN100558499C (en) A kind of manufacture method of cadmium-free silver brazing alloy
CN1803381A (en) Leadless soldering material and its preparation method
CN101157162A (en) SnAgCu leadless brazing filler metal with antioxygenic performance
CN115041864A (en) High-reliability low-temperature lead-free solder and preparation method thereof
CN101569966A (en) Method for preparing lead-free tin cream and soldering flux thereof
CN101380701A (en) High-temperature leadless soft solder and preparation method thereof
CN103243234A (en) Serial low-silver and lead-free solder for electronic packaging soft soldering and preparation method thereof
CN101585119A (en) Oxidation resistant low silver lead-free solder alloy
CN103240541B (en) Tin zinc multi-element alloy solder for soldering copper and aluminum and preparation method thereof
CN101817126A (en) Tin-zinc lead-free solder and preparation method thereof
CN102152022A (en) Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance
CN1238153C (en) Antioxidation leadless welding material
CN102642097A (en) Low-silver lead-free solder alloy
CN103934590A (en) ZnAlMgIn high temperature lead-free solder
CN101690995A (en) Low-temperature lead-free solder
CN101050528A (en) Metal spraying material without lead
CN100496861C (en) A tin-zinc selenium alloy welding flux
CN102689105B (en) Indium-containing active copper-based solder

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130313