CN112453752A - Lead-free low-temperature tin-based alloy soldering lug - Google Patents
Lead-free low-temperature tin-based alloy soldering lug Download PDFInfo
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- CN112453752A CN112453752A CN202011366724.XA CN202011366724A CN112453752A CN 112453752 A CN112453752 A CN 112453752A CN 202011366724 A CN202011366724 A CN 202011366724A CN 112453752 A CN112453752 A CN 112453752A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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Abstract
The invention provides a lead-free low-temperature tin-based alloy soldering lug which comprises a high-temperature tin-based alloy layer in the middle, component gradient change metal layers positioned on two sides of the high-temperature tin-based alloy layer and a low-temperature alloy layer positioned on the outer side of the component gradient change metal layers. The peak temperature of the soldering lug reflow soldering is lower than the reflow soldering temperature of the high-temperature single alloy soldering lug, so that the low-temperature soldering requirement is met; meanwhile, the solidus temperature of the welding spot formed after welding is increased, and the high-temperature service use requirement is met. The soldering lug can be applied to the field of low-temperature soldering high-temperature service application or used for matching secondary low-temperature reflow and repair soldering processes.
Description
Technical Field
The invention relates to a lead-free low-temperature tin-based alloy soldering lug, belonging to the technical field of materials for electronic device welding.
Background
With the development of the microelectronic industry, the micro-spacing, three-dimensional and systematization of component assembly and the trend of soft, small, light, thin and multifunctional chips develop. The problems of poor welding defects such as HOP (Head-On-pilot) and NWO (Non-Contact Open) caused by overhigh temperature of the conventional tin-silver-copper (SAC) or tin-copper alloy solder are more and more prominent, and more rigorous requirements are provided for the assembly accuracy, heat dissipation and heat-resisting temperature of components. The soldering temperature of the common tin-based lead-free soldering material is usually above 220 ℃, and the soldering temperature is controlled below 220 ℃ under the conditions that the temperature resistance of devices is insufficient, multi-temperature graded soldering is needed, and temperature-sensitive materials such as radiators, Light Emitting Diodes (LEDs) and the like are soldered.
At present, the low-temperature solder mainly comprises Sn-Bi series and Sn-In series, and Sn58Bi is often used In the scene of low-temperature soldering requirement. However, Bi is also prone to cause a low melting point problem, resulting in poor interface reliability, and is prone to dendrite segregation and coarsening of the structure during solidification, and Bi is prone to aggregate and form at the interface during service to form a continuous brittle phase, which makes Sn-Bi solder not widely used. Because In is a rare and expensive metal, the Sn52In eutectic alloy has too low melting point and poor mechanical property, and is more applied to heat sensitive devices, fuses and the like, so that the application of Sn-In solder is limited.
Composite solder alloy preforms (CN 102883851B) are provided that are laminated composite preform foils for high temperature Pb-free soldering applications consisting of a high melting ductile metal or alloy core layer and a low melting solder coating layer on each side of the core layer. During soldering, the core metal, the liquid solder layer and the substrate metal react and consume the low melting point solder phase to form a high melting point intermetallic compound phase (IMC). The core layer is not completely consumed and the resulting solder joint consists of a ductile core layer sandwiched by IMC layers on the substrate side. A heat conducting gasket (CN 104582446B) with a composite structure is composed of a substrate made of pure metals such as In, Ag, Cu, In-3Ag, Sn or graphite sheets, metal alloys or nonmetal, and a structure compounded with trace low-temperature metals such as In, In-50Sn, Sn or In-20Bi on the surface. When the heat conduction gasket is used for the first time, the low-temperature metal is melted along with the temperature rise to the working temperature, the gap between the device and the heat conduction gasket is filled, the contact thermal resistance of the device and the heat conduction gasket is reduced, the liquid-state low-temperature metal is fused with the heat conduction gasket base body, and the liquid phase disappears. The structure enables the heat conduction gasket to have the advantages of excellent heat conductivity and melting point higher than the working temperature. Multilayer transient liquid phase bonding (CN 105448869 a) also provides a bonding structure composed of multiple layers of pure metal and diffusion barrier layers. The above mentioned patents are different from the present invention in the welding field, welding temperature range, and composition of welding spot (welding joint).
Disclosure of Invention
In order to solve the problems of poor interface reliability, lower service temperature and the like of a single low-temperature solder welding spot, the invention provides a lead-free low-temperature tin-based alloy soldering lug which is composed of a plurality of soldering lug layers into an integral body connected with each other, target alloy components, target alloy melting temperature, welding spot service temperature and the like can be designed according to the proportion of high/low-temperature alloy layers of the soldering lug, the low-temperature reflow soldering requirement is met, the multi-component solder alloying and soldering processes are fused, the remelting temperature of a formed new combined alloy welding spot is higher than the solidus temperature of the soldering lug, and the welding spot meets the use requirement of high-temperature service.
The lead-free low-temperature tin-based alloy soldering lug comprises a high-temperature tin-based alloy layer in the middle, component gradient change metal layers positioned on two sides of the high-temperature tin-based alloy layer and a low-temperature alloy layer positioned on the outer side of the component gradient change metal layers, wherein the low-temperature alloy layer is firstly melted and then is subjected to liquid-solid diffusion in the low-temperature reflux process of the lead-free low-temperature tin-based alloy soldering lug to melt the component gradient change metal layers and the high-temperature tin-based alloy layer, and finally the component gradient change metal layers and the high-temperature tin-based alloy layer are mixed into a new component alloy with a.
The high-temperature tin-based alloy layer is selected from one of Sn-3Ag-0.5Cu alloy, Sn-0.7Cu alloy, Sn-3Ag alloy and Sn-Ag-X alloy, wherein X is selected from Co, Zn, Ge, P, Ni, Ce, Nd and La.
The component gradient change metal layer is formed by solid-solid diffusion or/and solid-liquid diffusion between the low-temperature alloy layer and the high-temperature tin-based alloy layer in the soldering lug preparation process, and the layer is positioned between the low-temperature alloy layer and the high-temperature tin-based alloy layer and plays a role in connecting the low-temperature alloy layer and the high-temperature tin-based alloy layer to enable the soldering lugs to form a whole; the lead-free tin-based alloy soldering lug is prepared by one or two methods of mechanical rolling (cold rolling and hot rolling) and hot dipping; solid-solid diffusion in the soldering lug preparation process occurs in the mechanical rolling process, and solid-liquid diffusion occurs in the hot dip coating process.
The low-temperature alloy layer is selected from Sn-52In, Sn-58Bi and BiIn-X, wherein X is selected from Ge, Ga, Ce, Nd and La.
The high-temperature tin-based alloy layer accounts for 50-76% of the total volume of the soldering lug, and the metal layers on the two sides of the high-temperature tin-based alloy layer can be the same alloy or different alloys; the thickness of the metal layers on both sides of the high temperature tin-based alloy layer may be the same thickness or different thicknesses.
The solidus temperature of the high-temperature tin-based alloy layer is 175-260 ℃; the solidus temperature of the low-temperature alloy layer is 60-160 ℃, and the solidus temperature of the component gradient change metal layer is not more than 260 ℃.
The low-temperature reflow process of the lead-free low-temperature tin-based alloy soldering lug refers to the steps that the prepared lead-free low-temperature tin-based alloy soldering lug is punched or stamped into a sheet with a certain shape, soldering flux is coated on the sheet, the sheet is placed on a welding base material or a target welding position, reflow soldering is carried out through a reflow device according to a proper reflow curve to form a soldering point, the peak temperature of reflow soldering is not more than 220 ℃, a low-temperature alloy layer is melted firstly in the reflow process of the soldering lug, then a component gradient change metal layer and a high-temperature tin-based alloy layer are gradually melted through liquid-solid diffusion, and finally, a new component alloy with a melting point higher than; the solder bump reflow process is shown in fig. 1.
The welding spot is formed by welding the welding sheet and the welding base material through low-temperature reflow soldering.
The technical principle of the invention is that solid-solid diffusion and solid-liquid diffusion occur in the process of preparing a sandwich structure matrix from low-temperature tin-based alloy and high-temperature tin-based alloy to form a soldering lug whole body (figure 1, i) which is connected by multilayer alloy interconnection, in the reflow soldering process of the soldering lug and a soldering base material, when the temperature is higher than the melting point of the low-temperature alloy, the soldering lug is melted and has solid-liquid diffusion reaction with a component gradient alloy layer (figure 1, ii) due to the existence of the low-temperature alloy layer, the component gradient change metal layer is gradually melted, and after the temperature is further increased, the high-temperature tin-based alloy layer is also gradually melted and forms a soldering point with; at this time, the welding spot is not formed by a single high-temperature alloy layer component or a single low-temperature alloy layer component and a welding base material, but a new alloy welding spot is formed (figure 1, iii); under the condition of proper volume ratio of high/low temperature alloy layer, the soldering lug is melted and mixed to form new alloy, the solidus temperature of the new alloy is higher than that of the original soldering lug, and then the melting of low temperature phase is avoided when the temperature is raised, and on the premise of realizing welding temperature lower than that of single high temperature alloy, the welding spot formed by the soldering lug can serve at higher temperature than that of the welding spot formed by single low temperature alloy.
The invention has the beneficial effects that:
(1) the soldering lug is formed into an interconnected whole by a plurality of soldering lug layers, target alloy components, target alloy melting temperature, welding spot service temperature and the like can be designed according to the proportion of soldering lug high/low temperature alloy layers, the alloy fusion casting preparation process is reduced, the alloy preparation process and the welding process are simplified and fused, and the soldering lugs with different sizes and shapes can be processed and produced according to different requirements;
(2) the peak temperature of the soldering lug reflow soldering is not more than 220 ℃, and the requirement of low-temperature reflow soldering is met;
(3) the remelting temperature of a new combined alloy welding spot formed after the welding of the welding sheet is higher than the solidus temperature of the welding sheet, and the welding spot meets the use requirement of high-temperature service; the soldering lug can be applied to the field of low-temperature welding high-temperature service application or used for matching secondary low-temperature reflow and repair welding processes.
Drawings
FIG. 1 is a schematic view of a lead-free low temperature tin-based alloy solder bump reflow process;
FIG. 2 is a scanning electron microscope image of the solder piece of example 1, wherein the total thickness of the solder piece is 1.0 mm;
FIG. 3 is a distribution of alloy elements of the tab of example 1;
FIG. 4 is a DSC curve of the solder coupon of example 1;
FIG. 5 is a cross-sectional view (50X) of a solder joint formed by the solder tab of example 1;
FIG. 6 is a scanning electron microscope image of the solder piece of example 2, wherein the total thickness of the solder piece is 0.75 mm;
FIG. 7 is a DSC curve of the solder bump of example 2;
FIG. 8 is a scanning electron microscope image of the solder piece of example 3, wherein the total thickness of the solder piece is 0.75 mm;
FIG. 9 is a DSC curve of the solder bump of example 3;
FIG. 10 is a scanning electron microscope image of the solder piece of example 4, wherein the total thickness of the solder piece is 1.0 mm;
FIG. 11 is a DSC curve of the solder bump of example 4.
Detailed Description
The present invention is further illustrated by the following examples, but the scope of the invention is not limited to the above-described examples.
Example 1: the lead-free tin-based alloy soldering lug of the embodiment consists of five soldering lug layers, wherein each soldering lug layer comprises a middle high-temperature tin-based alloy layer, component gradient change metal layers positioned at two sides of the high-temperature tin-based alloy layer and low-temperature alloy layers positioned at two sides of the component gradient change metal layers, the middle high-temperature tin-based alloy layer is Sn-3Ag-0.5Cu, and the temperature of a solidus line of the middle high-temperature tin-based alloy layer is 218.2 ℃; the low-temperature alloy layer is Sn-52In eutectic alloy, and the solidus temperature of the low-temperature alloy layer is 120.1 ℃; the total thickness of the soldering lug is 1.0mm, and the structure is shown in figure 2; wherein the thickness of the high-temperature tin-based alloy layer is 685 mu m and accounts for 68.5 percent of the total volume of the soldering lug;
solid-solid diffusion occurs between the low-temperature Sn-52In eutectic alloy layer and the high-temperature Sn-3Ag-0.5Cu layer to form a component gradient change metal layer, and the distribution condition of alloy elements of the soldering lug is shown In figure 3;
the two-time DSC cycle curve of the soldering lug is shown in FIG. 4, the solidus temperature of the soldering lug during the primary melting is 117.9 ℃, the solidus temperature of the soldering lug during the secondary melting is 190.9 ℃, the secondary melting temperature is 73 ℃ higher than the primary melting temperature, compared with the single Sn-3Ag-0.5Cu alloy, the solidus temperature of the soldering lug is reduced by 100.3 ℃, after a welding spot is formed, the service temperature of the welding spot is increased by 70.8 ℃ compared with the welding spot formed by the single low-temperature Sn52In alloy (Table 1);
the soldering lug is formed by combining a Sn-3Ag-0.5Cu high-temperature tin-based alloy layer soldering material with the thickness of 1.50 mm and a Sn-52In low-temperature alloy layer soldering material with the thickness of 0.25mm arranged on the two sides of the soldering lug through multiple times of equidirectional rolling. Punching the prepared soldering lug into a round slice with the diameter of 2.0mm, coating a proper amount of soldering flux on the slice, placing the slice on a thin copper sheet and welding the slice to form a welding spot, wherein the peak welding temperature is 200 ℃; the soldering temperature was reduced by about 60 c compared to about 260 c for a single Sn-3Ag-0.5Cu alloy solder pad, resulting in a solder joint structure as shown in fig. 5.
Example 2: the lead-free tin-based alloy soldering lug consists of five soldering lug layers, wherein each soldering lug layer comprises a middle high-temperature tin-based alloy layer, component gradient change metal layers positioned at two sides of the high-temperature tin-based alloy layer and low-temperature alloy layers positioned at two sides of the component gradient change metal layers, the middle high-temperature tin-based alloy layer is Sn-3Ag-0.5Cu, and the temperature of a solidus line of the middle high-temperature tin-based alloy layer is 218.2 ℃; the low-temperature alloy layers on the two sides are Sn-52In eutectic alloy, and the solidus temperature of the eutectic alloy is 120.1 ℃; the total thickness of the soldering lug is 0.75mm, and the structure is shown in figure 6; wherein the thickness of the high-temperature tin-based alloy layer is 504 mu m and accounts for 67.2 percent of the total volume of the soldering lug;
the two-time DSC cycle curve of the soldering lug is shown In FIG. 7, the solidus temperature of the soldering lug during the primary melting is 117.4 ℃, the solidus temperature of the soldering lug during the secondary melting is 190.9 ℃, the secondary melting temperature is 73.5 ℃ higher than the primary melting temperature, compared with the single Sn-3Ag-0.5Cu alloy, the solidus temperature of the soldering lug is reduced by 100.8 ℃, and after a soldering point is formed, the service use temperature of the soldering point is increased by 70.8 ℃ compared with the soldering point formed by the single low-temperature Sn-52In alloy (Table 1);
the soldering lug is formed by combining a Sn-3Ag-0.5Cu high-temperature tin-based alloy layer soldering material with the thickness of 1.50 mm and a Sn-52In low-temperature alloy layer soldering material with the thickness of 0.25mm arranged on the two sides of the soldering lug through multiple times of equidirectional rolling. Punching the prepared soldering lug into a round slice with the diameter of 2.0mm, coating a proper amount of soldering flux on the slice, placing the slice on a thin copper sheet and welding the slice to form a welding spot, wherein the peak welding temperature is 200 ℃; the soldering temperature is reduced by about 60 ℃ compared to a single Sn-3Ag-0.5Cu alloy solder pad by about 260 ℃.
Example 3: the lead-free tin-based alloy soldering lug consists of five soldering lug layers, wherein each soldering lug layer comprises a middle high-temperature tin-based alloy layer, component gradient change metal layers positioned at two sides of the high-temperature tin-based alloy layer and low-temperature alloy layers positioned at two sides of the component gradient change metal layers, the middle high-temperature tin-based alloy layer is Sn-0.7Cu, and the solidus temperature of the middle high-temperature tin-based alloy layer is 227.9 ℃; the low-temperature alloy layers on the two sides are Sn-52In eutectic alloy, and the solidus temperature of the eutectic alloy is 120.1 ℃; the total thickness of the soldering lug is 0.75mm, and the structure is shown in figure 8; the thickness of the high-temperature tin-based alloy layer is 409 mu m and accounts for 54.5% of the total volume of the soldering lug;
the two-time DSC cycle curve of the soldering lug is shown In FIG. 9, the solidus temperature of the soldering lug during the primary melting is 119.8 ℃, the solidus temperature of the soldering lug during the secondary melting is 187.3 ℃, the secondary melting temperature is higher than the primary melting temperature by 67.5 ℃, compared with the single Sn-0.7Cu alloy, the solidus temperature of the soldering lug is reduced by 108.1 ℃, and after a welding spot is formed, the service use temperature of the welding spot is increased by 67.2 ℃ compared with the welding spot formed by the single low-temperature Sn-52In alloy (Table 1);
the soldering lug is formed by combining a Sn-0.7Cu high-temperature tin-based alloy layer soldering material with the thickness of 1.00mm and a Sn-52In low-temperature alloy layer soldering material with the thickness of 0.25mm arranged on the two sides of the soldering lug through multiple times of same-direction rolling. The prepared soldering lug is punched into a round sheet with the diameter of 2.0mm, a proper amount of soldering flux is coated on the sheet, the sheet is placed on a thin copper sheet and soldered to form a soldering point, and the soldering peak temperature is 210 ℃, and the soldering temperature is reduced by about 50 ℃ compared with that of a single Sn-0.7Cu alloy soldering lug at about 260 ℃.
Example 4: the lead-free tin-based alloy soldering lug consists of five soldering lug layers, wherein each soldering lug layer comprises a middle high-temperature tin-based alloy layer, component gradient change metal layers positioned at two sides of the high-temperature tin-based alloy layer and low-temperature alloy layers positioned at two sides of the component gradient change metal layers, the middle high-temperature tin-based alloy layer is Sn-0.7Cu, and the solidus temperature of the middle high-temperature tin-based alloy layer is 227.9 ℃; the low-temperature alloy layers on the two sides are Sn-52In eutectic alloy, and the solidus temperature of the eutectic alloy is 120.1 ℃; the total thickness of the soldering lug is 1.0mm, and the structure is shown in figure 10; wherein the thickness of the high-temperature tin-based alloy layer of the soldering lug is 646 mu m and accounts for 64.6 percent of the total volume of the soldering lug;
the two-time DSC cycle curve of the soldering lug is shown In FIG. 11, the solidus temperature of the soldering lug during the primary melting is 118.9 ℃, the solidus temperature of the soldering lug during the secondary melting is 205.5 ℃, the secondary melting temperature is higher than the primary melting temperature by 86.6 ℃, compared with the single Sn-0.7Cu alloy, the solidus temperature of the soldering lug is reduced by 110.4 ℃, and after a welding spot is formed, the service use temperature of the welding spot is increased by 85.4 ℃ compared with the welding spot formed by the single low-temperature Sn-52In alloy (Table 1);
the soldering lug is formed by combining a Sn-0.7Cu high-temperature tin-based alloy layer soldering material with the thickness of 1.00mm and a Sn-52In low-temperature alloy layer soldering material with the thickness of 0.10mm arranged on the two sides of the soldering lug through multiple times of same-direction rolling. Punching the prepared soldering lug into a round slice with the diameter of 2.0mm, coating a proper amount of soldering flux on the slice, placing the slice on a thin copper sheet and welding the slice to form a welding spot, wherein the welding peak temperature is 220 ℃; the soldering temperature is reduced by about 40 ℃ compared to a single Sn-0.7Cu alloy solder pad by about 260 ℃.
Example 5: sn52In solder bump, 1mm thick, with a solidus temperature of 120.1 deg.C and a reflow temperature of 150 deg.C, the solder bump solidus temperature did not increase after reflow (Table 1).
Example 6: Sn3.0Ag0.5Cu soldering lug with the thickness of 1mm, the solidus temperature of 218.2 ℃, the reflux temperature of 260 ℃, and the solder joint temperature after the soldering lug reflows is unchanged; after reflow on a copper substrate, the content of Cu element in the sn3.0ag0.5cu tab is high (0.5 wt.%) due to the short reflow time of the solder because the diffusion of Cu element enters the solder; the diffusion rate of the Sn-Cu interface reaction through the forming compound is slow, Cu of the copper substrate enters the solder less, and thus the solidus temperature of the solder joint hardly changes (table 1).
Table 1 statistical table of soldering lug examples
Claims (7)
1. A lead-free low-temperature tin-based alloy soldering lug is characterized in that: the lead-free low-temperature tin-based alloy soldering lug is characterized by comprising a high-temperature tin-based alloy layer in the middle, component gradient change metal layers positioned on two sides of the high-temperature tin-based alloy layer and a low-temperature alloy layer positioned on the outer side of the component gradient change metal layers, wherein the low-temperature alloy layer is firstly melted and then is subjected to liquid-solid diffusion in the low-temperature reflow process of the lead-free low-temperature tin-based alloy soldering lug to melt the component gradient change metal layers and the high-temperature tin-based alloy layer, and finally the component gradient change metal layers and the high-temperature tin-based alloy.
2. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the high-temperature tin-based alloy layer is selected from one of Sn-3Ag-0.5Cu alloy, Sn-0.7Cu alloy, Sn-3Ag alloy and Sn-Ag-X alloy, wherein X is selected from Co, Zn, Ge, P, Ni, Ce, Nd and La.
3. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the component gradient change metal layer is formed by solid-solid diffusion and/or solid-liquid diffusion between the low-temperature alloy layer and the high-temperature tin-based alloy layer in the process of preparing the soldering lug, and the soldering lug is prepared by adopting a mechanical rolling and/or hot dipping method.
4. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the low-temperature alloy layer is selected from Sn-52In, Sn-58Bi and BiIn-X, wherein X is selected from Ge, Ga, Ce, Nd and La.
5. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the solidus temperature of the high-temperature tin-based alloy layer is 175-260 ℃; the solidus temperature of the low-temperature alloy layer is 60-160 ℃, and the solidus temperature of the component gradient change metal layer is not more than 260 ℃.
6. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the high-temperature tin-based alloy layer accounts for 50% -76% of the total volume of the soldering lug.
7. The lead-free low temperature tin-based alloy solder tab of claim 1, wherein: the low-temperature reflow process refers to that the prepared lead-free low-temperature tin-based alloy soldering lug is punched or stamped into a sheet with a certain shape, soldering flux is coated on the sheet, the sheet is placed on a soldering base material or a target soldering position, reflow soldering is carried out through a reflow device according to a proper reflow curve to form a soldering point, and the peak temperature of the reflow soldering is not more than 220 ℃.
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| CN113182727A (en) * | 2021-04-08 | 2021-07-30 | 北京科技大学 | Chlorine ion corrosion resistant Sn-Ag-Cu-Nd lead-free solder alloy and preparation method thereof |
| CN114918574A (en) * | 2022-06-21 | 2022-08-19 | 浙江亚通焊材有限公司 | Tin-based composite solder and preparation method thereof |
| CN115041863A (en) * | 2022-06-22 | 2022-09-13 | 浙江亚通焊材有限公司 | Composite brazing filler metal for automobile glass and preparation method and application thereof |
| CN115302123A (en) * | 2022-08-29 | 2022-11-08 | 大连理工大学 | High-reliability composite brazing filler metal sheet capable of being welded at low temperature, preparation method and application thereof |
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