JPS57121896A - Solder alloy - Google Patents

Solder alloy

Info

Publication number
JPS57121896A
JPS57121896A JP632881A JP632881A JPS57121896A JP S57121896 A JPS57121896 A JP S57121896A JP 632881 A JP632881 A JP 632881A JP 632881 A JP632881 A JP 632881A JP S57121896 A JPS57121896 A JP S57121896A
Authority
JP
Japan
Prior art keywords
solder
alloy
workability
wettability
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP632881A
Other languages
Japanese (ja)
Other versions
JPS6350118B2 (en
Inventor
Narutoshi Taguchi
Rikiya Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP632881A priority Critical patent/JPS57121896A/en
Publication of JPS57121896A publication Critical patent/JPS57121896A/en
Publication of JPS6350118B2 publication Critical patent/JPS6350118B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Abstract

PURPOSE:To obtain a solder alloy for an inexpensive wire solder contg. resin of good quality and workability by adding Bi to an Sn-Pb-Sb type alloy, and selecting the ratios of respective components adequately. CONSTITUTION:If Sn is <=25wt%, the wettability of the solder degrades, and the components such as Pb increase correspondingly, resulting in higher liquidus line temp. If >=45%, the improvement in the wettability of the solder cannot be expected in relation to an increased cost. With <0.5% Sb, the effect of improving strength and gloss is not provided and at >=3%, the solderability is adversely affected. When Bi is added to the Sn-Pb-Sb alloy, it improves solder workability by lowering liquidus line and solidus line, but at <=1%, it is ineffective, and at >=5%, the solidus line lowers too much, thereby degrading workability and making the alloy brittle. As the adequate composition range, the alloy consisting of 25-45wt% Sn, 0.5-3% Sb, 1-5% Bi and the balance Pb is obtained.
JP632881A 1981-01-21 1981-01-21 Solder alloy Granted JPS57121896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP632881A JPS57121896A (en) 1981-01-21 1981-01-21 Solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP632881A JPS57121896A (en) 1981-01-21 1981-01-21 Solder alloy

Publications (2)

Publication Number Publication Date
JPS57121896A true JPS57121896A (en) 1982-07-29
JPS6350118B2 JPS6350118B2 (en) 1988-10-06

Family

ID=11635292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP632881A Granted JPS57121896A (en) 1981-01-21 1981-01-21 Solder alloy

Country Status (1)

Country Link
JP (1) JPS57121896A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514029A1 (en) * 1981-10-02 1983-04-08 Frys Metals Ltd IMPROVED WELDING ALLOY
JPS59153857A (en) * 1983-02-21 1984-09-01 Taruchin Kk Alloy for forming joint
JPS60141396A (en) * 1983-12-29 1985-07-26 Hitachi Ltd Low-temperature solder alloy
CN1055881C (en) * 1997-12-12 2000-08-30 北京有色金属研究总院 Lead-base alloy powder used as solder for welding microphone head and its preparation process
CN103212918A (en) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 Lead-free solder mixture capable of assisting in soldering

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514046A (en) * 1974-07-01 1976-01-13 Nippon Sheet Glass Co Ltd GARASUROZUKE HOANDA
JPS51111450A (en) * 1975-03-26 1976-10-01 Nissan Motor Solswe for building up
JPS5538615A (en) * 1978-09-05 1980-03-18 Sony Corp Magnetic recording and reproducing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514046A (en) * 1974-07-01 1976-01-13 Nippon Sheet Glass Co Ltd GARASUROZUKE HOANDA
JPS51111450A (en) * 1975-03-26 1976-10-01 Nissan Motor Solswe for building up
JPS5538615A (en) * 1978-09-05 1980-03-18 Sony Corp Magnetic recording and reproducing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2514029A1 (en) * 1981-10-02 1983-04-08 Frys Metals Ltd IMPROVED WELDING ALLOY
JPS59153857A (en) * 1983-02-21 1984-09-01 Taruchin Kk Alloy for forming joint
JPS60141396A (en) * 1983-12-29 1985-07-26 Hitachi Ltd Low-temperature solder alloy
CN1055881C (en) * 1997-12-12 2000-08-30 北京有色金属研究总院 Lead-base alloy powder used as solder for welding microphone head and its preparation process
CN103212918A (en) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 Lead-free solder mixture capable of assisting in soldering

Also Published As

Publication number Publication date
JPS6350118B2 (en) 1988-10-06

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