JPS5711793A - Solder for aluminium - Google Patents
Solder for aluminiumInfo
- Publication number
- JPS5711793A JPS5711793A JP8762780A JP8762780A JPS5711793A JP S5711793 A JPS5711793 A JP S5711793A JP 8762780 A JP8762780 A JP 8762780A JP 8762780 A JP8762780 A JP 8762780A JP S5711793 A JPS5711793 A JP S5711793A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- aluminium
- blending
- plumbing
- balance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
PURPOSE:To obtain low melting point, highly corrosion resistant solder for aluminium that enables plumbing by blending 5-10% Zn, 8-13% Bi the rest Sn. CONSTITUTION:Solder is formed by blending 5-10%, preferably 7-9% Zn, 8- 13%, preferably 8-12% Bi, and the balance being Sn. By this way, low-melting point solder for aluminium excellent in corrosion resistance is obtained. To further improve corrosion resistance, solder is formed by blending 5-10%, preferably 7- 9% Zn, 5-13%, preferably 6-8% Bi, 2-5%, preferably 2.5-4% Sb and the balance being Sn. The solder obtained can be used for solder plating in case of sheath plumbing of aluminium sheath OF cable that uses plastic synthetic paper etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8762780A JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8762780A JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5711793A true JPS5711793A (en) | 1982-01-21 |
JPS6235876B2 JPS6235876B2 (en) | 1987-08-04 |
Family
ID=13920209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8762780A Granted JPS5711793A (en) | 1980-06-26 | 1980-06-26 | Solder for aluminium |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5711793A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189096A (en) * | 1983-04-08 | 1984-10-26 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
CN1067929C (en) * | 1994-10-11 | 2001-07-04 | 株式会社日立制作所 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
US6503338B1 (en) | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
JP2003002427A (en) * | 2001-06-18 | 2003-01-08 | Tokyo Autom Mach Works Ltd | Article supplying device |
US6853077B2 (en) | 2001-10-01 | 2005-02-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same |
CN100453246C (en) * | 2006-07-13 | 2009-01-21 | 昆山成利焊锡制造有限公司 | No-lead soft brazing alloy |
CN102152022A (en) * | 2011-04-18 | 2011-08-17 | 宁波喜汉锡焊料有限公司 | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06219089A (en) * | 1993-02-15 | 1994-08-09 | Hiroshi Sano | Paper-clipping apparatus |
US6361626B1 (en) * | 2000-10-24 | 2002-03-26 | Fujitsu Limited | Solder alloy and soldered bond |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5255927U (en) * | 1975-10-13 | 1977-04-22 |
-
1980
- 1980-06-26 JP JP8762780A patent/JPS5711793A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5255927U (en) * | 1975-10-13 | 1977-04-22 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189096A (en) * | 1983-04-08 | 1984-10-26 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
JPH0328274B2 (en) * | 1983-04-08 | 1991-04-18 | Senju Kinzoku Kogyo Kk | |
CN1067929C (en) * | 1994-10-11 | 2001-07-04 | 株式会社日立制作所 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same |
US6503338B1 (en) | 2000-04-28 | 2003-01-07 | Senju Metal Industry Co., Ltd. | Lead-free solder alloys |
JP2003002427A (en) * | 2001-06-18 | 2003-01-08 | Tokyo Autom Mach Works Ltd | Article supplying device |
US6853077B2 (en) | 2001-10-01 | 2005-02-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same |
CN100453246C (en) * | 2006-07-13 | 2009-01-21 | 昆山成利焊锡制造有限公司 | No-lead soft brazing alloy |
CN102152022A (en) * | 2011-04-18 | 2011-08-17 | 宁波喜汉锡焊料有限公司 | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance |
Also Published As
Publication number | Publication date |
---|---|
JPS6235876B2 (en) | 1987-08-04 |
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