CN105965172A - Low temperature welding material - Google Patents
Low temperature welding material Download PDFInfo
- Publication number
- CN105965172A CN105965172A CN201610397820.8A CN201610397820A CN105965172A CN 105965172 A CN105965172 A CN 105965172A CN 201610397820 A CN201610397820 A CN 201610397820A CN 105965172 A CN105965172 A CN 105965172A
- Authority
- CN
- China
- Prior art keywords
- low temperature
- solder
- alloy
- welding material
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C11/00—Alloys based on lead
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a low temperature welding material. The low temperature welding material comprises the following components by weight percent: 38 to 45% of Sn, 10 to 18% of Bi and 2.2 to 10% of In, and the balance being Pb. According to the low temperature welding material, the four elements of Sn, Pb, Bi and In are reasonably matched, an Sn-Pb-Bi-In quaternary alloy is prepared, and the alloy welding material has the characteristics that the melting point is low, the strength after welding is high, the temperature resistance is good, the toughness is good, and the cost is moderate.
Description
Technical field
The present invention relates to a kind of low temperature solder materials, be specifically related to LED illumination industry assembling solder manufacturing technology field.
Background technology
Semiconductor lighting, with its obvious characteristics of energy saving and environment-friendly function, has been widely regarded as the most potential high-tech
One of field.Along with development and the quickening of industrialization process of LED technology, and the guiding of departments of government and promotion, LED
Lighting engineering is applied at home and is promoted rapidly, and market scale constantly expands, as realizing the core technology of semiconductor lighting,
Bigger power output, luminous energy export, and higher photoelectric transformation efficiency is following development trend.
LED lamp bead welds, with substrate, the technology barriers that always LED is faced.In some special field (such as medical treatment), by
In the LED lamp bead non-refractory of its specific use, when temperature is higher than 150 DEG C, lamp bead is easily burned, and causes bad.So
When using tin cream as welding material, traditional SAC and tin-lead eutectic are too high and can not meet use requirement due to its fusing point,
Eutectic solder must be used.Containing in In solder, such as ternary alloy three-partalloy Sn-Bi-In, Sn-Pb-In, all there is fusing point and become
This contradiction, wants to make fusing point be reduced to less than 150 DEG C, and the content of In is at least more than 20%, and In belongs to noble metal, as
The solder of this high In content, industry generally not accepts；Containing the bianry alloy of In, stannum indium eutectic (SnIn52) alloy melts
Point is suitable, plasticity is good, but its intensity is compared relatively low, and rare element In too high levels causes cost the highest, is also not suitable for advising greatly
Mould is applied.And in the alloy of SnBi series, stannum bismuth eutectic (SnBi58) solder melt point is 138 DEG C, welding temperature can be met and want
Ask, but its solder joint is the most crisp, in use easily cause lamp bead and come off, it is impossible to meet welding between LED lamp bead with substrate
The requirement of strength of joint；And Sn-Pb-Bi alloy exists the contradiction of alloy fragility and fusing point, when fusing point is relatively low, fragility is poor, when
When fragility is good, fusing point is the most higher.
Summary of the invention
In order to solve the problems referred to above, the invention provides a kind of low temperature solder materials, by tetra-kinds of elements of Sn, Pb, Bi, In
Carrying out rational proportion and be prepared for Sn-Pb-Bi-In quaternary alloy, this solder has low melting point, deposited strength height, heatproof
Good, the feature of good toughness, moderate cost of property.
To achieve these goals, technical scheme is as follows:
A kind of low temperature solder materials, including the component of following percentage by weight: Sn be 38-45%, Bi be that 10-18%, In are
2.2-10%, remaining is Pb.
Further, described low temperature solder materials includes that the component of following percentage by weight: Sn is that 38-43%, Bi are
13.0-18.0%, In are 4.0-8.0%, and remaining is Pb.
Further, also include additive, described additive include in Cd, Zn, P, Ge, Ga, RE one or both with
Upper component, wherein, by weight percentage, Cd be 0-2.0%, Zn be 0-4.0%, P be 0-0.5%, Ge be 0-0.5%,
Ga be 0-0.5%, RE be 0-0.5%.
Preferably, described additive is Cd, and its percentage by weight is 0.05-2.0%.
Preferably, described additive includes Zn, P, wherein, by weight percentage, Zn be 0.05-4.0%, P be 0.01-0.5%.
Preferably, described additive includes Cd, Ge and RE, and wherein, by weight percentage, Cd is 0.05-2.0%, Ge
It is 0.01-0.5% for 0.01-0.5%, RE.
Technical scheme of the present invention provides the benefit that relative to prior art, acquirement:
(1) present invention is by the rational proportion to tetra-kinds of elements of Sn, Pb, Bi, In, is ensureing low-temperature melting point, higher-strength
On the premise of toughness, reduce the content (2.2-10%) of rare precious metal indium in this solder, and existing solder contains
Having in the binary of In or ternary alloy three-partalloy that In content is at least more than 20%, cost remains high, and the present invention is by reducing In's
Content meets the cost requirement of scale practical application；On the other hand, the addition of In makes the plastic deformation ability of alloy significantly
Strengthening, toughness improves, and meets the use requirement under mal-condition.
(2) present invention is by the rational proportion to tetra-kinds of elements of Sn, Pb, Bi, In, it is to avoid unfavorable intermetallic compound (IMC)
Thick form and the appearance of alloy internal oxidation so that it is do not increase the melting range of solder while fusion temperature can be significantly reduced, carry
Rise the heat resistance of postwelding；And it is capable of solution strengthening, refined crystalline strengthening and in-situ preparation IMC dispersion-strengtherning, three kinds of strengthenings
The common reciprocal action of mechanism makes the impact resistance of solder and toughness be substantially improved.
(3) be to promote further application performance index, also can add strengthening class or antioxidation dvielement Cd on a small quantity, Zn, P, Ge,
One or more combination in Ga, RE, described RE is the rare earth of general rich La or rich Ce；Adding of the elements such as Cd, Zn
Adding binding ability and the postwelding fatigue resistance improving solder further, P, Ge, Ga, RE etc. add can promote weldering further
The non-oxidizability of material, and refine solder tissue, promote the reliability of postwelding product further.
Accompanying drawing explanation
Fig. 1 is the scanning electron microscope macrograph of Sn-36Pb-14Bi-8In solder；
Fig. 2 is DSC curve and the temperatur-timel curve (cooling procedure) of Sn-36Pb-14Bi-8In；
Fig. 3 is the temperatur-timel curve (cooling procedure) of Sn-40Pb-13Bi-5In-0.05Zn-0.01P；
Fig. 4 is the temperatur-timel curve (cooling procedure) of Sn-39Pb-16Bi-4In-2Cd-0.01Ge-0.01RE；
Fig. 5 is the temperatur-timel curve (cooling procedure) of Sn-40Pb-13Bi-7In.
Detailed description of the invention
In order to make the technical problem to be solved, technical scheme and beneficial effect clearer, clear, below in conjunction with reality
Execute example, the present invention is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain this
Bright, it is not intended to limit the present invention.
A kind of low temperature solder materials of the present invention, is that 38-45%, Bi are including the component of following percentage by weight: Sn
10-18%, In are 2.2-10%, and remaining is Pb.
Further, described low temperature solder materials includes that the component of following percentage by weight: Sn is that 38-43%, Bi are
13.0-18.0%, In are 4.0-8.0%, and remaining is Pb.
Further, also include additive, described additive include in Cd, Zn, P, Ge, Ga, RE one or both with
Upper component, wherein, by weight percentage, Cd be 0-2.0%, Zn be 0-4.0%, P be 0-0.5%, Ge be 0-0.5%,
Ga be 0-0.5%, RE be 0-0.5%.
Preferably, described additive is Cd, and its percentage by weight is 0.05-2.0%.
Preferably, described additive includes Zn, P, wherein, by weight percentage, Zn be 0.05-4.0%, P be 0.01-0.5%.
Preferably, described additive includes Cd, Ge and RE, and wherein, by weight percentage, Cd is 0.05-2.0%, Ge
It is 0.01-0.5% for 0.01-0.5%, RE.
The preparation method of a kind of low temperature solder materials of the present invention, comprises the steps:
Step 1: be proportionally added into Sn, Pb, Bi, In raw material weighed up in smelting furnace, and add appropriate melting coverture,
It is heated to 250-300 DEG C, is incubated 10-20min；
Step 2: remove the surface dopant of step 1 gained liquation, is cast in mould and makes solder ingot blank, standby.
Step 3: above-mentioned steps 2 gained solder ingot blank is applied directly as solder, or make band, filament plate or roll sheet use；
Or by above-mentioned steps 2 gained solder ingot blank 200-300 DEG C of fusing, dust, be prepared as spherical alloy welding powder, as soldering paste base
Material.
A kind of low temperature solder materials of the present invention, it adds additive, described additive include Cd, Zn, P, Ge, Ga,
One or more components in RE, the preparation method of this low temperature solder materials, comprise the steps:
Step 1: additive is prepared as intermediate alloy, described intermediate alloy is Pb-17Cd, Sn-9Zn, Sn-5P, Sn-5Ge,
Sn-5Ga、Sn-5RE；
Step 2: add Sn, Pb, Bi, In raw material weighed up in proportion and the intermediate alloy of step 1 preparation in smelting furnace,
And add appropriate melting coverture, it is heated to 250-300 DEG C, is incubated 10-20min；；
Step 3: remove the surface dopant of step 3 gained liquation, is cast in mould and makes solder ingot blank, standby.
Step 4: above-mentioned steps 3 gained solder ingot blank is applied directly as solder, or make band, filament plate or roll sheet use.
Or by above-mentioned steps 3 gained solder ingot blank 200-300 DEG C of fusing, dust, be prepared as spherical alloy welding powder, as soldering paste base
Material.
Embodiment 1
Low temperature solder materials described in the present embodiment, including the component of following percentage by weight: 40%Sn, 40%Pb, 13%Bi and
7%In.Its preparation process is as follows:
Step 1: add the 40 parts of pure Sn weighed up, 40 parts of pure Pb, 13 parts of pure Bi, 7 parts of pure In in 200kg smelting furnace
Raw material, altogether 100kg, add the ZnCl of 100g2Melting coverture, is heated to 250 DEG C, and is incubated 20min；
Step 2: remove surface dopant after above-mentioned gained liquation is stirred 3-5min, be cast in mould and make eutectic welding
Material ingot blank.
Step 3: on extruder, step 2 gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy welding powder.
Embodiment 2
Low temperature solder materials described in the present embodiment, including the component of following percentage by weight: 42%Sn, 36%Pb, 14%Bi and
8%In.Its preparation process is as follows:
Step 1: add the 42 parts of pure Sn weighed up, 36 parts of pure Pb, 14 parts of pure Bi, 8 parts of pure In in 200kg smelting furnace
Raw material, altogether 100kg, add the ZnCl of 100g2Melting coverture, is heated to 250 DEG C, and is incubated 20min；
Step 2: remove surface dopant after above-mentioned gained liquation is stirred 3-5min, be cast in mould and make eutectic welding
Material ingot blank.
Step 3: on extruder, step 2 gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy welding powder.
Embodiment 3
Low temperature solder materials described in the present embodiment, including the component of following percentage by weight: 38.95%Sn, 36%Pb, 15%Bi
With 10%In, 0.05%Cd.Its preparation process is as follows:
Step 1: using the mode of vacuum induction melting, Pb-17Cd intermediate alloy is prepared in melting under the conditions of 400 DEG C；
Step 2: proportioning as listed by table 1, depends on pure Sn, pure Pb, pure Bi, the charging sequence of pure In and Pb-17Cd alloy
In secondary addition smelting furnace, and add ZnCl2Coverture is heated to 300 DEG C in smelting furnace, is incubated 20min after fusing；
Step 3: remove surface dopant, waters alloy melt and casts from mould, solidification, prepares solder ingot blank.
Step 4: on extruder, step 3 gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy welding powder.
Embodiment 4-7
According to the mass percent of each alloying component listed in table 1, prepare the low temperature solder materials of embodiment 4-7 respectively.
Step 1: the binary intermediate alloys such as preparation Pb-17Cd, Sn-9Zn, Sn-5P, Sn-5Ge, Sn-5RE, Sn-5Ga, its
Preparation method is the mode using vacuum induction melting；
Step 2: proportioning as listed by table 1, according to pure Sn, pure Pb, pure Bi, pure In and the intermediate alloy of required kind, ZnCl2
The charging sequence of coverture is sequentially added in smelting furnace, is heated to 300 DEG C in smelting furnace, is incubated 20min after fusing；
Step 3: remove surface dopant, waters alloy melt and casts from mould, solidification, prepares the series of embodiment 4-7
Solder ingot blank.
Step 4: on extruder, step 3 gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy welding powder.
| Embodiment | Sn | Pb | Bi | In | Cd | Zn | P | Ge | Ga | RE |
| 1 | 40 | 40 | 13 | 7 | / | / | / | / | / | / |
| 2 | 42 | 36 | 14 | 8 | / | / | / | / | / | / |
| 3 | 38.95 | 36 | 15 | 10 | 0.05 | / | / | / | / | / |
| 4 | 42.75 | 37 | 18 | 2.2 | / | 0.05 | / | / | / | / |
| 5 | 41.94 | 40 | 13 | 5 | / | 0.05 | 0.01 | / | / | / |
| 6 | 38.98 | 39 | 16 | 4 | 2 | / | / | 0.01 | / | 0.01 |
| 7 | 40.5 | 31 | 16 | 8 | / | 4 | / | / | 0.2 | 0.3 |
Table 1 embodiment proportioning data (percentage by weight %)
Table 2 section Example compares with fusing point and the mechanical property of tradition main flow solder
Find out that low temperature solder materials of the present invention is in fusion temperature, elongation percentage, tensile strength and yield strength from table 2 data
Assessing etc. comprehensive aspect, comparing conventional solder has advantage, is ensureing under its solderability premise, improve solder tensile strength and
Yield strength, and the combination reliability of solder joint can be improved.
Fig. 1 is the scanning electron microscope macrograph of Sn-36Pb-14Bi-8In solder.As can be seen from the figure this solder even tissue,
Being dispersed with the most tiny precipitation strength phase in tissue, this is also the basic reason that such solder has higher-strength；Fig. 2
Being the temperatur-timel curve (cooling procedure) of Sn-36Pb-14Bi-8In, Fig. 3 is Sn-40Pb-13Bi-5In-0.05Zn-0.01P
Temperatur-timel curve (cooling procedure), Fig. 4 and Fig. 5 be respectively Sn-39Pb-16Bi-4In-2Cd-0.01Ge-0.01RE and
The temperatur-timel curve (cooling procedure) of Sn-40Pb-13Bi-7In, the fusion temperature of such solder is relatively low as can be seen from Figure,
Molten solder can be realized 150 DEG C of conditions by temperature retention time, and solder is being showed no endothermic peak appearance less than 100 DEG C,
Illustrate that such solder has stable Solid State Structure less than 100 DEG C of conditions.
Described above illustrate and describes the preferred embodiments of the present invention, as previously mentioned, it should be understood that the present invention is not limited to this
Form disclosed by literary composition, is not to be taken as the eliminating to other embodiments, and can be used for other combinations various, amendment and environment,
And can be modified by above-mentioned teaching or the technology of association area or knowledge in invention contemplated scope described herein.And this
Change that field personnel are carried out and change, the most all should be in claims of the present invention without departing from the spirit and scope of the present invention
In protection domain.
Claims (6)
1. a low temperature solder materials, it is characterised in that: include that the component of following percentage by weight: Sn is that 38-45%, Bi are
10-18%, In are 2.2-10%, and remaining is Pb.
A kind of low temperature solder materials the most according to claim 1, it is characterised in that: include the component of following percentage by weight:
Sn be 38-43%, Bi be 13.0-18.0%, In be 4.0-8.0%, remaining is Pb.
A kind of low temperature solder materials the most according to claim 1 and 2, it is characterised in that: also include additive, described in add
Adding one or more components that agent includes in Cd, Zn, P, Ge, Ga, RE, wherein, by weight percentage, Cd is
0-2.0%, Zn be 0-4.0%, P be 0-0.5%, Ge be 0-0.5%, Ga be 0-0.5%, RE be 0-0.5%.
A kind of low temperature solder materials the most according to claim 3, it is characterised in that: described additive is Cd, its weight hundred
Proportion by subtraction is 0.05-2.0%.
A kind of low temperature solder materials the most according to claim 3, it is characterised in that: described additive includes Zn, P, its
In, by weight percentage, Zn be 0.05-4.0%, P be 0.01-0.5%.
A kind of low temperature solder materials the most according to claim 3, it is characterised in that: described additive include Cd, Ge and
RE, wherein, by weight percentage, Cd be 0.05-2.0%, Ge be 0.01-0.5%, RE be 0.01-0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610397820.8A CN105965172A (en) | 2016-06-06 | 2016-06-06 | Low temperature welding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610397820.8A CN105965172A (en) | 2016-06-06 | 2016-06-06 | Low temperature welding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105965172A true CN105965172A (en) | 2016-09-28 |
Family
ID=57011597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610397820.8A Pending CN105965172A (en) | 2016-06-06 | 2016-06-06 | Low temperature welding material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105965172A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312362A (en) * | 2016-10-31 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material for LED and preparation method thereof |
| CN106848817A (en) * | 2017-03-28 | 2017-06-13 | 王淑珍 | A kind of high-capacity optical fiber laser |
| CN111872595A (en) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | Low-temperature solder of Sn, in, Ag and Bi |
| CN111979434A (en) * | 2020-08-07 | 2020-11-24 | 广东先导稀材股份有限公司 | Preparation method of low-melting-point alloy |
| CN112247394A (en) * | 2020-09-25 | 2021-01-22 | 河南理工大学 | Lead-free solder for sealing toughened vacuum glass in atmospheric environment and pressure brazing sealing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60203394A (en) * | 1984-03-29 | 1985-10-14 | Taruchin Kk | Corrosion resistant solder alloy |
| JPS61273296A (en) * | 1985-05-29 | 1986-12-03 | Taruchin Kk | Corrosion resistant solder alloy |
| JPS63112092A (en) * | 1986-10-29 | 1988-05-17 | Sony Corp | Low melting-point solder alloy |
| EP0363740A1 (en) * | 1988-10-11 | 1990-04-18 | KAWAKATSU, Ichiro | Low temperature melting solder alloys |
| EP0262580B1 (en) * | 1986-09-25 | 1993-11-24 | Kabushiki Kaisha Toshiba | Method of electrically bonding two objects |
| JPH06269984A (en) * | 1993-03-18 | 1994-09-27 | Ichiro Kawakatsu | Low melting solder alloy |
| CN103231180A (en) * | 2013-05-15 | 2013-08-07 | 郑州机械研究所 | Aluminum alloy low-temperature brazing solder and production method thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104690442A (en) * | 2015-03-17 | 2015-06-10 | 湖南新瑞化工有限公司 | Low-melting-point lead-free solder alloy and preparation method thereof |
-
2016
- 2016-06-06 CN CN201610397820.8A patent/CN105965172A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60203394A (en) * | 1984-03-29 | 1985-10-14 | Taruchin Kk | Corrosion resistant solder alloy |
| JPS61273296A (en) * | 1985-05-29 | 1986-12-03 | Taruchin Kk | Corrosion resistant solder alloy |
| EP0262580B1 (en) * | 1986-09-25 | 1993-11-24 | Kabushiki Kaisha Toshiba | Method of electrically bonding two objects |
| JPS63112092A (en) * | 1986-10-29 | 1988-05-17 | Sony Corp | Low melting-point solder alloy |
| EP0363740A1 (en) * | 1988-10-11 | 1990-04-18 | KAWAKATSU, Ichiro | Low temperature melting solder alloys |
| JPH06269984A (en) * | 1993-03-18 | 1994-09-27 | Ichiro Kawakatsu | Low melting solder alloy |
| CN103231180A (en) * | 2013-05-15 | 2013-08-07 | 郑州机械研究所 | Aluminum alloy low-temperature brazing solder and production method thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104690442A (en) * | 2015-03-17 | 2015-06-10 | 湖南新瑞化工有限公司 | Low-melting-point lead-free solder alloy and preparation method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312362A (en) * | 2016-10-31 | 2017-01-11 | 深圳市唯特偶新材料股份有限公司 | Low-temperature welding material for LED and preparation method thereof |
| CN106848817A (en) * | 2017-03-28 | 2017-06-13 | 王淑珍 | A kind of high-capacity optical fiber laser |
| CN111872595A (en) * | 2020-07-29 | 2020-11-03 | 昆山市宏嘉焊锡制造有限公司 | Low-temperature solder of Sn, in, Ag and Bi |
| CN111979434A (en) * | 2020-08-07 | 2020-11-24 | 广东先导稀材股份有限公司 | Preparation method of low-melting-point alloy |
| CN112247394A (en) * | 2020-09-25 | 2021-01-22 | 河南理工大学 | Lead-free solder for sealing toughened vacuum glass in atmospheric environment and pressure brazing sealing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105965172A (en) | Low temperature welding material | |
| CN103358051B (en) | A kind of copper base solder and preparation method thereof | |
| CN1895837B (en) | Sn-Cu-Cr lead-free soldering material and its preparation | |
| CN101716702B (en) | Multi-component alloy cadmium-free low-silver solder | |
| CN103028863B (en) | A kind of High-anti-oxidation lead-free solder | |
| CN100558499C (en) | A kind of manufacture method of cadmium-free silver brazing alloy | |
| CN106312362A (en) | Low-temperature welding material for LED and preparation method thereof | |
| CN103624415A (en) | Boron-containing stannum-based lead-free solder and manufacturing method thereof | |
| CN102152021A (en) | Lead-free solder for hot dipping of solar battery and preparation method thereof | |
| CN104339099A (en) | Medium-temperature solder containing copper and copper alloy | |
| CN1840282A (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN103934590A (en) | ZnAlMgIn high temperature lead-free solder | |
| CN108546846A (en) | A kind of photovoltaic welding belt low-melting point leadless brazing filler metal alloy and preparation method thereof | |
| CN108544122A (en) | A kind of photovoltaic welding belt Antioxidant Solder alloy and preparation method thereof | |
| CN100496861C (en) | A tin-zinc selenium alloy welding flux | |
| CN102500946A (en) | Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same | |
| CN112894191B (en) | Band-shaped brazing filler metal for lap brazing of copper plates and aluminum plates and preparation method thereof | |
| CN101342643B (en) | Oxidation resistant lead-free solder containing rare earth neodymium | |
| CN106312360A (en) | Low-temperature welding material and preparation method thereof | |
| CN108274148A (en) | A kind of photovoltaic welding belt tin-zinc-based leadless solder alloy and preparation method thereof | |
| CN101357421B (en) | Lead-free welding material | |
| CN1313240C (en) | Shape memory Co-Zn-Al alloy grains reinforced composite Sn-Ag welding material and its prepn process | |
| CN1401804A (en) | Low cost heat-resistant magnesium alloy | |
| CN103659042B (en) | Durable intermediate-temperature lead-free soldering tin bar and preparing method thereof | |
| CN107052614A (en) | Without silver yellow spelter solder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160928 |