CN1887501A - No-lead soft brazing alloy - Google Patents
No-lead soft brazing alloy Download PDFInfo
- Publication number
- CN1887501A CN1887501A CN 200610089715 CN200610089715A CN1887501A CN 1887501 A CN1887501 A CN 1887501A CN 200610089715 CN200610089715 CN 200610089715 CN 200610089715 A CN200610089715 A CN 200610089715A CN 1887501 A CN1887501 A CN 1887501A
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- Prior art keywords
- brazing alloy
- lead soft
- lead
- soft brazing
- present
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The present invention relates to one kind of no-lead soft brazing alloy, and features that the no-lead soft brazing alloy consists of Zn 20-47 wt%, Bi 1-15 wt% and Sn for the rest. The present invention has the advantages of high smelting point and high soldering performance, and is suitable for secondary soldering of circuit board.
Description
Technical field
The present invention relates to a kind of no-lead soft soldering, particularly a kind of no-lead soft soldering that can be used for the wiring board secondary welding belongs to welding material.
Background technology
The wiring board secondary welding is meant in the circuit board welds after the fraction part earlier for the first time, insert for the second time again that other part carries out wave-soldering or by carrying out Reflow Soldering behind the SMT paster, must guarantee that when welding for the second time pad does not melt for the first time, part can not drop, therefore the requirement scolder fusing point first time will be higher than scolder fusing point for the second time, and its fusing point should be greater than 270 ℃.During existing wiring board secondary welding, high plumbous low tin solder is adopted in welding for the first time, as Sn85～95Pb scolder, its fusing point is about more than 314 ℃, but this high plumbous low tin solder is the poisonous and harmful substance of harm humans health and contaminated environment, therefore needs a kind of lead-free high-temperature solder to replace traditional high plumbous low tin solder to satisfy the needs of wiring board secondary welding.
Summary of the invention
Purpose of the present invention provides a kind of no-lead soft soldering for wiring board secondary welding needs for the shortcoming that overcomes above-mentioned prior art existence just with deficiency, thereby makes the unleaded of electronic product.
The objective of the invention is to realize by following technical proposal:
No-lead soft soldering is characterized in that it is made up of following weight percentages:
Zn 20～47%, Bi 1～15% and surplus Sn.
Its fine melt point of SnZnBi lead-free solder of the present invention is more than 300-350 ℃, and it can connect weldering property, good fluidity, satisfies the demand of wiring board secondary welding.
Formulation of series products of the present invention is smelted by traditional method, and the purity of each raw material of selecting for use: Sn is 99.5%, Zn 〉=99.5%, and Bi 〉=99.5% can be made into soldering paste and tin bar product.
Product of the present invention is through detecting, and its main performance is as follows:
1, fusing point sees Table 1
Table 1 fusing point testing result
| Product | Sn25Zn10Bi | Sn30Zn12Bi | Sn35Zn15Bi |
| Fusing point (℃) | 305 | 328 | 350 |
2, weldability sees Table 2
Table 2 weldability testing result
| Product | Sn25Zn10Bi | Sn30Zn12Bi | Sn35Zn15Bi |
| Weldability | Well | Good | Good |
Have fusing point height, good welding performance from above-mentioned comparative result product of the present invention as can be seen, be suitable for the advantage and the effect of wiring board secondary welding.
The specific embodiment
Embodiment
| Embodiment | Raw material components consumption (Kg) | ||
| Sn | Zn | Bi | |
| 1 | 79 | 20 | 1 |
| 2 | 50 | 35 | 15 |
| 3 | 45 | 47 | 8 |
| 4 | 65 | 25 | 10 |
| 5 | 58 | 30 | 12 |
| 6 | 55 | 40 | 5 |
Claims (1)
1, a kind of no-lead soft soldering is characterized in that it is made up of the following weight percentages component:
Zn 20～47%, Bi 1～15% and surplus Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100897154A CN100453246C (en) | 2006-07-13 | 2006-07-13 | No-lead soft brazing alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100897154A CN100453246C (en) | 2006-07-13 | 2006-07-13 | No-lead soft brazing alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1887501A true CN1887501A (en) | 2007-01-03 |
| CN100453246C CN100453246C (en) | 2009-01-21 |
Family
ID=37576783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100897154A Expired - Fee Related CN100453246C (en) | 2006-07-13 | 2006-07-13 | No-lead soft brazing alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100453246C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103737195A (en) * | 2013-12-30 | 2014-04-23 | 大连理工大学 | Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper |
| CN106975860A (en) * | 2017-03-22 | 2017-07-25 | 合肥仁德电子科技有限公司 | A kind of circuit board tin cream and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5594455A (en) * | 1979-09-03 | 1980-07-17 | Nippon Cable Syst Inc | Solder alloy |
| JPS5711793A (en) * | 1980-06-26 | 1982-01-21 | Dainichi Nippon Cables Ltd | Solder for aluminium |
| JPS59189096A (en) * | 1983-04-08 | 1984-10-26 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
| JP3232963B2 (en) * | 1994-10-11 | 2001-11-26 | 株式会社日立製作所 | Lead-free solder for connecting organic substrates and mounted products using the same |
| JPH0985484A (en) * | 1995-09-20 | 1997-03-31 | Hitachi Ltd | Lead-free solder and packaging method using the same and packaged articles |
| JP4138965B2 (en) * | 1998-10-01 | 2008-08-27 | 三井金属鉱業株式会社 | Lead-free solder powder and manufacturing method thereof |
| US6503338B1 (en) * | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
-
2006
- 2006-07-13 CN CNB2006100897154A patent/CN100453246C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103737195A (en) * | 2013-12-30 | 2014-04-23 | 大连理工大学 | Sn-Zn-Bi-base lead-free solder alloy for soft soldering of aluminum and copper |
| CN106975860A (en) * | 2017-03-22 | 2017-07-25 | 合肥仁德电子科技有限公司 | A kind of circuit board tin cream and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100453246C (en) | 2009-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090121 Termination date: 20160713 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |