CN113210927A - Indium tin alloy solder, welding method and preparation method - Google Patents
Indium tin alloy solder, welding method and preparation method Download PDFInfo
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- CN113210927A CN113210927A CN202110617076.9A CN202110617076A CN113210927A CN 113210927 A CN113210927 A CN 113210927A CN 202110617076 A CN202110617076 A CN 202110617076A CN 113210927 A CN113210927 A CN 113210927A
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- CN
- China
- Prior art keywords
- tin alloy
- alloy solder
- indium
- indium tin
- welding
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 229910001128 Sn alloy Inorganic materials 0.000 title claims abstract description 36
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 238000003466 welding Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 12
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011701 zinc Substances 0.000 claims abstract description 7
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims description 14
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 238000003723 Smelting Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002241 glass-ceramic Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
- Ceramic Products (AREA)
Abstract
The invention discloses an indium tin alloy solder, a welding method and a preparation method, and relates to the technical field of welding. The invention discloses an indium tin alloy solder, which comprises: 5-20% of indium, 1-5% of zinc, 1-5% of antimony, 0.001-1% of rare earth elements and the balance of tin. The indium tin alloy solder can be used for welding oxide materials such as glass, ceramics and the like, can well wet and combine the oxide materials such as the glass, the ceramics and the like, improves the welding performance, and has better combination strength and air tightness.
Description
Technical Field
The invention relates to the technical field of welding, in particular to an indium tin alloy solder, a welding method and a preparation method.
Background
At present, ultrasonic brazing is a favorable brazing mode for products such as glass ceramics, and compared with the traditional metallization coating, the method can reduce brazing cost and simplify the process flow. However, indium tin alloys used for ultrasonic brazing, such as 52% In48% Sn, are poor In moisture resistance and low In strength by themselves, although they can be used for ultrasonic brazing.
Patent No. CN00800883 discloses a lead-free solder, which can be used for ultrasonic brazing of glass ceramics, but contains titanium, which is an insoluble metal, and increases the difficulty of alloy melting and the cost for preparing the solder.
In view of this, the invention is particularly proposed.
Disclosure of Invention
The invention aims to provide an indium tin alloy solder, a welding method and a preparation method. The indium tin alloy solder provided by the invention can be used for welding oxide materials such as glass and ceramics, can well wet and combine the oxide materials such as glass and ceramics, improves the welding performance, and has better combination strength and air tightness; in addition, the indium tin alloy solder has low melting temperature and is easy to prepare.
The invention is realized by the following steps:
the invention provides an indium tin alloy solder which comprises the following raw materials in percentage by mass: 50-95% of tin (Sn), 5-20% of indium (In), 1-5% of zinc (Zn), 1-5% of antimony (Sb) and 0.001-1% of rare earth elements.
In is an active, easily oxidizable element with very low surface energy, and can be wetted and bonded with materials such as glass and ceramics. However, In is a rare metal and is expensive, so that the amount of In used needs to be reduced, and In has a low strength and a low melting point, and thus it is difficult to satisfy performance requirements such as high temperature resistance and moisture resistance. The indium tin alloy solder can reduce the using amount of In and reduce the oxidation of In by adding Zn with the same activity, thereby improving the welding performance. In addition, the hardness of Zn is higher, the hardness of the solder can be improved, the wetting is enhanced, the processing is convenient, and the automatic wire feeding can be carried out on an automatic soldering machine.
Indium is easy to oxidize, the surface oxide film is thin, the oxide film can prevent indium from being further oxidized, and after melting, once the oxide film is broken, the indium can wet oxide materials such as glass and ceramics, and the like, and the indium can spread on the surfaces of the oxide materials such as the glass and the ceramics due to the extremely low surface energy. Although the indium content of the indium-tin alloy solder does not exceed 20 percent, the activity is maintained by adding Zn, so that the bonding strength and the air tightness of the solder are ensured.
Antimony (Sb) can improve the high temperature resistance and humidity resistance of the material; by adding rare earth elements, the grains of the material can be refined, and the strength and the connection performance of the material are improved.
In a word, the indium tin alloy solder of the invention selects each element scientifically and reasonably and controls the content of each element within a proper range, and can well wet and combine oxide materials such as glass, ceramics and the like during welding, thereby improving the welding performance and the combination strength and the air tightness; in addition, the indium-tin alloy solder contains no titanium, has low melting temperature and is easy to prepare.
Optionally, in some embodiments of the invention, the rare earth element is selected from one or a combination of two of cerium (Ce), lanthanum (La), praseodymium (Pr), and neodymium (Nd).
The addition of the rare earth elements can improve the activity of the material, better wet the oxide and improve the welding strength.
Optionally, in some embodiments of the invention, the feedstock further comprises 0.01-1% copper (Cu).
Alternatively, in some embodiments of the invention, the feedstock further comprises 0.001 to 0.1% silicon (Si).
Si is an inorganic element, has the same properties as glass ceramics, and can enhance wetting and reduce the expansion coefficient.
Optionally, in some embodiments of the invention, the feedstock further comprises 0.001 to 1% aluminum (Al).
Al is an active element, and the addition of a trace amount can further improve the activity of the solder and reduce the usage amount of indium.
Alternatively, in some embodiments of the invention, the feedstock comprises: 8% indium, 4% zinc, 3% antimony, 0.5% rare earth elements, 0.1% copper, 0.05% silicon, 0.2% aluminum, and the balance tin.
In another aspect, the invention provides the use of an indium tin alloy solder as defined in any one of the above for soldering an oxide material or a material coated with an oxide film.
Alternatively, in some embodiments of the invention, the oxide material is a glass, a ceramic, or a composite of both.
In another aspect, the present invention provides a method of soldering an oxide material using the indium tin alloy solder as defined in any one of the above.
Alternatively, in some embodiments of the invention, the welding is performed using ultrasonic brazing.
In another aspect, the present invention provides a method of preparing an indium tin alloy solder as described above, comprising: heating and smelting the raw materials to obtain the indium-tin alloy solder.
Alternatively, in some embodiments of the invention, when the feedstock contains aluminum or silicon, the method comprises: preparing tin and aluminum or silicon in the raw materials into intermediate alloy, and then heating and smelting the intermediate alloy and other components to prepare the indium-tin alloy solder.
Alternatively, in some embodiments of the invention, the temperature of the heat melting is 300-600 ℃ for 5-30 minutes.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view of a welding structure for welding soda lime glass by using a welding material in an embodiment; in the figure: 1-nano-calcium glass, 2-supporting clamp, 3-pressing clamp and 4-alloy solder.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The features and properties of the present invention are described in further detail below with reference to examples.
Examples and comparative examples
The content ratios (mass percentages) of the indium tin alloy solders provided by examples 1 to 5 and comparative examples 1 to 3 are shown in the following table:
the rare earth element used in the examples and comparative examples was lanthanum.
The preparation method of the indium tin alloy solder in the embodiment is as follows:
when Al is used as the raw material, Sn and Al are added into a vacuum induction furnace at the smelting temperature of 600-800 ℃, the temperature is kept for 5-30 minutes, and then the intermediate alloy is cast.
When Si is used as the raw material, Sn and Si are added into a vacuum induction furnace, the melting temperature is 800-1500 ℃, the temperature is kept for 5-30 minutes, and then the intermediate alloy is cast.
And then adding the intermediate alloy and other raw materials into a vacuum induction furnace, heating and smelting at the smelting temperature of 300-600 ℃, preserving heat for 5-30 minutes, and casting into ingots after smelting to obtain the indium-tin alloy solder for welding oxide materials such as glass, ceramics and the like.
Experimental example 1
Detection of welding performance: to determine the solder strength of the solder and the oxide, two soda lime glasses 1 (length 50mm x width 50mm x thickness 3 mm) were used, and solder 4 was coated between the soda lime glasses using a 60khz ultrasonic iron and the connection structure of fig. 1 was formed. The test specimen was subjected to a 3-point bending test using the supporting jig 2 and the pressing jig 3, and the strength of the joint when it was peeled off or broken was measured. The results of the weld strength test of each example and comparative example are shown in table 1.
It can be seen that the soldering strength of soldering with the solder of example 1 is higher than that of the solder of comparative example.
In summary, the indium tin alloy solder provided by the embodiment of the invention has the following advantages:
the traditional SnAgCu or PbSn solder is difficult to wet and tin solder glass ceramics, so a metal layer is plated on the surface of the glass ceramics by a magnetron sputtering coating mode, and then the glass ceramics are further tin soldered, thereby increasing the process complexity and the cost. The indium-tin alloy solder provided by the embodiment of the invention can reduce the use amount of rare metal indium, improve the activity strength and strengthen the welding performance to oxide, thereby realizing low cost and high performance.
The traditional Sn-In alloy can wet glass ceramics, but is too soft and difficult to process and feed on automatic soldering equipment.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The indium tin alloy solder is characterized by comprising the following raw materials in percentage by mass: 5-20% of indium, 1-5% of zinc, 1-5% of antimony, 0.001-1% of rare earth elements and the balance of tin.
2. An indium tin alloy solder according to claim 1, wherein the rare earth element is selected from one or a combination of two of cerium, lanthanum, praseodymium and neodymium.
3. An indium tin alloy solder according to claim 1 or 2, characterized in that the raw material further contains 0.01 to 1% of copper.
4. An indium tin alloy solder according to claim 1 or 2, characterized in that the raw material further contains 0.001 to 0.1% of silicon.
5. An indium tin alloy solder according to claim 1 or 2, characterized in that the raw material further contains 0.001 to 1% of aluminum.
6. An indium tin alloy solder according to claim 1 or 2, characterized in that the raw materials contain: 8% indium, 4% zinc, 3% antimony, 0.5% rare earth elements, 0.1% copper, 0.05% silicon, 0.2% aluminum, and the balance tin.
7. Use of an indium tin alloy solder according to any one of claims 1 to 6 for soldering oxide materials or materials coated with an oxide film.
8. The use according to claim 7, wherein the oxide material is a glass, ceramic or a composite of both.
9. A method for soldering an oxide material, characterized by soldering using the indium tin alloy solder according to any one of claims 1 to 6; preferably, the welding is performed using ultrasonic brazing.
10. A method of making an indium tin alloy solder according to any of claims 1 to 6, comprising: heating and smelting the raw materials to prepare the indium-tin alloy solder; preferably, when the raw material contains aluminum or silicon, the method includes: preparing tin and aluminum or silicon in the raw materials into an intermediate alloy, and then heating and smelting the intermediate alloy and other components to prepare the indium-tin alloy solder; preferably, the temperature for heating and smelting is 300-600 ℃, and the time is 5-30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110617076.9A CN113210927A (en) | 2021-06-03 | 2021-06-03 | Indium tin alloy solder, welding method and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110617076.9A CN113210927A (en) | 2021-06-03 | 2021-06-03 | Indium tin alloy solder, welding method and preparation method |
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| Publication Number | Publication Date |
|---|---|
| CN113210927A true CN113210927A (en) | 2021-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110617076.9A Pending CN113210927A (en) | 2021-06-03 | 2021-06-03 | Indium tin alloy solder, welding method and preparation method |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115041799A (en) * | 2022-05-25 | 2022-09-13 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
| CN115383344A (en) * | 2022-06-06 | 2022-11-25 | 桂林航天工业学院 | In-48Sn-xCuZnAl composite solder and preparation method and application thereof |
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| CN1398697A (en) * | 2001-07-25 | 2003-02-26 | 邓和升 | Lead-free solder |
| JP2004082199A (en) * | 2002-08-29 | 2004-03-18 | Kuroda Techno Co Ltd | Unleaded solder |
| JP2014196549A (en) * | 2013-03-29 | 2014-10-16 | 千住金属工業株式会社 | Electric conductive adhesion material |
| CN104755221A (en) * | 2012-08-31 | 2015-07-01 | 千住金属工业株式会社 | Electroconductive bonding material |
| CN105479030A (en) * | 2016-01-07 | 2016-04-13 | 哈尔滨工业大学 | Active anti-corrosion SnZn base brazing filler metal, manufacturing method thereof and low-temperature ultrasonic brazing method of ceramic and/or composite material and aluminum and magnesium alloy |
| CN111872597A (en) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | Low-temperature solder of Sn, in, Zn and Sb |
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2021
- 2021-06-03 CN CN202110617076.9A patent/CN113210927A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1398697A (en) * | 2001-07-25 | 2003-02-26 | 邓和升 | Lead-free solder |
| JP2004082199A (en) * | 2002-08-29 | 2004-03-18 | Kuroda Techno Co Ltd | Unleaded solder |
| CN104755221A (en) * | 2012-08-31 | 2015-07-01 | 千住金属工业株式会社 | Electroconductive bonding material |
| JP2014196549A (en) * | 2013-03-29 | 2014-10-16 | 千住金属工業株式会社 | Electric conductive adhesion material |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115041799A (en) * | 2022-05-25 | 2022-09-13 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
| CN115041799B (en) * | 2022-05-25 | 2023-01-24 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
| CN115383344A (en) * | 2022-06-06 | 2022-11-25 | 桂林航天工业学院 | In-48Sn-xCuZnAl composite solder and preparation method and application thereof |
| CN115383344B (en) * | 2022-06-06 | 2024-02-06 | 桂林航天工业学院 | In-48Sn-xCuZnAl composite solder and preparation method and application thereof |
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Application publication date: 20210806 |