CN101831574A - Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof - Google Patents
Lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof Download PDFInfo
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Abstract
The invention provides a lead-free tin-solder alloy of low-silver SnAgCuSb and a preparation method thereof. The lead-free tin-solder alloy of low-silver SnAgCuSb comprises chemical components in percentage by weight: 0.1-1.0 percent of Ag, 0.3-3.0 percent of Cu, 0.1-1.0 percent of Sb, 0.008-0.03 percent of P, 0.006-0.08 percent of Ce and the balance of Sn. The lead-free tin-solder alloy of low-silver SnAgCuSb can effectively control the lead content to be in the range of less than 100ppm so as to be more environmentally-friendly. Compared with the traditional tin-lead solder, a melting point of the tin-solder is slightly higher, the wettability and the expansibility are slightly improved, and the comprehensive performances of tensile strength, creep resistance, fatigue resistance and the like of the melting point are better and slightly improved, the cost of the tin-solder alloy cost is lower and the cost performance of the product is also higher.
Description
Technical field
The invention relates to a kind of soldering alloy and preparation method thereof, and particularly relevant for a kind of lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof.
Background technology
At present, the technological challenge of global scolder industry faces sternness, the unleaded technology of electronic product is more and more ripe through this development in several years.Lead-free solder advanced person's of future generation SAC alloy technology promptly is to add other alloying elements on the basis of tin, silver, copper; Hang down silver or do not have silver alloy solder; The research and development task of new technologies such as hybrid alloys is extremely urgent.Research and development at present, the application low-silver lead-free scolding tin performance issue relevant with technology: fusing point is low, and is suitable with the Sn63Pb37 wiping solder; Wettability is good, and extendability is suitable with the Sn63Pb37 wiping solder; Cost is low as far as possible, nontoxicity etc.The performance issue relevant with reliability: conduction, thermal conductivity is suitable with the Sn63Pb37 wiping solder; Tensile strength, shearing resistance, creep resistance, anti-fatigue performance are good, and is suitable with the Sn63Pb37 wiping solder; Welding material will adapt with a series of relevant factors such as components and parts, PCB, equipment, soldering flux and processing condition as far as possible.
Summary of the invention
The object of the present invention is to provide a kind of lead-free tin solder alloy of low-silver SnAgCuSb and preparation method thereof, the wettability of lead-free tin solder alloy of low-silver SnAgCuSb is higher, extendability is better, and over-all propertieies such as the tensile strength of solder joint, creep resistance, antifatigue are better, and cost is lower.
For reaching above-mentioned purpose, the invention provides a kind of lead-free tin solder alloy of low-silver SnAgCuSb, its Chemical Composition is counted by weight percentage and is the Ce of P, the 0.006-0.08% of Sb, the 0.008-0.03% of the Ag of 0.1-1.0%, the Cu of 0.3-3.0%, 0.1-1.0%, the Sn of surplus.
Preferably, the Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is the Sn of 0.1% Ag, 3.0% Cu, 1.0% Sb, 0.008% P, 0.006% Ce surplus.
The Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is 0.6% Ag, 1.6% Cu, 0.6% Sb, 0.019% P, 0.01% Ce, the Sn of surplus.
The Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is 0.5% Ag, 1.6% Cu, 0.1% Sb, 0.01% P, 0.019% Ce, the Sn of surplus.
The Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is 0.5% Ag, 2.6% Cu, 0.6% Sb, 0.03% P, 0.027% Ce, the Sn of surplus.
The Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is 1.0% Ag, 1.6% Cu, 0.6% Sb, 0.018% P, 0.03% Ce, the Sn of surplus.
The Chemical Composition of lead-free tin solder alloy of low-silver SnAgCuSb is counted by weight percentage and is 0.5% Ag, 3.0% Cu, 1.0% Sb, 0.01% P, 0.019% Ce, the Sn of surplus.
The preparation method of lead-free tin solder alloy of low-silver SnAgCuSb of the present invention comprises the following steps:
(1) makes master alloy
Frequently carry out melting in the induction melting furnace in a vacuum; the fusing of employing plumbago crucible; starting material charge calculation in proportion are good; put into plumbago crucible; P, Ce low melting point and active element add in the secondary hopper; because it is relatively more active; easily oxidization burning loss influences its recovery rate, thus P, in adding the molten bath before; must pour a certain amount of rare gas element Ar in vacuum chamber protects; close stove evacuation, treat metallic substance all after the fusing, P at＜400 ℃, Ce under＜950 ℃ condition; carry out alloying, be cast into corresponding master alloy after scolding tin solution is even.
A, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the Sn-Ag master alloy, be warming up to 1080 ℃, treat that fusing of sn-ag alloy liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the sn-ag alloy ingot after the air cooling demoulding of coming out of the stove.
B, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Cu master alloy, be warming up to 1130 ℃, treat that fusing of gun-metal liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the gun-metal ingot after the air cooling demoulding of coming out of the stove.
C, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the Sn-Sb master alloy, be warming up to 720 ℃, treat that fusing of tin pewter liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the tin pewter ingot after the air cooling demoulding of coming out of the stove.
D, in a vacuum frequently in the induction melting furnace weight percent with 98: 2 prepare the Sn-P master alloy, in crucible, form the molten bath, in stove, charge into rare gas element (Ar), be warming up to 350 ℃, add phosphorus from hopper in the molten bath, tin phosphorus alloy liquid alloying, magnetic agitation are extremely even about 5 minutes, leave standstill ingot casting after 10 minutes, become tin phosphorus alloy ingot after the air cooling demoulding of coming out of the stove.
E, in a vacuum frequently in the induction melting furnace weight percent with 97.5: 2.5 prepare the Sn-Ce master alloy, in crucible, form the molten bath, in stove, charge into rare gas element (Ar), be warming up to 900 ℃, add cerium from hopper in the molten bath, tin-cerium alloy liquid alloying, magnetic agitation are extremely even about 5 minutes, leave standstill ingot casting after 10 minutes, become the tin-cerium alloy ingot after the air cooling demoulding of coming out of the stove.
(2) SnAg, SnCu, SnSb, SnP, SnCe master alloy are added insufficient tin amount carries out weight proportion according to the Pb-free solder alloy ratio.After the pure tin fusing, be warming up to 350-400 ℃, drop into SnAg, SnCu, SnSb master alloy earlier, stirred 15 minutes the fusing back, after temperature is reduced to below 350 ℃, add SnP, SnCe master alloy again, remove slag after the homogenizing, cast required tin bar (or tin slab) behind the decon.
SnAgCuSb of the present invention is the low-silver lead-free soldering alloy, lead content can effectively be controlled at＜scope of 100ppm in, environmental protection more, Ben Xi material fusing point is slightly than traditional wiping solder height, wettability and extendability are compared with traditional wiping solder slightly and are improved, and over-all propertieies such as the tensile strength of solder joint, creep resistance, antifatigue are better, compare with traditional wiping solder slightly and improve, this soldering alloy cost is lower, and cost performance of product is also higher.
Description of drawings
Fig. 1 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 1;
Fig. 2 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 2;
Fig. 3 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 3;
Fig. 4 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 4;
Fig. 5 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 5;
Fig. 6 carries out differential scanning calorimetric (DSC) curve that heat analysis obtains for adopting differential scanning calorimeter to the embodiment of the invention 6.
Embodiment
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
The Chemical Composition of embodiment 1 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: the Sn of 0.1% Ag, 3.0% Cu, 1.0% Sb, 0.008% P, 0.006% Ce surplus.
The preparation method of this lead-free tin solder alloy of low-silver SnAgCuSb is as follows:
(1) makes master alloy: carry out melting in the induction melting furnace frequently in a vacuum; the fusing of employing plumbago crucible; starting material charge calculation according to the above ratio are good; put into plumbago crucible; P; Ce low melting point and active element add in the secondary hopper (because relatively more active; easy oxidization burning loss; influence its recovery rate; so P; Ce in adding the molten bath before, must in vacuum chamber, pour a certain amount of rare gas element Ar and protect), close stove evacuation; after treating that metallic substance all melts; in the proper temperature insulation, carry out alloying, be cast into corresponding master alloy after scolding tin solution is even.
A, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the Sn-Ag master alloy, be warming up to 1080 ℃, treat that fusing of sn-ag alloy liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnAg alloy pig after the air cooling demoulding of coming out of the stove.
B, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the Sn-Cu master alloy, be warming up to 1130 ℃, treat that fusing of gun-metal liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnCu alloy pig after the air cooling demoulding of coming out of the stove.
C, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the Sn-Sb master alloy, be warming up to 720 ℃, treat that fusing of tin pewter liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnSb alloy pig after the air cooling demoulding of coming out of the stove.
D, in a vacuum frequently in the induction melting furnace weight percent with 98: 2 prepare the Sn-P master alloy, in crucible, form the molten bath, in stove, charge into rare gas element (Ar), be warming up to 350 ℃, add phosphorus from hopper in the molten bath, tin phosphorus alloy liquid alloying, magnetic agitation are extremely even about 5 minutes, leave standstill ingot casting after 10 minutes, become the SnP alloy pig after the air cooling demoulding of coming out of the stove.
E, in a vacuum frequently in the induction melting furnace weight percent with 97.5: 2.5 prepare the Sn-Ce master alloy, in crucible, form the molten bath, in stove, charge into rare gas element (Ar), be warming up to 900 ℃, add cerium from hopper in the molten bath, tin-cerium alloy liquid alloying, magnetic agitation are extremely even about 5 minutes, leave standstill ingot casting after 10 minutes, become the SnCe alloy pig after the air cooling demoulding of coming out of the stove.
(2) SnAg, SnCu, SnSb, SnP, SnCe master alloy are added insufficient tin amount carries out weight proportion according to the Pb-free solder alloy ratio.After the pure tin fusing, be warming up to 350-400 ℃, drop into SnAg, SnCu, SnSb master alloy earlier, stirred 15 minutes the fusing back, after temperature is reduced to below 350 ℃, add SnP, SnCe master alloy again, remove slag after the homogenizing, cast required tin bar (or tin slab) behind the decon.
Adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 1, its every Performance Detection data see Table 2～table 3.
The Chemical Composition of embodiment 2 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: 0.6% Ag, 1.6% Cu, 0.6% Sb, 0.019% P, 0.01% Ce, the Sn of surplus, its preparation method is with embodiment 1, adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 2, its every Performance Detection data see Table 2～table 3.
The Chemical Composition of embodiment 3 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: 0.5% Ag, 1.6% Cu, 0.1% Sb, 0.01% P, 0.019% Ce, the Sn of surplus, its preparation method is with embodiment 1, adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 3, its every Performance Detection data see Table 2～table 3.
The Chemical Composition of embodiment 4 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: 0.5% Ag, 2.6% Cu, 0.6% Sb, 0.03% P, 0.027% Ce, the Sn of surplus, its preparation method is with embodiment 1, adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 4, its every Performance Detection data see Table 2～table 3.
The Chemical Composition of embodiment 5 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: 1.0% Ag, 1.6% Cu, 0.6% Sb, 0.018% P, 0.03% Ce, the Sn of surplus, its preparation method is with embodiment 1, adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 5, its every Performance Detection data see Table 2～table 3.
The Chemical Composition of embodiment 6 lead-free tin solder alloy of low-silver SnAgCuSb (wt%) by weight percentage is calculated as: 0.5% Ag, 3.0% Cu, 1.0% Sb, 0.01% P, 0.019% Ce, the Sn of surplus, its preparation method is with embodiment 1, adopt thermal-analysis instrumentation that differential scanning calorimetric (DSC) curve in the temperature-rise period of this no lead-tin soldering alloy measuring is seen Fig. 6, its every Performance Detection data see Table 2～table 3.
Lead-free tin solder alloy of low-silver SnAgCuSb prescription among the embodiment 1-6, specifically as shown in table 1: table 1SnAgCuSb series lead-free soldering tin alloy formula
Lead-free tin solder alloy of low-silver SnAgCuSb among the above-mentioned numbering 1-6 is carried out performance test, and the mass percent detected result of chemical ingredients sees Table 2:
Table 2 sample chemical ingredients detected result
The fusing point of the lead-free tin solder alloy of low-silver SnAgCuSb among the above-mentioned numbering 1-6, the rate of spread, tensile strength and three seconds wetting powers see Table 3:
Table 3 sample fusing point, the rate of spread, tensile strength and three seconds wetting power detected results
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 1 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 1, as seen from Figure 1, this low-silver lead-free soldering alloy has two phase transformations, its solidus temperature is 219.66 ℃, and liquidus temperature is 223.25 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 2 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 2, as seen from Figure 2, this low-silver lead-free soldering alloy has two phase transformations, its solidus temperature is 218.99 ℃, and liquidus temperature is 225.08 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 3 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 3, as seen from Figure 3, this low-silver lead-free soldering alloy has two phase transformations, its solidus temperature is 218.38 ℃, and liquidus temperature is 225.48 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 4 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 4, as seen from Figure 4, this low-silver lead-free soldering alloy has two phase transformations, its solidus temperature is 219.04 ℃, and liquidus temperature is 225.80 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 5 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 5, as seen from Figure 5, the solidus temperature of this low-silver lead-free soldering alloy is 219.60 ℃, and liquidus temperature is 222.96 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
The lead-free tin solder alloy of low-silver SnAgCuSb of numbering 6 detects through differential scanning calorimeter (Diamond DSC), obtain differential scanning calorimetric (DSC) curve and see Fig. 6, as seen from Figure 6, the solidus temperature of this low-silver lead-free soldering alloy is 219.63 ℃, and liquidus temperature is 226.64 ℃.The welding of adopting this soldering alloy to carry out on the electronic devices and components is tested, and has good wettability and oxidation-resistance, and its mechanical property is better than traditional tinsel national standard.
Low-silver lead-free soldering alloy of the present invention is being to add Ag, Cu, Sb, P, Ce element in the matrix with Sn.Add the lower silver of content, the electrical and thermal conductivity of silver is better, and certain plasticity is arranged, and can improve the creep strength of scolding tin, welding strength and unit elongation, the wettability of enhancing scolding tin.Copper has good conductive and heat-conductive solidity to corrosion and good welding property, because the mother metal major part that scolding tin is contacted when welding is copper product, so add copper in tin matrix, the mutual solubility between them, wettability are good, can improve the reliability of solder joint.Antimony can hinder grain growth in scolding tin, play the effect of crystal grain thinning, thereby helps improving the mechanical property of scolding tin.The adding of phosphorus can significantly improve the oxidation-resistance of scolding tin material.The scolding tin material can produce metal oxide in operation process, and the effectively generation of inhibited oxidation thing of the adding of phosphorus, play the effect of deoxidation, phosphorus has good influence to the welding property of copper in addition, and improves the extendability (good fluidity) of welding property, helps improving mechanical property.Add Ce in scolder, scolder can play cleaning action to material, improves conduction, the heat conductivility of material, plays crystal grain thinning, helps improving the plasticity of scolding tin material, and mechanical propertys such as the intensity of solder joint, unit elongation have also improved cost performance of product.
Concrete case study on implementation only is a preferable case study on implementation of the present invention described in the present invention, is not to be used for limiting practical range of the present invention.Be that all equivalences of doing according to the content of the present patent application claim change and modification, all should be as technology category of the present invention.
Claims (8)
1. a lead-free tin solder alloy of low-silver SnAgCuSb is characterized in that, its Chemical Composition count by weight percentage into:
The Ag of 0.1-1.0%
The Cu of 0.3-3.0%
The Sb of 0.1-1.0%
The P of 0.008-0.03%
The Ce of 0.006-0.08%
The Sn of surplus.
2. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
0.1% Ag
3.0% Cu
1.0% Sb
0.008% P
0.006% Ce
The Sn of surplus.
3. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
0.6% Ag
1.6% Cu
0.6% Sb
0.019% P
0.01% Ce
The Sn of surplus.
4. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
0.5% Ag
1.6% Cu
0.1% Sb
0.01% P
0.019% Ce
The Sn of surplus.
5. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
0.5% Ag
2.6% Cu
0.6% Sb
0.03% P
0.027% Ce
The Sn of surplus.
6. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
1.0% Ag
1.6% Cu
0.6% Sb
0.018% P
0.03% Ce
The Sn of surplus.
7. lead-free tin solder alloy of low-silver SnAgCuSb according to claim 1 is characterized in that, its Chemical Composition count by weight percentage into:
0.5% Ag
3.0% Cu
1.0% Sb
0.01% P
0.019% Ce
The Sn of surplus.
8. the preparation method according to any described lead-free tin solder alloy of low-silver SnAgCuSb in the claim 1 to 7 is characterized in that comprising the following steps:
(1) makes master alloy
A, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the SnAg master alloy, be warming up to 1080 ℃, treat that fusing of SnAg alloy liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnAg alloy pig after the air cooling demoulding of coming out of the stove;
B, in a vacuum frequently in the induction melting furnace weight percent with 80: 20 prepare the SnCu master alloy, be warming up to 1130 ℃, treat that fusing of SnCu alloy liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnCu alloy pig after the air cooling demoulding of coming out of the stove;
C, in a vacuum frequently in the induction melting furnace weight percent with 90: 10 prepare the SnSb master alloy, be warming up to 720 ℃, treat that fusing of SnSb alloy liquid and magnetic agitation are even, leave standstill ingot casting after 30 minutes, become the SnSb alloy pig after the air cooling demoulding of coming out of the stove;
D, in a vacuum frequently in the induction melting furnace weight percent with 98: 2 prepare the SnP master alloy, in crucible, form the molten bath, in stove, charge into rare gas element, be warming up to 350 ℃, from hopper, in the molten bath, add phosphorus, SnP alloy liquid alloying, magnetic agitation 5 minutes is to evenly, leave standstill ingot casting after 10 minutes, become the SnP alloy pig after the air cooling demoulding of coming out of the stove;
E, in a vacuum frequently in the induction melting furnace weight percent with 97.5: 2.5 prepare the SnCe master alloy, in crucible, form the molten bath, in stove, charge into rare gas element, be warming up to 900 ℃, from hopper, in the molten bath, add cerium, SnCe alloy liquid alloying, magnetic agitation 5 minutes is to evenly, leave standstill ingot casting after 10 minutes, become the SnCe alloy pig after the air cooling demoulding of coming out of the stove;
(2) SnAg, SnCu, SnSb, SnP, SnCe master alloy and tin are carried out weight proportion according to the Pb-free solder alloy ratio, after the pure tin fusing, be warming up to 350-400 ℃, drop into SnAg, SnCu, SnSb master alloy earlier, stirred 15 minutes the fusing back, after temperature is reduced to below 350 ℃, add SnP, SnCe master alloy again, remove slag after the homogenizing, cast required tin bar or tin slab behind the decon.
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| CN108004429A (en) * | 2017-11-29 | 2018-05-08 | 广西厚思品牌策划顾问有限公司 | A kind of low melting point lead-free solder alloy and preparation method thereof |
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| CN111421260A (en) * | 2020-04-07 | 2020-07-17 | 威海新佳电子有限公司 | Solder alloy and preparation method thereof |
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| WO2023103289A1 (en) * | 2021-12-10 | 2023-06-15 | 北京康普锡威科技有限公司 | Lead-free solder alloy, preparation method therefor and use thereof |
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