JP3040929B2 - Solder material - Google Patents
Solder materialInfo
- Publication number
- JP3040929B2 JP3040929B2 JP7018048A JP1804895A JP3040929B2 JP 3040929 B2 JP3040929 B2 JP 3040929B2 JP 7018048 A JP7018048 A JP 7018048A JP 1804895 A JP1804895 A JP 1804895A JP 3040929 B2 JP3040929 B2 JP 3040929B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- solder
- alloy
- content
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、主として電子回路基板
のはんだ付けに用いるクリームはんだ等におけるはんだ
材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder material for cream solder or the like mainly used for soldering an electronic circuit board.
【０００２】[0002]
【従来の技術】近年の電子回路基板における表面実装
は、電子部品の小型化、高密度実装化の一途をたどって
いる。それに伴いはんだ材料の高機能化が必要となって
きている。2. Description of the Related Art In recent years, surface mounting on electronic circuit boards has been steadily reduced in size and high-density mounting of electronic components. Accordingly, it has become necessary to enhance the functionality of the solder material.
【０００３】しかし、環境問題の立場から、従来一般の
はんだ材料（Ｓｎ−Ｐｂ系合金）中に含まれる鉛の問題
が浮上してきている。すなわち、従来のはんだ材料を用
いた製品の廃棄物が酸性雨にさらされると、有害物質で
ある鉛が大量に溶出するので、その毒性は非常に深刻な
問題となっている。そのため鉛を含むはんだに代替する
ことができる鉛を含有しないはんだ（鉛レスはんだ）材
料の開発が必要となっている。However, from the standpoint of environmental problems, the problem of lead contained in conventional general solder materials (Sn-Pb-based alloys) has emerged. That is, when a waste of a product using a conventional solder material is exposed to acid rain, a large amount of lead, which is a harmful substance, is eluted, and its toxicity is a very serious problem. Therefore, it is necessary to develop a lead-free solder (lead-less solder) material that can be substituted for a solder containing lead.
【０００４】以下に従来のはんだ材料の一例について説
明する。代表的なはんだ合金はその金属組成が錫と鉛の
共晶合金である、６３Ｓｎ−３７Ｐｂ（組成の比率６
３：３７は重量％以下同様）であり、１８３℃に共晶点
をもつものであった。An example of a conventional solder material will be described below. A typical solder alloy is 63Sn-37Pb (composition ratio 6), whose metal composition is a eutectic alloy of tin and lead.
3: 37% by weight or less), and had a eutectic point at 183 ° C.
【０００５】また、鉛を含まないはんだ合金の一例につ
いて説明する。Ｓｎ−３．５Ａｇ合金はんだ、およびＳ
ｎ−５Ｓｂ合金はんだは、Ｓｎ−Ｐｂ共晶はんだよりも
優れた機械的強度を持っている。また、濡れ性について
はＳｎ−Ｐｂ共晶はんだには若干劣るが、それでも代替
できる可能性があると考えられている。An example of a lead-free solder alloy will be described. Sn-3.5Ag alloy solder, and S
The n-5Sb alloy solder has better mechanical strength than the Sn-Pb eutectic solder. In addition, although the wettability is slightly inferior to that of the Sn-Pb eutectic solder, it is considered that there is a possibility that the solder may be substituted.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、Ｓｎ−
３．５Ａｇ合金はんだやＳｎ−５Ｓｂ合金はんだは融点
が高いため、作業温度が２２０℃〜２５０℃であるよう
な高温となり、電子部品の組立には温度が高すぎ、電子
部品を損傷させるという問題点を有していた。However, Sn-
Since the 3.5Ag alloy solder and the Sn-5Sb alloy solder have a high melting point, the working temperature is as high as 220 ° C. to 250 ° C., and the temperature is too high for assembling electronic components, and the electronic components are damaged. Had a point.
【０００７】本発明の目的は、上記のような問題点を発
生することなく、上記はんだの融点を下げ、優れた機械
的強度を持つはんだ材料を提供することにある。An object of the present invention is to provide a solder material having a low melting point and excellent mechanical strength without causing the above-mentioned problems.
【０００８】[0008]
【課題を解決するための手段】本願の発明は、上記従来
のＳｎ−３．５Ａｇ合金はんだの問題点（融点２２１
℃）を解消するため、Ａｇの含有量が０．１〜２０重量
％、Ｂｉの含有量が０．１〜２５重量％、Ｉｎの含有量
が０．１〜２０重量％であることを特徴とし、下記の配
合割合及びのものを除いたＡｇ−Ｂｉ−Ｉｎ−Ｓｎ
系のはんだ材料である。 SUMMARY OF THE INVENTION The present invention relates to the problems (melting point 221) of the above-mentioned conventional Sn-3.5Ag alloy solder.
° C), the content of Ag is 0.1 to 20 weight
%, Bi content is 0.1 to 25% by weight, In content
Is 0.1 to 20% by weight.
Ag-Bi-In-Sn excluding the mixing ratio and
It is a system solder material.
【０００９】 １〜４重量％のＡｇを含有し、Ｂｉ、
Ｉｎを以下の判別式（１）のＡの値が５．００以上、判
別式（２）のＢの値が６．９０以下となる量で含有し、
残部がＳｎからなるＡｇ−Ｂｉ−Ｉｎ−Ｓｎ系のはんだ
材料 Ａ＝[Ａｇｗｔ％]＋１．２３[Ｂｉｗｔ％]＋０．５２[Ｉｎｗｔ％]…（１） Ｂ＝[Ａｇｗｔ％]＋１．１９[Ｂｉｗｔ％]＋０．５０[Ｉｎｗｔ％]…（２） Ａｇ、Ｂｉ及びＩｎの配合割合が下記の表２の配合
割合からなり、残部がＳｎからなるＡｇ−Ｂｉ−Ｉｎ−
Ｓｎ系のはんだ材料 Containing 1-4 wt% Ag, Bi,
In is determined when the value of A in the following discriminant (1) is 5.00 or more.
Contained in an amount such that the value of B in formula (2) is 6.90 or less,
Ag-Bi-In-Sn based solder with the remainder being Sn
Material A = [Agwt%] + 1.23 [Biwt%] + 0.52 [Inwt%] ... (1) B = [Agwt%] + 1.19 [Biwt%] + 0.50 [Inwt%] ... (2) Ag , Bi and In are mixed as shown in Table 2 below.
Ag-Bi-In- consisting of a proportion and the balance being Sn
Sn-based solder material
【００１０】[0010]
【表２】 本願の第1の参考発明はＳｎとＡｇを基本組成とし、Ａ
ｇの含有量が０．１〜２０重量％とする合金であって、
その中に０．１〜２５重量％のＢｉ、０．１〜２０重量
％のＩｎのいずれか１種のみを含有し、残部がＳｎから
なることを特徴とする。[Table 2] The first reference invention of the present application has Sn and Ag as basic compositions,
An alloy having a g content of 0.1 to 20% by weight,
It is characterized in that it contains only one kind of Bi of 0.1 to 25% by weight and In of 0.1 to 20% by weight, with the balance being Sn.
【００１１】本願の第２の参考発明は、同様の目的を達
成するため、ＳｎとＡｇを基本組成とし、Ａｇの含有量
が０．１〜２０重量％とする合金であって、その中に
０．１〜２５重量％のＢｉ、０．１〜２０重量％のＩｎ
のいずれか１種以上を含有すると共に、０．１〜３．０
重量％のＣｕ、０．１〜１５重量％のＺｎのいずれか１
種以上を含有し、残部がＳｎからなることを特徴とす
る。In order to achieve the same object, the second reference invention of the present application is an alloy having a basic composition of Sn and Ag and an Ag content of 0.1 to 20% by weight. 0.1-25 wt% Bi, 0.1-20 wt% In
, And 0.1 to 3.0.
Any one of Cu% by weight and Zn of 0.1 to 15% by weight.
It is characterized by containing at least one species and the balance being Sn.
【００１２】本発明及び第１、第２の参考発明において
Ａｇの含有量は３．５重量％を中心にして、０．５〜６
重量％の範囲にあることが好適である。また主組成であ
るＳｎの含有量は７５〜９８重量％の範囲にあることが
好適である。In the present invention and the first and second reference inventions , the Ag content is 0.5 to 6 based on 3.5% by weight.
Preferably it is in the range of weight%. The content of Sn as the main composition is preferably in the range of 75 to 98% by weight.
【００１３】本願の第３の参考発明は、上記従来のＳｎ
−５Ｓｂ合金はんだの問題点（融点２４０℃）を解消す
るため、ＳｎとＳｂを基本組成とし、Ｓｂの含有量が
０．１〜２０重量％とする合金であって、その中に０．
１〜３０重量％のＢｉ、０．１〜２０重量％のＩｎのい
ずれか１種以上を含有し、残部がＳｎからなることを特
徴とする。 The third reference invention of the present application is the above-described conventional Sn
In order to solve the problem of the -5Sb alloy solder (melting point: 240 ° C.), this alloy has a basic composition of Sn and Sb and a Sb content of 0.1 to 20% by weight.
It is characterized in that it contains at least one of Bi in an amount of 1 to 30% by weight and In of 0.1 to 20% by weight, with the balance being Sn.
【００１４】本願の第４の参考発明は、同様の目的を達
成するため、ＳｎとＳｂを基本組成とし、Ｓｂの含有量
が０．１〜２０重量％とする合金であって、その中に
０．１〜３０重量％のＢｉ、０．１〜２０重量％のＩｎ
のいずれか１種以上を含有すると共に、０．１〜３．０
重量％のＣｕ、０．１〜１５重量％のＺｎのいずれか１
種以上を含有し、残部がＳｎからなることを特徴とす
る。According to a fourth aspect of the present invention , there is provided an alloy having a basic composition of Sn and Sb and an Sb content of 0.1 to 20% by weight in order to achieve the same object. 0.1-30 wt% Bi, 0.1-20 wt% In
, And 0.1 to 3.0.
Any one of Cu% by weight and Zn of 0.1 to 15% by weight.
It is characterized by containing at least one species and the balance being Sn.
【００１５】第３と第４の参考発明においてＳｂの含有
量は５重量％を中心にして、１〜９重量％の範囲にある
ことが好適である。また主組成であるＳｎの含有量は８
０〜９８重量％の範囲にあることが好適である。In the third and fourth reference inventions , the Sb content is preferably in the range of 1 to 9% by weight, centering on 5% by weight. The content of Sn, which is the main composition, is 8
Preferably it is in the range of 0 to 98% by weight.
【００１６】[0016]
【作用】本願発明及び第１、第２の参考発明において、
ＳｎとＡｇを基本組成とする合金に、Ｂｉ、Ｉｎの一方
又は両方を添加するのは、融点を下げるためである。こ
のような目的を達成するため、Ｂｉ、Ｉｎのそれぞれの
組成を０．１重量％以上としている。In the present invention and the first and second reference inventions ,
The reason for adding one or both of Bi and In to the alloy having the basic composition of Sn and Ag is to lower the melting point. In order to achieve such an object, the composition of each of Bi and In is set to 0.1% by weight or more.
【００１７】また、Ｂｉ、Ｉｎの組成がそれぞれ２５、
２０重量％を超えると機械的強度が得られなくなるので
好ましくない。さらにＢｉ、Ｉｎの添加量を増大する
と、濡れ性を良好なものとすることができる。The composition of Bi and In is 25, respectively.
If it exceeds 20% by weight, it is not preferable because mechanical strength cannot be obtained. Further, when the addition amount of Bi and In is increased, the wettability can be improved.
【００１８】図１は、Ｓｎ−３．５Ａｇ合金にＢｉを添
加した場合の添加量の変化に伴う融点の変化を示すもの
である。図１から明らかなように、Ｂｉの添加量が増加
するとともに融点は直線的に低下し、２５重量％の添加
により融点は１７５℃まで降下する。FIG. 1 shows the change in the melting point with the change in the amount of Bi added to the Sn-3.5Ag alloy. As is clear from FIG. 1, the melting point decreases linearly with an increase in the amount of Bi added, and the melting point drops to 175 ° C. with the addition of 25% by weight.
【００１９】図２は、Ｓｎ−３．５Ａｇ合金にＢｉを添
加した場合の添加量の変化に伴う引張り強度の変化を示
すものである。図２から明らかなように、Ｂｉの添加量
が約１０重量％で引張り強度が最大値を示し、Ｂｉの添
加量が２５重量％を超えると、Ｓｎ−３．５Ａｇ合金の
引張り強度よりも低下する。FIG. 2 shows the change in tensile strength with the change in the amount of Bi added to the Sn-3.5Ag alloy. As apparent from FIG. 2, the tensile strength shows the maximum value when the amount of added Bi is about 10% by weight, and when the amount of added Bi exceeds 25% by weight, the tensile strength is lower than the tensile strength of the Sn-3.5Ag alloy. I do.
【００２０】図３はＳｎ−３．５Ａｇ合金にＢｉを３重
量％添加した場合（Ｓｎ−３．５Ａｇ−３Ｂｉ）と、２
０重量％添加した場合（Ｓｎ−３．５Ａｇ−２０Ｂｉ）
の濡れ性を示すものである。図３から明らかなように、
６０Ｓｎ−４０Ｐｂ共晶はんだと同等の濡れ性を示し、
特にＢｉを２０重量％添加したものは、６０Ｓｎ−４０
Ｐｂ共晶はんだよりも良好な濡れ性を示す。FIG. 3 shows a case where Bi was added to Sn-3.5Ag alloy at 3% by weight (Sn-3.5Ag-3Bi),
0% by weight (Sn-3.5Ag-20Bi)
It indicates the wettability of the material. As is clear from FIG.
Shows the same wettability as 60Sn-40Pb eutectic solder,
In particular, those containing 20% by weight of Bi are 60Sn-40.
Shows better wettability than Pb eutectic solder.
【００２１】上記図１〜図３に示した傾向は、Ｓｎ−
３．５Ａｇ合金にＩｎを添加した場合、或いはＢｉ及び
Ｉｎの両者を添加した場合にもみられ、又Ａｇの含有量
を異ならしたときにもみられる。The trends shown in FIG. 1 to FIG.
This is also seen when In is added to the 3.5 Ag alloy, or when both Bi and In are added, and also when the Ag content is different.
【００２２】なお、Ｉｎの添加についてはＳｎホイスカ
の発生を抑制する作用をも有している。The addition of In also has the effect of suppressing the generation of Sn whiskers.
【００２３】第２の参考発明において、ＳｎとＡｇを基
本組成とし、Ｂｉ、Ｉｎの一方又は両方を添加したもの
に、更にＣｕ、Ｚｎを添加するのは強度を向上させるた
めである。In the second reference invention , the reason why Sn and Ag have the basic composition and one or both of Bi and In are added, and Cu and Zn are further added to improve the strength.
【００２４】強度確保のためＣｕ、Ｚｎのそれぞれの組
成を０．１重量％以上としている。また、２２１℃未満
の融点を確保するためにそれぞれ、３．０、１５重量％
以下とした。To ensure strength, the composition of each of Cu and Zn is set to 0.1% by weight or more. Further, in order to secure a melting point of less than 221 ° C., 3.0 and 15% by weight, respectively.
It was as follows.
【００２５】第３及び第４の参考発明において、Ｓｎと
Ｓｂを基本組成とする合金に、Ｂｉ、Ｉｎの一方又は両
方を添加するのは、第１発明と同様、融点を下げ、濡れ
性を改善するためである。この目的を達成するため、Ｂ
ｉ、Ｉｎのそれぞれの組成を０．１重量％以上とし、ま
た機械的強度の低下を防ぐため、Ｂｉ、Ｉｎのそれぞれ
の組成を３０、２０重量％以下としている。In the third and fourth reference inventions , the addition of one or both of Bi and In to the alloy having a basic composition of Sn and Sb reduces the melting point and improves the wettability similarly to the first invention. It is to improve. To achieve this goal, B
The composition of each of i and In is set to 0.1% by weight or more, and the composition of Bi and In is set to 30 or 20% by weight or less in order to prevent a decrease in mechanical strength.
【００２６】第４の参考発明において、ＳｎとＳｂを基
本組成とし、Ｂｉ、Ｉｎの一方又は両方を添加したもの
に、更にＣｕ、Ｚｎを添加するのは強度を向上させるた
めである。In the fourth reference invention , the reason why Sn and Sb are used as a basic composition and one or both of Bi and In are added, and Cu and Zn are further added to improve the strength.
【００２７】強度確保のためＣｕ、Ｚｎのそれぞれの組
成を０．１重量％以上とし、又２４０℃未満の融点を確
保するためにそれぞれ、３．０、１５重量％以下とし
た。The respective compositions of Cu and Zn are set to 0.1% by weight or more for ensuring the strength, and 3.0 and 15% by weight, respectively, for ensuring the melting point of less than 240 ° C.
【００２８】[0028]
【実施例】表３に本発明のはんだ材料の実施例及び参考
例をその組成率（重量％）と共に示す。EXAMPLES Table 3 shows examples of solder materials of the present invention and reference.
Examples are shown together with their composition ratios (% by weight).
【００２９】[0029]
【表３】 表３に示す実施例と参考例１〜６は、Ｓｎ（錫）とＡｇ
（銀）を基本組成とし、その中にＢｉ（ビスマス）、Ｉ
ｎ（インジウム）のいずれか１種以上を含有したはんだ
材料に係るもの、すなわち本願発明の実施例と第１、第
２の参考発明の参考例である。[Table 3] Examples shown in Table 3 and Reference Examples 1 to 6 are based on Sn (tin) and Ag.
(Silver) as the basic composition, and Bi (bismuth), I
n (indium), which relates to a solder material containing at least one of n (indium), that is, an embodiment of the present invention and first and second embodiments.
2 is a reference example of Reference Example 2 ;
【００３０】特に参考例５、参考例６は、ＳｎとＡｇを
基本組成とし、その中にＢｉ、Ｉｎのいずれか１種以上
を含有すると共に、Ｃｕ（銅）、Ｚｎ（亜鉛）のいずれ
か１種以上を含有したはんだ材料に係るもの、すなわち
第２の参考発明の参考例である。In particular, Reference Examples 5 and 6 have a basic composition of Sn and Ag, which contain at least one of Bi and In, and which contain at least one of Cu (copper) and Zn (zinc). Relating to solder materials containing one or more, ie
It is a reference example of the second reference invention .
【００３１】参考例７、参考例８は、ＳｎとＳｂ（アン
チモン）を基本組成とし、その中にＢｉ、Ｉｎのいずれ
か１種以上を含有したはんだ材料に係るもの、すなわち
第３の参考発明の参考例である。 Reference Examples 7 and 8 relate to a solder material having a basic composition of Sn and Sb (antimony) and containing at least one of Bi and In, namely,
It is a reference example of the third reference invention .
【００３２】又表３には、比較例として従来のはんだ材
料をその組成率（重量％）と共に示す。比較例１はＳｎ
−３．５Ａｇ合金はんだ、比較例２はＳｎ−５Ｓｂ合金
はんだ、比較例３は６３Ｓｎ−３７Ｐｂ共晶はんだであ
る。Table 3 shows a conventional solder material together with its composition ratio (% by weight) as a comparative example. Comparative Example 1 is Sn
-3.5Ag alloy solder, Comparative Example 2 is a Sn-5Sb alloy solder, and Comparative Example 3 is a 63Sn-37Pb eutectic solder.
【００３３】実施例と各参考例及び比較例１〜比較例３
の各融点、引張り強度及び濡れ性は、表３に示すとおり
である。濡れ性の評価は、○が最良、□が良、△が普通
であり、表３に示す事例のすべては普通以上であって、
不良のものはなかった。Examples, Reference Examples and Comparative Examples 1 to 3
Table 3 shows the melting point, tensile strength and wettability of the sample. The evaluation of wettability was as follows: ○ is best, □ is good, Δ is normal, all of the cases shown in Table 3 are more than normal,
Nothing was bad.
【００３４】表３より明らかなように、Ｓｎ−Ａｇ合金
はんだ及びＳｎ−Ｓｂ合金はんだに、Ｂｉ、Ｉｎを添加
することにより、融点を下げることができ、特に参考例
２、参考例４、実施例では融点を２００℃以下にするこ
とができた。また機械的強度も６３Ｓｎ−３７Ｐｂ共晶
はんだに比較し、同等あるいは改善されている。さらに
濡れ性も実用に差しつかえなく、特に参考例２は、６３
Ｓｎ−３７Ｐｂ共晶はんだと同等の良好な濡れ性を有し
ている。[0034] As is apparent from Table 3, the Sn-Ag alloy solder and Sn-Sb alloy solder, Bi, by adding In, it is possible to lower the melting point, in particular reference example
2, In Reference Example 4 and Example, the melting point could be reduced to 200 ° C. or less. Also, the mechanical strength is equivalent or improved as compared with the 63Sn-37Pb eutectic solder. Furthermore, the wettability may be practical. Especially, in Reference Example 2 , 63
It has good wettability equivalent to that of Sn-37Pb eutectic solder.
【００３５】次に参考例５（Ａｇ３．５重量％、Ｂｉ３
重量％、Ｚｎ１％、Ｃｕ０．７％、Ｓｎ残部）のはんだ
材料及び参考例２（Ａｇ３．５重量％、Ｂｉ２０重量
％．Ｓｎ残部）のはんだ材料をペースト化してなるクリ
ームはんだを用いて、チップ部品実装に供したときの実
験結果を、比較例３（６３Ｓｎ−３７Ｐｂ共晶はんだ）
を材料とするクリームはんだの場合と比較して示すと、
表４のようになる。Next, Reference Example 5 (3.5% by weight of Ag, Bi3
Chips using cream solder obtained by pasting the solder material of wt%, Zn1%, Cu0.7%, Sn balance) and the solder material of Reference Example 2 (Ag3.5 wt%, Bi20 wt%. Sn balance). Comparative example 3 (63Sn-37Pb eutectic solder) shows the experimental result when subjected to component mounting.
In comparison with the case of cream solder using
Table 4 below.
【００３６】なお、ペースト化に用いたフラックスの組
成は、溶剤４０重量％、ロジン５５．３１重量％、活性
剤０．６９重量％、チキソ剤４重量％である。The composition of the flux used for forming the paste was 40% by weight of a solvent, 55.31% by weight of rosin, 0.69% by weight of an activator, and 4% by weight of a thixotropic agent.
【００３７】[0037]
【表４】 表４から明らかなように、参考例５及び参考例２におけ
るチップ立ち発生率は１．７％、１．５５％であって、
比較例３の１．５％とほぼ同等であり、チップ部品の実
装を従来の場合とほぼ同様に行うことができる。[Table 4] As is clear from Table 4, the chip standing occurrence rates in Reference Example 5 and Reference Example 2 were 1.7% and 1.55%, respectively.
This is almost equal to 1.5% of Comparative Example 3, and the mounting of the chip component can be performed almost in the same manner as the conventional case.
【００３８】上記説明においては、第４の参考発明の参
考例を具体的には挙げなかったが、参考例５（第２の参
考発明）と参考例１（第１の参考発明）との関係に見ら
れるように、例えば参考例７（第３の参考発明）のもの
にＺｎ、Ｃｕを添加することによって引張り強度を改善
できる参考例（第４の参考発明相当のもの）を想定でき
ることが自明であるからである。In the above description, reference is made to the fourth reference invention.
Although no specific examples were given, reference example 5 (second reference) was used.
As can be seen from the relationship between the present invention and Reference Example 1 (First Reference Invention) , for example , the tensile strength can be improved by adding Zn and Cu to Reference Example 7 (Third Reference Invention ). This is because it is obvious that a reference example ( corresponding to the fourth reference invention ) can be assumed.
【００３９】[0039]
【発明の効果】本発明によれば、はんだの融点を電子部
品組立てが可能な程度にまで下げることができると共
に、機械的強度及び濡れ性にすぐれた、無鉛のはんだ材
料を提供することができる。According to the present invention, it is possible to provide a lead-free solder material which can reduce the melting point of solder to a level at which electronic components can be assembled and has excellent mechanical strength and wettability. .
【図１】Ｓｎ−３．５Ａｇ合金にＢｉを添加した場合の
添加量と融点との関係を示す特性図。FIG. 1 is a characteristic diagram showing a relationship between an added amount and a melting point when Bi is added to a Sn-3.5Ag alloy.
【図２】Ｓｎ−３．５Ａｇ合金にＢｉを添加した場合の
添加量と引張り強度との関係を示す特性図。FIG. 2 is a characteristic diagram showing a relationship between the addition amount and the tensile strength when Bi is added to a Sn-3.5Ag alloy.
【図３】参考発明の参考例と比較例との濡れ性を比較し
て示す特性図。FIG. 3 is a characteristic diagram showing a comparison between wettability of a reference example of the reference invention and a comparative example.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 古澤 彰男 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平２−179387（ＪＰ，Ａ) 特開 平６−238479（ＪＰ，Ａ) 特開 平６−126484（ＪＰ，Ａ) 特開 昭62−252693（ＪＰ，Ａ) 特開 平７−88681（ＪＰ，Ａ) 特開 平８−187590（ＪＰ，Ａ) 特開 平８−132277（ＪＰ，Ａ) 特開 平８−132279（ＪＰ，Ａ) 特開 平８−164495（ＪＰ，Ａ) 特開 平７−88679（ＪＰ，Ａ) 特開 平８−192291（ＪＰ，Ａ) 特開 平５−50286（ＪＰ，Ａ) 特公 昭57−54238（ＪＰ，Ｂ２) 特公 平４−35278（ＪＰ，Ｂ２) 特公 昭52−7422（ＪＰ，Ｂ２) 特公 昭56−49679（ＪＰ，Ｂ２) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 35/26 310 C22C 13/00 H05K 3/34 512 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Furusawa 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-2-179387 (JP, A) JP-A-6- 238479 (JP, A) JP-A-6-126484 (JP, A) JP-A-62-252593 (JP, A) JP-A-7-88681 (JP, A) JP-A 8-187590 (JP, A) JP-A-8-132277 (JP, A) JP-A-8-132279 (JP, A) JP-A-8-164495 (JP, A) JP-A-7-88679 (JP, A) JP-A-8-192291 (JP, A) JP-A-5-50286 (JP, A) JP-B-57-54238 (JP, B2) JP-B 4-35278 (JP, B2) JP-B-52-7422 (JP, B2) 56-49679 (JP, B2) (58) Fields investigated (Int. Cl. 7 , DB name) B23K 35/26 310 C2 2C 13/00 H05K 3/34 512
Claims (1)
ｉの含有量が０．１〜２５重量％、Ｉｎの含有量が０．
１〜２０重量％であることを特徴とし、下記の配合割合
及びのものを除いたＡｇ−Ｂｉ−Ｉｎ−Ｓｎ系のは
んだ材料。 １〜４重量％のＡｇを含有し、Ｂｉ、Ｉ
ｎを以下の判別式（１）のＡの値が５．００以上、判別
式（２）のＢの値が６．９０以下となる量で含有し、残
部がＳｎからなるＡｇ−Ｂｉ−Ｉｎ−Ｓｎ系のはんだ材
料 Ａ＝[Ａｇｗｔ％]＋１．２３[Ｂｉｗｔ％]＋０．５２[Ｉｎｗｔ％]…（１） Ｂ＝[Ａｇｗｔ％]＋１．１９[Ｂｉｗｔ％]＋０．５０[Ｉｎｗｔ％]…（２） Ａｇ、Ｂｉ及びＩｎの配合割合が下記の表１の配合
割合からなり、残部がＳｎからなるＡｇ−Ｂｉ−Ｉｎ−
Ｓｎ系のはんだ材料 【表１】 1. The method according to claim 1, wherein the Ag content is 0.1 to 20% by weight,
The content of i is 0.1 to 25% by weight, and the content of In is 0.1 to 25% by weight.
1-20% by weight
The Ag-Bi-In-Sn system excluding and
Material. Containing 1-4% by weight of Ag, Bi, I
When the value of A in the following discriminant (1) is 5.00 or more,
It is contained in such an amount that the value of B in the formula (2) becomes 6.90 or less,
Ag-Bi-In-Sn-based solder material whose part is made of Sn
Fee A = [Agwt%] + 1.23 [Biwt%] + 0.52 [Inwt%] ... (1) B = [Agwt%] + 1.19 [Biwt%] + 0.50 [Inwt%] ... (2) Ag , Bi and In are composed of the proportions shown in Table 1 below, with the balance being Sn-Ag-Bi-In-.
Sn-based solder material [Table 1]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7018048A JP3040929B2 (en) | 1995-02-06 | 1995-02-06 | Solder material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7018048A JP3040929B2 (en) | 1995-02-06 | 1995-02-06 | Solder material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11317139A Division JP2000126890A (en) | 1999-11-08 | 1999-11-08 | Soldering material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08206874A JPH08206874A (en) | 1996-08-13 |
| JP3040929B2 true JP3040929B2 (en) | 2000-05-15 |
Family
ID=11960816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7018048A Expired - Lifetime JP3040929B2 (en) | 1995-02-06 | 1995-02-06 | Solder material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3040929B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8598464B2 (en) | 2009-04-20 | 2013-12-03 | Panasonic Corporation | Soldering material and electronic component assembly |
| US9199340B2 (en) | 2013-11-27 | 2015-12-01 | Panasonic Intellectual Property Management Co., Ltd. | Solder material and bonded structure |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3226213B2 (en) | 1996-10-17 | 2001-11-05 | 松下電器産業株式会社 | Solder material and electronic component using the same |
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| US6649127B2 (en) | 1996-12-17 | 2003-11-18 | Sony Chemicals Corp | Lead-free solder material having good wettability |
| CN1252842A (en) * | 1997-04-22 | 2000-05-10 | 伊科索尔德国际股份有限公司 | Lead-free solder |
| WO1999004048A1 (en) * | 1997-07-17 | 1999-01-28 | Litton Systems, Inc. | Tin-bismuth based lead-free solders |
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| US6365097B1 (en) | 1999-01-29 | 2002-04-02 | Fuji Electric Co., Ltd. | Solder alloy |
| JP2001071174A (en) * | 1999-09-07 | 2001-03-21 | Mitsui Mining & Smelting Co Ltd | Tin-silver base solder alloy |
| KR100407448B1 (en) | 2000-06-12 | 2003-11-28 | 가부시키가이샤 히타치세이사쿠쇼 | Electronic apparatus and semiconductor device |
| JP2002100857A (en) * | 2000-09-25 | 2002-04-05 | Matsushita Electric Ind Co Ltd | Flux-applying method, flow soldering method, device for the same and electronic circuit board |
| JP2002273596A (en) * | 2001-03-19 | 2002-09-25 | Mitsui Mining & Smelting Co Ltd | Tin-silver-base solder alloy |
| KR20040063027A (en) * | 2003-01-04 | 2004-07-12 | 삼화비철공업 주식회사 | Alloy that there is no lead ingredient for soldering |
| US7215030B2 (en) * | 2005-06-27 | 2007-05-08 | Advanced Micro Devices, Inc. | Lead-free semiconductor package |
| JP4618089B2 (en) * | 2005-10-12 | 2011-01-26 | 千住金属工業株式会社 | Sn-In solder alloy |
| JP4993916B2 (en) * | 2006-01-31 | 2012-08-08 | 昭和シェル石油株式会社 | In solder-coated copper foil ribbon conductor and connection method thereof |
| GB2452229B (en) | 2006-06-30 | 2010-11-17 | Asahi Kasei Emd Corp | Conductive filler |
| JP5493257B2 (en) * | 2007-09-12 | 2014-05-14 | トヨタ自動車株式会社 | Manufacturing method of semiconductor device |
| JP5339968B2 (en) | 2009-03-04 | 2013-11-13 | パナソニック株式会社 | Mounting structure and motor |
| JP5061168B2 (en) * | 2009-09-17 | 2012-10-31 | ルネサスエレクトロニクス株式会社 | Manufacturing method of electronic equipment |
| JP5756933B2 (en) | 2010-09-29 | 2015-07-29 | 株式会社弘輝 | flux |
| JP2011058003A (en) * | 2010-11-24 | 2011-03-24 | Mitsubishi Chemicals Corp | Epoxy resin composition for sealing semiconductor, resin-sealed semiconductor device and method for mounting semiconductor device |
| KR101752616B1 (en) | 2011-02-25 | 2017-06-29 | 센주긴조쿠고교 가부시키가이샤 | Solder alloy for power device and soldered joint of high current density |
| GB201114076D0 (en) * | 2011-08-16 | 2011-09-28 | Pilkington Group Ltd | Glazing |
| CN103737195B (en) * | 2013-12-30 | 2016-03-02 | 大连理工大学 | The application of Sn-Zn-Bi base leadless solder alloy in aluminum bronze solder |
| CN105880872A (en) * | 2016-06-03 | 2016-08-24 | 广东昭信照明科技有限公司 | Brazing material and preparing method thereof |
| US11267080B2 (en) | 2019-05-09 | 2022-03-08 | Indium Corporation | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders |
| CN111872595A (en) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | Low-temperature solder of Sn, in, Ag and Bi |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
-
1995
- 1995-02-06 JP JP7018048A patent/JP3040929B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8598464B2 (en) | 2009-04-20 | 2013-12-03 | Panasonic Corporation | Soldering material and electronic component assembly |
| US9199340B2 (en) | 2013-11-27 | 2015-12-01 | Panasonic Intellectual Property Management Co., Ltd. | Solder material and bonded structure |
| US9789569B2 (en) | 2013-11-27 | 2017-10-17 | Panasonic Intellectual Property Managment Co., Ltd. | Solder material and bonded structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08206874A (en) | 1996-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3040929B2 (en) | Solder material | |
| JP3220635B2 (en) | Solder alloy and cream solder | |
| JP3753168B2 (en) | Solder paste for joining microchip components | |
| JP5142999B2 (en) | Cream solder and soldering method for electronic parts | |
| EP1952934B1 (en) | Soldering paste and solder joints | |
| KR101059710B1 (en) | Solder paste and printed circuit board | |
| JP3761678B2 (en) | Tin-containing lead-free solder alloy, cream solder thereof, and manufacturing method thereof | |
| KR100213695B1 (en) | Tin bismuth solder paste and method using paste to form connection having improved high temperature properties | |
| EP1317991B1 (en) | Solder paste | |
| KR19980068127A (en) | Lead-Free Alloys for Soldering | |
| EP1073539B1 (en) | Use of lead-free solder alloy powder paste in pcb production | |
| JP2002018589A (en) | Lead-free solder alloy | |
| JP3262113B2 (en) | Solder alloy | |
| JP2003311469A (en) | Solder paste, electronic parts and step soldering method | |
| JPH08132277A (en) | Leadless solder | |
| JP4389331B2 (en) | Paste solder | |
| WO2005099961A1 (en) | Lead-free, bismuth-free solder alloy powders and pastes and methods of production thereof | |
| JPH1041621A (en) | Junction method using tin-bismuth solder | |
| JP2000126890A (en) | Soldering material | |
| JP3346848B2 (en) | Lead-free solder alloy | |
| JP2003112285A (en) | Solder paste | |
| JP2001018090A (en) | Solder paste and soldering method | |
| JPH11138292A (en) | Nonleaded solder paste | |
| JP3107483B2 (en) | No to low lead content solder alloy | |
| JPH08192291A (en) | Cream solder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080303 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090303 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100303 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110303 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120303 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130303 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130303 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140303 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term |