CN111872596A - Indium, lead, silver and antimony low-temperature brazing solder - Google Patents
Indium, lead, silver and antimony low-temperature brazing solder Download PDFInfo
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- CN111872596A CN111872596A CN202010741402.2A CN202010741402A CN111872596A CN 111872596 A CN111872596 A CN 111872596A CN 202010741402 A CN202010741402 A CN 202010741402A CN 111872596 A CN111872596 A CN 111872596A
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- CN
- China
- Prior art keywords
- low
- temperature brazing
- brazing solder
- indium
- percentage
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
Abstract
The invention discloses an indium, lead, silver and antimony low-temperature brazing solder, which comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.5, Sb: 0.85-1.15, the rest is In. The brazing filler metal not only has excellent heat conductivity, low melting point, fabulous softness and ductility, and the matching relation who satisfies coefficient of thermal expansion between the material that simultaneously can be better provides the welding yield, and the processability of brazing filler metal self is good simultaneously, especially can satisfy the demand to thin silk material. Moreover, the brazing filler metal is suitable for various welding methods such as soldering of complex iron, resistance soldering, special soldering and the like.
Description
Technical Field
The invention belongs to the technical field of low-temperature brazing materials, and particularly relates to an indium, lead, silver and antimony low-temperature brazing material.
Background
The indium-based solder is low-temperature solder, a series of binary low-melting-point eutectic solders are formed by adding elements such as Sn, Pb, Ag and the like, the influence of high-temperature factors on products in the packaging and welding process can be avoided, the indium-based solder has high corrosion resistance to alkaline media, has good wetting capacity to metals and nonmetals, and the formed welding spot has the advantages of low resistance, high plasticity and the like. Therefore, the indium-based solder is mainly applied to the packaging of electric vacuum devices, glass, ceramics and low-temperature superconducting devices, has the characteristics of excellent heat conductivity, low melting point, excellent softness and ductility and the like, and is suitable for the braze welding connection of the following materials or device combinations: the welding temperature of the automobile windshield-antenna connecting wire harness, the automobile windshield-heating connecting wire harness or the automobile wire harness wire-electrical component is 135-165 ℃. However, due to the matching relationship of the thermal expansion coefficients of the materials, the binary alloy may have defects such as cracking after welding, thereby reducing the yield.
Meanwhile, researches on solders of ternary alloys of In-Ag-Pb, In-Sn-Ag and the like show that the wire breakage rate is higher when the wire is prepared, particularly when the diameter is less than 2 mm.
Therefore, a low-temperature brazing filler metal which meets the requirements of good performance of a brazing filler metal connection joint and excellent self-processing performance is not available in the field of automobile application at present.
Disclosure of Invention
The invention aims to provide an indium, lead, silver and antimony low-temperature brazing solder to solve the problems in the prior art in the background technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
the low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.5, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.0, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.7-5.2, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 13.5-15.0, Ag: 3.5-4.5, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 13.5-15.0, Ag: 4.5-5.2, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 14.5-15.5, Ag: 4.2-5.2, Sb: 0.85-1.15, the rest is In.
Preferably, the low-temperature brazing solder comprises the following components in percentage by weight: 13.0-16.5, Ag: 4.5-5.5, Sb: 0.85-1.15, the rest is In.
The invention has the technical effects and advantages that: compared with the prior art, the indium, lead, silver and antimony low-temperature brazing solder provided by the invention has the following advantages:
the invention is used as a low-temperature brazing material and is suitable for brazing materials among automobile windshields, antenna connecting wire harnesses, automobile windshields, heating connecting wire harnesses or automobile wire harness wires and electrical components. The brazing filler metal not only has excellent heat conductivity, low melting point, fabulous softness and ductility, and the matching relation who satisfies coefficient of thermal expansion between the material that simultaneously can be better provides the welding yield, and the processability of brazing filler metal self is good simultaneously, especially can satisfy the demand to thin silk material. Moreover, the brazing filler metal is suitable for various welding methods such as soldering of complex iron, resistance soldering, special soldering and the like.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.5, Sb: 0.85, the rest is In.
Example 2
The low-temperature brazing solder comprises the following components in percentage by weight: 13.00, Ag: 4.50, Sb: 0.90, the rest is In.
Example 3
The low-temperature brazing solder comprises the following components in percentage by weight: 13.00, Ag: 5.00, Sb: 1.00 with the balance In.
Example 4
The low-temperature brazing solder comprises the following components in percentage by weight: 13.50, Ag: 3.50, Sb: 0.85, the rest is In.
Example 5
The low-temperature brazing solder comprises the following components in percentage by weight: 14.00, Ag: 3.50, Sb: 0.85, the rest is In
Example 6
The low-temperature brazing solder comprises the following components in percentage by weight: 14.50, Ag: 5.00, Sb: 1.00, remainder In
Example 7
The low-temperature brazing solder comprises the following components in percentage by weight: 15.00, Ag: 4.80, Sb: 1.10, balance In
Example 8
The low-temperature brazing solder comprises the following components in percentage by weight: 15.00, Ag: 5.00, Sb: 1.00, remainder In
Example 9
The low-temperature brazing solder comprises the following components in percentage by weight: 15.00, Ag: 4.50, Sb: 0.85, the rest is In
Example 10
The low-temperature brazing solder comprises the following components in percentage by weight: 15.50, Ag: 5.00, Sb: 1.00, remainder In
Example 11
The low-temperature brazing solder comprises the following components in percentage by weight: 16.00, Ag: 5.50, Sb: 1.10, balance In
Example 12
The low-temperature brazing solder comprises the following components in percentage by weight: 16.50, Ag: 6.00, Sb: 1.15, balance In
Table 1, the compositions and weight percentages of the compositions of examples 1-12 of the present invention when performed, are given in the following table:
table 2, the tensile strength, peel strength and melting point of the low temperature solders obtained when examples 1 to 12 of the present invention were performed are compared to each other, and the following table is obtained:
the solder with the components of 1-8 shown in the tables 1 and 2 is adopted, the processing performance is good, the minimum diameter of the processed wire reaches 0.5mm, the automobile windshield-antenna connecting wire harness is welded at the brazing temperature of 150-165 ℃, the post-welding breaking force is larger than 13.4N, the stripping force is larger than 0.867N, and the use requirement is met.
The component solders of the embodiments 1-8 shown in the tables 1 and 2 are adopted, the processing performance is good, the minimum diameter of the processed wire reaches 0.5mm, the automobile windshield glass-heating connecting wire harness is welded at the brazing temperature of 150-165 ℃, the post-welding breaking force is larger than 13.0N, the stripping force is larger than 0.831N, and the use requirements are met.
The component solders of the embodiments 1-8 shown in the tables 1 and 2 are adopted, the processing performance is good, the minimum diameter of the processed wire reaches 0.5mm, the automobile wire harness wire-electrical component is welded at the brazing temperature of 150-165 ℃, the post-welding breaking force is larger than 13.5N, the stripping force is larger than 1.097N, and the use requirements are met.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. The low-temperature brazing solder of indium, lead, silver and antimony is characterized by comprising the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.5, Sb: 0.85-1.15, the rest is In.
2. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.5-5.0, Sb: 0.85-1.15, the rest is In.
3. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 12.0-13.5, Ag: 4.7-5.2, Sb: 0.85-1.15, the rest is In.
4. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 13.5-15.0, Ag: 3.5-4.5, Sb: 0.85-1.15, the rest is In.
5. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 13.5-15.0, Ag: 4.5-5.2, Sb: 0.85-1.15, the rest is In.
6. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 14.5-15.5, Ag: 4.2-5.2, Sb: 0.85-1.15, the rest is In.
7. The indium, lead, silver and antimony low-temperature brazing solder as claimed in claim 1, wherein the low-temperature brazing solder comprises the following components in percentage by weight: 13.0-16.5, Ag: 4.5-5.5, Sb: 0.85-1.15, the rest is In.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010741402.2A CN111872596A (en) | 2020-07-29 | 2020-07-29 | Indium, lead, silver and antimony low-temperature brazing solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010741402.2A CN111872596A (en) | 2020-07-29 | 2020-07-29 | Indium, lead, silver and antimony low-temperature brazing solder |
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| Publication Number | Publication Date |
|---|---|
| CN111872596A true CN111872596A (en) | 2020-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010741402.2A Pending CN111872596A (en) | 2020-07-29 | 2020-07-29 | Indium, lead, silver and antimony low-temperature brazing solder |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53130252A (en) * | 1977-04-19 | 1978-11-14 | Fujitsu Ltd | Solder material |
| CN1477663A (en) * | 2002-07-16 | 2004-02-25 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type temp, fuse and wire for temp, fuse component |
| CN1842907A (en) * | 2003-08-26 | 2006-10-04 | 德山株式会社 | Substrate for device bonding, device bonded substrate, and method for producing same |
| CN103476539A (en) * | 2011-02-04 | 2013-12-25 | 安塔亚技术公司 | Lead-free solder composition |
| CN110153589A (en) * | 2019-06-17 | 2019-08-23 | 常熟理工学院 | A kind of indium base solder and preparation method thereof |
-
2020
- 2020-07-29 CN CN202010741402.2A patent/CN111872596A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53130252A (en) * | 1977-04-19 | 1978-11-14 | Fujitsu Ltd | Solder material |
| CN1477663A (en) * | 2002-07-16 | 2004-02-25 | ���Ű�˹̩�˹ɷ�����˾ | Alloy type temp, fuse and wire for temp, fuse component |
| CN1842907A (en) * | 2003-08-26 | 2006-10-04 | 德山株式会社 | Substrate for device bonding, device bonded substrate, and method for producing same |
| CN103476539A (en) * | 2011-02-04 | 2013-12-25 | 安塔亚技术公司 | Lead-free solder composition |
| CN110153589A (en) * | 2019-06-17 | 2019-08-23 | 常熟理工学院 | A kind of indium base solder and preparation method thereof |
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Application publication date: 20201103 |
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