CN106312360A - Low-temperature welding material and preparation method thereof - Google Patents
Low-temperature welding material and preparation method thereof Download PDFInfo
- Publication number
- CN106312360A CN106312360A CN201610867103.7A CN201610867103A CN106312360A CN 106312360 A CN106312360 A CN 106312360A CN 201610867103 A CN201610867103 A CN 201610867103A CN 106312360 A CN106312360 A CN 106312360A
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- Prior art keywords
- solder
- pure
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- content
- proportioning
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Abstract
The invention provides a low-temperature welding material and a preparation method thereof. The low-temperature welding material comprises, by weight percentage, 25-32% of Pb, 13-25% of In and the balance Sn. The preparation method comprises the following steps of 1, adding weighed pure Sn and pure Pb into a smelting furnace in proportion to be mixed with pure In, adding a proper amount of a smelting covering agent, then heating the materials to 250-300 DEG C to obtain a mixed solution of Sn, Pb and In, and preserving the temperature for 10-20 minutes; and 2, stirring the solution obtained in step 1 for 3-5 minutes, then removing the surface covering agent, and pouring the solution into a die, so that a low-temperature welding material ingot blank is obtained. The low-temperature welding material can meet the requirement that the temperature of an element is lower than 150 DEG C and is good in impact toughness.
Description
Technical field
The present invention relates to welding material, be specifically related to a kind of LED illumination industry assembling solder and preparation method thereof.
Background technology
At military industry field, some components and parts are due to its specific use, and it can not be high temperature resistant, when temperature is higher than 150 DEG C,
Components and parts are easily burned, and cause bad.When using tin cream as welding material, traditional SAC and tin-lead eutectic melt due to it
Point is too high and can not meet use requirement.Stannum bismuth eutectic (SnBi58) solder melt point is 138 DEG C, can meet welding temperature requirement,
But its solder joint is the most crisp, in use easily causes components and parts and come off, it is impossible to meet welding between components and parts with substrate and connect
The requirement of strength of head.Stannum indium eutectic (SnIn52) alloy melting point is suitable, plasticity good, but its intensity is compared relatively low, and rare element
In too high levels causes cost the highest, is not suitable for large-scale application.
The more solder of current application mainly has the ternary alloys such as Sn-Pb-Bi, Sn-Bi-In, but in view of such
The reliability of specific components requires and harsh use condition, all there is a lot of problems.Close as Sn-Pb-Bi alloy exists
Gold fragility and the contradiction of fusing point, when fusing point is relatively low, fragility is poor, and when fragility is good, fusing point is the most higher.
Summary of the invention
The present invention proposes a kind of solder, and this solder can not only meet the components and parts requirement less than 150 DEG C, and
And solder toughness is good, tensile strength reaches more than 40MPa.
The technical scheme is that and be achieved in that:
A kind of solder, including following components: Pb:25～32wt%, In:13～25wt%, remaining is Sn.
Further, including following components: Pb:25～28wt%, In:16～25wt%, remaining is Sn.
Further, Cd, Zn, P, Ge, Ga and one or more in RE are also included.The interpolation of the elements such as Cd, Zn is further
Improving binding ability and the postwelding fatigue resistance of solder, P, Ge, Ga, RE etc. add the antioxidation that can promote solder further
Property, and refine solder tissue, promote the reliability of postwelding product further.
Further, RE (rare earth element) is preferably La or Ce.
Further, the content of Cd is 0～2.0wt%, and the content of Zn is 0～4.0wt%, and the content of P is 0～0.5wt%,
The content of Ge is 0～0.5wt%, the content of Ga be the content of 0～0.5wt% Yu RE be 0～0.5wt%.
Further, the fusing point of this solder is 120～137 DEG C.
It is a further object to provide the preparation method of a kind of solder, comprise the following steps:
1) be proportionally added into weighing pure Sn in smelting furnace, pure Pb mixes with pure In, and adds appropriate melting coverture, so
Post-heating obtains Sn, Pb and In mixed molten liquid to 250～300 DEG C, is incubated 10～20min；
2) to step 1) obtain liquation and be stirred 3～5min, then remove surface dopant, be cast in mould and make
Solder ingot blank.
Further, solder ingot blank can be applied directly as solder, or make band, filament plate or roll sheet use；Also
Spherical alloy welding powder can be prepared as, as soldering paste base material 200～300 DEG C of fusings.
Further, described step 1) also include the preparation of intermediate alloy, intermediate alloy is joined Sn, Pb and mixes with In molten
In liquid, and in 250～300 DEG C of temperature 10～20min.
Further, intermediate alloy is one or more in PbCd, SnZn, SnP, SnGe and SnRE, and PbCd proportioning is
Pb83wt% and Cd17wt%, SnZn proportioning is Sn91wt% and Zn9wt%, and SnP proportioning is Sn95wt% and P5wt%, SnGe
Proportioning is Sn95wt% and Ge5wt%, and SnRE proportioning is Sn95wt% and RE5wt%.
Further, Pb-17Cd is the PbCd intermediate alloy of Pb83wt% Yu Cd17wt%, and Sn-9Zn is Sn91wt%
With the SnZn intermediate alloy of Zn9wt%, Sn-5P is the SnP intermediate alloy of Sn95wt% Yu P5wt%, and Sn-5Ge is
The SnGe intermediate alloy of Sn95wt% Yu Ge5wt%, Sn-5RE is the SnRE intermediate alloy of Sn95wt% Yu RE5wt%.
Beneficial effects of the present invention:
1, controlled by the Reasonable when preparation technology of tri-kinds of elements of Sn, Pb, In, it is to avoid unfavorable intermetallic compound
(IMC) thick form and the appearance of alloy internal oxidation so that it is while fusion temperature can be significantly reduced, do not increase solder
Melting range, and be capable of solution strengthening, refined crystalline strengthening and in-situ preparation IMC dispersion-strengtherning, three kinds of strengthening mechanisms common mutual
Effect makes the impact resistance of solder be substantially improved.It addition, this solder adds the In of more than 13%, make moulding of alloy
Deformation ability is greatly enhanced, and toughness improves, and meets the use requirement under mal-condition.
2, the internal oxidation during covering protection melting effectively prevent alloy melting and slagging scaling loss, it is ensured that alloy
Pure and composition accurate.Rare precious metal indium content only 13～25wt%, moderate cost, meet the cost of scale practical application
Requirement.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the scanning electron microscope macrograph of embodiment 1 solder.
Detailed description of the invention
Embodiment 1
Solder
Each component proportion is: be the Sn of 50%, the In of the Pb of 25% and 25% by mass percentage.
Its preparation process is as follows:
(1) in 200kg smelting furnace, add the 50kg weighed up pure Sn, 25kg pure Pb, 25kg pure In raw material, 100kg altogether,
Add the ZnCl of 100g2Melting coverture, is heated to 250 DEG C, and is incubated 20min；
(2) remove surface dopant after above-mentioned gained liquation being stirred 3min, be cast in mould and make eutectic welding
Material ingot blank, sees Fig. 1.
(3) on extruder, step (2) gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy weldering
Powder.
From Fig. 1, it can be seen that being dispersed with the most tiny precipitation strength phase in this solder even tissue, tissue, this is also
It it is such solder basic reason with higher-strength.
Embodiment 2
Solder
Each component proportion is: be the Sn of 56%, the In of the Pb of 28% and 16% by mass percentage.
Its preparation process is as follows:
(1) in 200kg smelting furnace, add the 56kg weighed up pure Sn, 28kg pure Pb, 16kg pure In raw material, 100kg altogether,
Add the ZnCl of 100g2Melting coverture, is heated to 250 DEG C, and is incubated 20min；
(2) remove surface dopant after above-mentioned gained liquation being stirred 5min, be cast in mould and make eutectic welding
Material ingot blank.
(3) on extruder, step (2) gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy weldering
Powder.
Embodiment 3
(1) mode of vacuum induction melting, Pb-17Cd intermediate alloy at melting preparation under the conditions of 400 DEG C are used；
(2) formula as listed by table 1, is sequentially added into smelting furnace according to pure Sn, pure Pb, the charging sequence of pure In and PbCd alloy
In, and add ZnCl2Coverture is heated to 300 DEG C in smelting furnace, is incubated 20min after fusing；
(3) removing surface dopant, watered by alloy melt and cast from mould, solidification obtains solder ingot blank.
(4) on extruder, step (3) gained ingot is squeezed into strip, thread or atomization be prepared as spherical alloy weldering
Powder.
Embodiment 4
Substantially the same manner as Example 3, difference be intermediate alloy be Sn-9Zn, pure Sn, pure Pb, pure In content are the most not
With.
Embodiment 5
Substantially the same manner as Example 3, difference be intermediate alloy be Sn-9Zn and Sn-5P, pure Sn, pure Pb, pure In contain
Measure different.
Embodiment 6
Substantially the same manner as Example 3, difference be intermediate alloy be Pb-17Cd, Sn-5Ge and Sn-5RE, pure Sn, pure
Pb, pure In content are different.
Embodiment 7
Substantially the same manner as Example 3, difference is intermediate alloy Sn-9Zn, Sn-5Ge and Sn-5RE, pure Sn, pure Pb,
Pure In content is different.
The table 1 embodiment 1-7 each component formula of low temperature content
| Embodiment | Sn | Pb | In | Cd | Zn | P | Ge | Ga | RE |
| 1 | 50 | 25 | 25 | / | / | / | / | / | / |
| 2 | 56 | 28 | 16 | / | / | / | / | / | / |
| 3 | 49.95 | 27 | 23 | 0.05 | / | / | / | / | |
| 4 | 51.95 | 25 | 23 | / | 0.05 | / | / | / | |
| 5 | 53.94 | 28 | 18 | / | 0.05 | 0.01 | / | / | / |
| 6 | 55.98 | 27 | 19 | 2 | / | / | 0.01/ | / | 0.01 |
| 7 | 47.5 | 26 | 22 | / | 4 | / | / | 0.2 | 0.3 |
Embodiment 8
By embodiment 1,2,3,5 and 6 solders obtained, compare with tradition main flow solder melt point and mechanical property, knot
Fruit is shown in Table 2.
The various solder melt point of table 2 and mechanical property
Find out that the solder of the present invention is in the comprehensive side such as fusion temperature, elongation percentage, tensile strength and yield strength from table 2 data
Face is assessed, and compares conventional solder and has advantage, and under ensureing its solderability premise, the tensile strength and the surrender that improve solder are strong
Degree, and the combination reliability of solder joint can be improved.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (9)
1. a solder, it is characterised in that include following components: Pb:25～32wt%, In:13～25wt%, remaining is
Sn。
Solder the most according to claim 1, it is characterised in that include following components: Pb:25～28wt%, In:16
～25wt%, remaining is Sn.
Solder the most according to claim 1 and 2, it is characterised in that also include Cd, Zn, P, Ge, Ga and in RE
Plant or multiple.
Solder the most according to claim 3, it is characterised in that the content of Cd is 0～2.0wt%, the content of Zn is 0
～the content of 4.0wt%, P is 0～0.5wt%, the content of Ge is 0～0.5wt%, and the content of Ga is 0～0.5wt% Yu RE
Content is 0～0.5wt%.
Solder the most according to claim 1 and 2, it is characterised in that the fusing point of this solder is 120～137 DEG C.
Solder the most according to claim 3, it is characterised in that the fusing point of this solder is 120～137 DEG C.
7. the preparation method of a solder as claimed in claim 1, it is characterised in that comprise the following steps:
1) be proportionally added into weighing pure Sn in smelting furnace, pure Pb mixes with pure In, and adds appropriate melting coverture, then adds
Heat obtains Sn, Pb and In mixed molten liquid to 250～300 DEG C, is incubated 10～20min；
2) to step 1) obtain liquation and be stirred 3～5min, then remove surface dopant, be cast in mould and make low temperature
Solder ingot blank.
The preparation method of solder the most according to claim 7, it is characterised in that described step 1) also include middle conjunction
The preparation of gold, joins intermediate alloy in Sn, Pb and In mixed molten liquid, and in 250～300 DEG C of temperature 10～20min.
The preparation method of solder the most according to claim 7, it is characterised in that intermediate alloy is PbCd, SnZn,
One or more in SnP, SnGe and SnRE, PbCd proportioning is Pb83wt% and Cd17wt%, and SnZn proportioning is
Sn91wt% and Zn9wt%, SnP proportioning is Sn95wt% and P5wt%, and SnGe proportioning is Sn95wt% and Ge5wt%, SnRE
Proportioning is Sn95wt% and RE5wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867103.7A CN106312360A (en) | 2016-09-28 | 2016-09-28 | Low-temperature welding material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610867103.7A CN106312360A (en) | 2016-09-28 | 2016-09-28 | Low-temperature welding material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106312360A true CN106312360A (en) | 2017-01-11 |
Family
ID=57821016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610867103.7A Pending CN106312360A (en) | 2016-09-28 | 2016-09-28 | Low-temperature welding material and preparation method thereof |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108971793A (en) * | 2018-08-24 | 2018-12-11 | 云南科威液态金属谷研发有限公司 | A kind of low-temperature lead-free solder |
| CN115041799A (en) * | 2022-05-25 | 2022-09-13 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
Citations (7)
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| JPS58218393A (en) * | 1982-06-11 | 1983-12-19 | Hitachi Ltd | Solder alloy |
| EP0363740A1 (en) * | 1988-10-11 | 1990-04-18 | KAWAKATSU, Ichiro | Low temperature melting solder alloys |
| US5871690A (en) * | 1997-09-29 | 1999-02-16 | Ford Motor Company | Low-temperature solder compositions |
| JP2000126890A (en) * | 1999-11-08 | 2000-05-09 | Matsushita Electric Ind Co Ltd | Soldering material |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
| CN105382443A (en) * | 2015-12-18 | 2016-03-09 | 黄河水电光伏产业技术有限公司 | Alloy welding flux, preparation method thereof and application thereof |
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2016
- 2016-09-28 CN CN201610867103.7A patent/CN106312360A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218393A (en) * | 1982-06-11 | 1983-12-19 | Hitachi Ltd | Solder alloy |
| EP0363740A1 (en) * | 1988-10-11 | 1990-04-18 | KAWAKATSU, Ichiro | Low temperature melting solder alloys |
| US5871690A (en) * | 1997-09-29 | 1999-02-16 | Ford Motor Company | Low-temperature solder compositions |
| JP2000126890A (en) * | 1999-11-08 | 2000-05-09 | Matsushita Electric Ind Co Ltd | Soldering material |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN104759783A (en) * | 2015-03-24 | 2015-07-08 | 广东工业大学 | Low-silver lead-free solder and preparation method thereof |
| CN105382443A (en) * | 2015-12-18 | 2016-03-09 | 黄河水电光伏产业技术有限公司 | Alloy welding flux, preparation method thereof and application thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108971793A (en) * | 2018-08-24 | 2018-12-11 | 云南科威液态金属谷研发有限公司 | A kind of low-temperature lead-free solder |
| CN115041799A (en) * | 2022-05-25 | 2022-09-13 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
| CN115041799B (en) * | 2022-05-25 | 2023-01-24 | 云南前沿液态金属研究院有限公司 | Alloy material for low-temperature welding of indium tin oxide film and welding method |
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Application publication date: 20170111 |