CN111872595A - Low-temperature solder of Sn, in, Ag and Bi - Google Patents
Low-temperature solder of Sn, in, Ag and Bi Download PDFInfo
- Publication number
- CN111872595A CN111872595A CN202010740939.7A CN202010740939A CN111872595A CN 111872595 A CN111872595 A CN 111872595A CN 202010740939 A CN202010740939 A CN 202010740939A CN 111872595 A CN111872595 A CN 111872595A
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- Prior art keywords
- low
- percent
- indium
- silver
- bismuth
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a low-temperature tin, indium, silver and bismuth brazing solder, which comprises the following components: calculated by mass percent, 20-40 percent of tin, 20-40 percent of indium, 20-30 percent of silver and 15-20 percent of bismuth. The invention has excellent heat conductivity, low melting point, excellent flexibility and ductility, can better satisfy the matching relation of thermal expansion coefficients among materials, provides the welding yield, has good processing performance of the brazing filler metal, can effectively improve the low temperature resistance of welding parts after adding tin, indium, silver and bismuth, can balance the expansion coefficients of raw materials, and effectively reduces the occurrence of cracking after welding.
Description
Technical Field
The invention belongs to the technical field of low-temperature brazing materials, and particularly relates to a tin, indium, silver and bismuth low-temperature brazing material.
Background
The indium-based solder is low-temperature solder, a series of binary low-melting-point eutectic solders are formed by adding elements such as Sn, Pb, Ag and the like, the influence of high-temperature factors on products in the packaging and welding process can be avoided, the indium-based solder has high corrosion resistance to alkaline media, has good wetting capacity to metals and nonmetals, and the formed welding spot has the advantages of low resistance, high plasticity and the like. Therefore, the indium-based solder is mainly applied to the packaging of electric vacuum devices, glass, ceramics and low-temperature superconducting devices, has the characteristics of excellent heat conductivity, low melting point, excellent softness and ductility and the like, and is suitable for the braze welding connection of the following materials or device combinations: the welding temperature of the automobile windshield-antenna connecting wire harness, the automobile windshield-heating connecting wire harness or the automobile wire harness wire-electrical component is 135-165 ℃. However, due to the matching relationship of the thermal expansion coefficients of the materials, the binary alloy may have defects such as cracking after welding, thereby reducing the yield. Therefore, we propose a low-temperature solder of Sn, in, Ag and Bi.
Disclosure of Invention
The invention aims to provide a low-temperature tin, indium, silver and bismuth brazing material which can balance the expansion coefficients of raw materials and effectively reduce cracking after welding so as to solve the problems of poor flexibility and ductility of welding rods in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
the low-temperature tin, indium, silver and bismuth brazing solder comprises the following components: calculated by mass percent, 20-40 percent of tin, 20-40 percent of indium, 20-30 percent of silver and 15-20 percent of bismuth.
Preferably, the mass percentage of tin is 40%, indium is 30%, silver is 20%, and bismuth is 10%.
Preferably, the mass percentage of the tin is 20 percent, the indium is 40 percent, the silver is 25 percent, and the bismuth is 15 percent.
Preferably, 30% of tin, 20% of indium, 30% of silver and 20% of bismuth by mass percentage.
Preferably, the purity of the tin raw material in the low-temperature brazing solder is 99%.
Preferably, the purity of the indium raw material in the low-temperature brazing solder is 99%.
Preferably, the purity of the silver raw material in the low-temperature brazing solder is 99%.
Preferably, the purity of the bismuth raw material in the low-temperature brazing solder is 99%.
Preferably, the thickness of the low-temperature brazing solder strip is set to be 0.02-0.04 mm.
The invention has the technical effects and advantages that: compared with the prior art, the low-temperature tin, indium, silver and bismuth brazing material provided by the invention has the following advantages:
the low-temperature brazing material is mainly prepared from tin, indium, silver and bismuth in proportion, the brazing filler metal has excellent thermal conductivity, low melting point and excellent softness and ductility, can better meet the matching relation of thermal expansion coefficients among materials, provides a welding yield, has good processing performance, can effectively improve the low-temperature resistance of a welding part after the tin, indium, silver and bismuth are added, can balance the expansion coefficients of raw materials, and effectively reduces the occurrence of cracking after welding.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The low-temperature tin, indium, silver and bismuth brazing solder comprises the following components: according to the mass percentage, the tin is 40%, the purity of tin raw materials in the low-temperature brazing solder is 99%, the purity of indium is 30%, the purity of indium raw materials in the low-temperature brazing solder is 99%, the purity of silver is 20%, the purity of silver raw materials in the low-temperature brazing solder is 99%, the purity of bismuth is 10%, the purity of bismuth raw materials in the low-temperature brazing solder is 99%, and the thickness of the low-temperature brazing solder strip is set to be 0.02 mm.
Example 2
The low-temperature tin, indium, silver and bismuth brazing solder comprises the following components: according to the mass percentage, the tin is 20%, the purity of tin raw materials in the low-temperature brazing solder is 99%, the purity of indium is 40%, the purity of indium raw materials in the low-temperature brazing solder is 99%, the purity of silver is 25%, the purity of silver raw materials in the low-temperature brazing solder is 99%, the purity of bismuth is 15%, the purity of bismuth raw materials in the low-temperature brazing solder is 99%, and the thickness of the low-temperature brazing solder strip is set to be 0.03 mm.
Example 3
The low-temperature tin, indium, silver and bismuth brazing solder comprises the following components: according to the mass percentage, the tin is 30 percent, the purity of tin raw materials in the low-temperature brazing solder is 99 percent, the purity of indium is 20 percent, the purity of indium raw materials in the low-temperature brazing solder is 99 percent, the purity of silver is 30 percent, the purity of silver raw materials in the low-temperature brazing solder is 99 percent, the purity of bismuth raw materials in the low-temperature brazing solder is 20 percent, and the thickness of the low-temperature brazing solder strip is set to be 0.04 mm.
Table 1, the compositions and weight percentages of the compositions of examples 1-3 of the present invention when performed, are given in the following table:
table 2, the tensile strength, the peel strength and the melting point of the low temperature brazing material obtained when carrying out examples 1 to 3 of the present invention are compared to each other, and the following table is obtained:
according to the table 1 and the table 2, the low-temperature brazing material in the embodiment 1 has good processing performance, the melting point is 120-105 ℃, the post-welding breaking force is larger than 13.4N, the stripping force is larger than 1.421N, and the use requirement is met;
according to the table 1 and the table 2, the low-temperature brazing material in the embodiment 2 has good processing performance, the melting point is between 100 ℃ and 108 ℃, the post-welding breaking force is larger than 13.4N, the stripping force is larger than 0.88N, and the use requirement is met;
according to the table 1 and the table 2, the low-temperature brazing solder in the embodiment 3 has good processing performance, the melting point is between 100 and 109.5 ℃, the post-welding tensile strength is larger than 13.4N, the peeling force is larger than 1.643N, and the use requirement is met.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. The low-temperature tin, indium, silver and bismuth brazing solder is characterized in that: the low-temperature brazing solder comprises the following components: calculated by mass percent, 20-40 percent of tin, 20-40 percent of indium, 20-30 percent of silver and 15-20 percent of bismuth.
2. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: calculated by mass percent, 40 percent of tin, 30 percent of indium, 20 percent of silver and 10 percent of bismuth.
3. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: calculated by mass percent, 20 percent of tin, 40 percent of indium, 25 percent of silver and 15 percent of bismuth.
4. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: 30% of tin, 20% of indium, 30% of silver and 20% of bismuth in percentage by mass.
5. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: the purity of the tin raw material in the low-temperature brazing solder is 99%.
6. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: the purity of the indium raw material in the low-temperature brazing solder is 99%.
7. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: the purity of the silver raw material in the low-temperature brazing solder is 99%.
8. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: the purity of the bismuth raw material in the low-temperature brazing solder is 99 percent.
9. The tin, indium, silver and bismuth low-temperature brazing solder as claimed in claim 1, is characterized in that: the thickness of the low-temperature brazing solder strip is set to be 0.02-0.04 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010740939.7A CN111872595A (en) | 2020-07-29 | 2020-07-29 | Low-temperature solder of Sn, in, Ag and Bi |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010740939.7A CN111872595A (en) | 2020-07-29 | 2020-07-29 | Low-temperature solder of Sn, in, Ag and Bi |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111872595A true CN111872595A (en) | 2020-11-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010740939.7A Pending CN111872595A (en) | 2020-07-29 | 2020-07-29 | Low-temperature solder of Sn, in, Ag and Bi |
Country Status (1)
| Country | Link |
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| CN (1) | CN111872595A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117697225A (en) * | 2024-02-06 | 2024-03-15 | 苏州雷盾新材料科技有限公司 | Low-temperature soldering tin photovoltaic solder strip welding material and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08206874A (en) * | 1995-02-06 | 1996-08-13 | Matsushita Electric Ind Co Ltd | Solder material |
| CN101780613A (en) * | 2010-03-25 | 2010-07-21 | 杭州华光焊料有限公司 | Special rare earth alloy silver-brazing filler metal |
| JP2010167465A (en) * | 2009-01-23 | 2010-08-05 | Asahi Kasei E-Materials Corp | Metal filler and solder paste |
| CN105965172A (en) * | 2016-06-06 | 2016-09-28 | 厦门强力巨彩光电科技有限公司 | Low temperature welding material |
| CN106312362A (en) * | 2016-10-31 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material for LED and preparation method thereof |
| CN108971793A (en) * | 2018-08-24 | 2018-12-11 | 云南科威液态金属谷研发有限公司 | A kind of low-temperature lead-free solder |
| CN110125571A (en) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | A kind of high intensity low-temperature lead-free solder and its solder(ing) paste |
-
2020
- 2020-07-29 CN CN202010740939.7A patent/CN111872595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08206874A (en) * | 1995-02-06 | 1996-08-13 | Matsushita Electric Ind Co Ltd | Solder material |
| JP2010167465A (en) * | 2009-01-23 | 2010-08-05 | Asahi Kasei E-Materials Corp | Metal filler and solder paste |
| CN101780613A (en) * | 2010-03-25 | 2010-07-21 | 杭州华光焊料有限公司 | Special rare earth alloy silver-brazing filler metal |
| CN105965172A (en) * | 2016-06-06 | 2016-09-28 | 厦门强力巨彩光电科技有限公司 | Low temperature welding material |
| CN106312362A (en) * | 2016-10-31 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material for LED and preparation method thereof |
| CN108971793A (en) * | 2018-08-24 | 2018-12-11 | 云南科威液态金属谷研发有限公司 | A kind of low-temperature lead-free solder |
| CN110125571A (en) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | A kind of high intensity low-temperature lead-free solder and its solder(ing) paste |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117697225A (en) * | 2024-02-06 | 2024-03-15 | 苏州雷盾新材料科技有限公司 | Low-temperature soldering tin photovoltaic solder strip welding material and preparation method thereof |
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Application publication date: 20201103 |