CN1055881C - Lead-base alloy powder used as solder for welding microphone head and its preparation process - Google Patents
Lead-base alloy powder used as solder for welding microphone head and its preparation process Download PDFInfo
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- CN1055881C CN1055881C CN97120351A CN97120351A CN1055881C CN 1055881 C CN1055881 C CN 1055881C CN 97120351 A CN97120351 A CN 97120351A CN 97120351 A CN97120351 A CN 97120351A CN 1055881 C CN1055881 C CN 1055881C
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Abstract
The present invention relates to a solder plumbum-base alloy powder and a preparation method thereof. The solder lead-base alloy has the components of 26 to 34% of Sn, 0.3 to 0.8% of Sb and residual Pb. Ingredients of Sn, Pb, Sb are weighed; the ingredients are melted under inert gas atmosphere and 350 to 500 DEG C, and cast into prealloying ingots. The prealloying ingots are melted under the protection of the inert gas atmosphere and the 400 to 500 DEG C, inert gas is used as atomizing steam for carrying out atomization, and the atomizing pressure is from 1.5 to 3.0MPa. the alloy powder with high melting point and high binding strength can be used for matching soldering flux into soft soldering paste for soldering. The alloy powder manufactured by the method has the advantages of uniformity and small grain diameters.
Description
The present invention relates to the lead base soldering alloyed metal powder, a kind of soldering of more specifically saying so is with soldering alloyed metal powder and preparation method thereof, especially for microphone head soldering lead base soldering alloyed metal powder and preparation method thereof.
Most of microphone heads adopt 45
#Steel or copper material manufacturing.The brazing filler metal alloy that is used for the soldering microphone head is more, but generally all exists the higher characteristics of welding temperature, and traditional lead-containing alloy solder fusing point is lower, only is suitable for the not high parts of low-temperature welding requirement of strength.The soldering of microphone head is by adopting traditional lead-containing alloy, and its composition (percentage meter by weight) is Pb 60～65%, and Sn 35～40%.This lead-containing alloy solder exists some shortcomings: first solidus and liquidus curve are little at interval, and good fluidity drops down tin easily during microphone head soldering and sealing, pollute microphone head, bring difficulty for follow-up electroplating technology; It two is that the microphone head intensity of soldering and sealing is low; It three is to adopt manual welding, operating difficulties, and production efficiency is low.
Chinese patent literature CN87105076A has proposed the lead-base alloy solder that a kind of soldering that is used to do communication lead jacket cable joint is used.Percentage meter by weight, its composition is 15～25%Sn, 8～17%Cd, 0.2～2%Sb, surplus is Pb.Make the ingot casting of different shape, for example block.This scolder is owing to contain poisonous element cadmium, insulting health, and cause pollution to environment.
Chinese patent literature CN1104950A has proposed a kind of high kupper solder of low tin that is used for technical field welding usefulness such as power industry, instrument and meter, and filling a prescription is plumbous 45-80%, tin 15-45%, bismuth 3-10%, antimony 1-5%, this scolder has been saved tin raw material, has reduced the cost of scolder.But, also be to make welding wire to be used for welding, do not make soldering alloyed metal powder, still existing needs weldering by hand, operating difficulties, the shortcoming that production efficiency is low.
Purpose of the present invention just is to develop a kind of new higher soldering of fusing point lead base soldering alloyed metal powder, particularly is used for the soldering alloyed metal powder that microphone head soldering and sealing is used in conjunction with the characteristics of microphone head soldering and sealing and specification requirement a kind of.
Another object of the present invention is to work out to produce the preparation method of the higher soldering of above-mentioned a kind of new fusing point with the lead base soldering alloyed metal powder, the preparation method of the soldering alloyed metal powder that a kind of new fusing point of using especially for the microphone head soldering is higher.
A kind of soldering alloyed metal powder that is used for microphone head soldering and sealing of the present invention, percentage meter by weight, its alloying component is a tin 26～34, antimony 0.3～0.8, surplus is plumbous.
A kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of the present invention; percentage meter by weight; alloying component is Sn 26～34, and Sb 0.3～0.8, and surplus is Pb; take by weighing tin, lead, antimony batching; under the protection of inert gas atmosphere under 350-500 ℃ temperature, will prepare burden the fusing after, be that atomization gas atomizes with the inert gas; the pressure of atomizing is 1.5-3.0MPa, produces soldering solder lead-base alloy powder
Under the protection of intermediate frequency furnace at inert gas atmosphere in the 350-500 ℃ of fusing of will preparing burden earlier, be cast into the prealloy ingot after, again the prealloy ingot is atomized to well in 350-500 ℃ of fusing under the protection of inert atmosphere.
Melted 15-40 minute under the protection of inert gas atmosphere, will prepare burden again, be cast into the prealloy ingot again and be advisable in 350-500 ℃ temperature with intermediate frequency furnace.Said inert gas is wherein a kind of of nitrogen, argon gas, and the pressure of inert nitrogen gas, argon gas a kind of gas wherein is 0.09-0.1Mpa.The prealloy ingot is melted; the prealloy ingot is under the vacuum state of 13.3-1.33pa; charge into inert nitrogen gas, argon gas a kind of inert gas wherein again; under the protection of inert nitrogen gas, argon gas a kind of atmosphere wherein under 350-500 ℃ temperature; with the fusing of prealloy ingot, the pressure of the inert gas that the inert nitrogen gas that is charged into, argon gas are wherein a kind of is 0.09～0.1Mpa.After making the fusing of prealloy ingot, be that atomization gas atomizes with the inert gas, inert nitrogen gas, argon gas a kind of gas wherein is atomization gas during atomizing, and atomizing pressure is 1.5-3.0MPa, and makes soldering solder lead-base alloy powder.
Soldering is seen Fig. 1 with the technological process of solder lead-base alloy powder, and the gas atomization fundamental diagram is seen Fig. 2.After the prealloy ingot melted in intermediate frequency furnace 7, it is forwarded in the tundish 8, enter inert nitrogen gas or the argon gas that pipe 10 enters 1.5-3.0MPa from gases at high pressure, make the prealloy that has melted form powder 11, collect alloy powder in gatherer 12.
Advantage of the present invention just is:
1. the fusing point of the solder lead-base alloy powder that soldering of the present invention is used is higher, be 183-245 ℃, has high bond strength again, with low cost, be prepared into alloy powder by atomizing, be fit to fit in soft pricker cream and weld with scaling powder, especially make microphone head carry out Reflow Soldering, soldering processes are simplified, improved welding quality and labor productivity, and can be follow-up electroplating technology and bring convenience.
2. soldering of the present invention owing to carried out the preparation of prealloy ingot, has improved the uniformity of each alloying elements distribution with the preparation method of solder lead-base alloy powder, adopt the gas atomization rapid condensation, make the alloy powder composition even, particle diameter is little, has improved the brazing property of alloy
Fig. 1 produces the process chart of the solder lead-containing alloy powder that soldering uses
Among the figure, 1 is batching, and 2 is the preparation of prealloy ingot, and 3 for vacuumizing, and charges into the inert gas of protection, and 4 for to melt the prealloy ingot, and 5 are gas atomization, and 6 for making the solder lead-containing alloy powder that soldering is used.
Fig. 2 gas atomization fundamental diagram
Among the figure, 7 is intermediate frequency furnace, and 8 is tundish, and 9 is the working chamber, 10 the pipes that enter for high-pressure inert gas nitrogen or argon gas, and 11 is soldering solder lead-containing alloy powder, 12 is soldering solder lead-containing alloy powder gatherer.
X-ray method (XRD) the facies analysis collection of illustrative plates of Fig. 3 embodiment 1 outturn sample (Sn28Pb71.5Sb0.5)
Among the figure, ordinate is a per second counting (CPS), and abscissa is the θ angle
ESEM (SEM) the pattern photo of the outturn sample of Fig. 4 embodiment 1 (Sn28Pb71.5Sb0.5)
Below the present invention is further illustrated with embodiment, will help the preparation method and the advantage thereof of product of the present invention and product are done further to understand.The present invention is not subjected to the qualification of these embodiment, and protection scope of the present invention is decided by claims.
Embodiment 1
A kind of lead-base alloy powder used as solder for welding in the present embodiment, percentage meter by weight, its alloyed powder food ingredient is Sn 28, Pb 71.5 Sb 0.5
Take by weighing the Sn of purity 99.9% (purity is better more than 99.9%); Pb; the Sb batching; will prepare burden under the protection of inert nitrogen gas atmosphere under 470 ℃ the temperature with intermediate frequency furnace with its fusing 25 minutes after; the pressure of inert gas nitrogen is 0.1Mpa; be cast into the prealloy ingot; the prealloy ingot is under the vacuum state of 6.6pa; charge into inert gas argon gas (or nitrogen) again; under the protection of the atmosphere of inert gas argon gas in 470 ℃ temperature; with intermediate frequency furnace the prealloy ingot is melted; the pressure of the inert gas argon gas (or nitrogen) that is charged into is 0.1Mpa; after making the fusing of prealloy ingot; adopting the powder by atomization technology, is atomization gas with inert gas argon gas (or nitrogen), and atomizing pressure is 2.0MPa; and make solder lead-containing alloy powder; the XRD facies analysis collection of illustrative plates of alloy powder and SEM pattern are shown in respectively in accompanying drawing 3 and the accompanying drawing 4, from the test the result as can be seen, its result for solder lead-containing alloy composition be Sn 28.2%; Pb71.3%, Sb 0.46%.In this brazing filler metal alloy, except that forming part Sn-Pb solid solution, all the other Sn, Pb form with simple substance and exist; Sb can form middle SbSn mutually with Sn, the brazing filler metal alloy powder good sphericity that atomizing obtains, and particle size distribution is narrow, and the surface is more smooth, and oxygen content is low
Solder lead-containing alloy powder is welded profit with suitable helping be mixed with soft pricker cream, squeeze on welding assembly by technological requirement with distributor, enter then in single warm area reflow soldering equipment, carry out the soldering of microphone head in 400～500 ℃ of scopes of welding temperature, used in the present embodiment welding temperature is 450 ± 10 ℃
The solder lead-containing alloy powder product soldering microphone head that makes with present embodiment, soldering is in conjunction with firm, and outward appearance is smoothly bright and clean, and is respond well, be applicable to the soldering of microphone head and like fully, improved the qualification rate and the production efficiency of microphone head product greatly.
Claims (7)
1. a soldering alloyed metal powder that is used for microphone head soldering and sealing is characterized in that, percentage meter by weight, and alloying component is Sn 26～34, and Sb 0.3～0.8, and surplus is plumbous.
2. a preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing is characterized in that,
1) percentage meter by weight, alloying component is Sn 26～34, and Sb 0.3～0.8, and surplus is Pb, takes by weighing tin, lead, antimony batching,
2) under the protection of inert gas atmosphere under 350-500 ℃ temperature, will prepare burden the fusing after,
With the inert gas is that atomization gas atomizes, and the pressure of atomizing is 1.5-3.0MPa, produces soldering solder lead-base alloy powder.
3. according to a kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of claim 2; it is characterized in that; under the protection of inert gas atmosphere, lead, tin, antimony batching are melted in 350-500 ℃; after being cast into the prealloy ingot, again the prealloy ingot is being atomized after 350～500 ℃ of fusings under the protection of inert atmosphere.
4. according to a kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of claim 3, it is characterized in that, under inert gas atmosphere protection, will prepare burden and melt 15-40 minute, be cast into the prealloy ingot again in 350-500 ℃ temperature.
5. according to a kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of claim 3 or 4, it is characterized in that said inert gas is wherein a kind of of nitrogen, argon gas, the pressure of nitrogen, argon gas a kind of gas wherein is 0.09-0.1Mpa.
6. according to a kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of claim 4; it is characterized in that; the prealloy ingot is under the vacuum state of 13.3-1.33pa; charge into inert nitrogen gas, argon gas a kind of inert gas wherein again; under the atmosphere protection of inert nitrogen gas, argon gas a kind of gas wherein under 350-500 ℃ temperature; with the fusing of prealloy ingot, be that atomization gas atomizes with the inert gas.
7. according to a kind of preparation method who is used for the soldering alloyed metal powder of microphone head soldering and sealing of claim 6, it is characterized in that the pressure of the inert nitrogen gas that is charged into, argon gas a kind of inert gas wherein is 0.09-0.1Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97120351A CN1055881C (en) | 1997-12-12 | 1997-12-12 | Lead-base alloy powder used as solder for welding microphone head and its preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97120351A CN1055881C (en) | 1997-12-12 | 1997-12-12 | Lead-base alloy powder used as solder for welding microphone head and its preparation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1184015A CN1184015A (en) | 1998-06-10 |
| CN1055881C true CN1055881C (en) | 2000-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97120351A Expired - Fee Related CN1055881C (en) | 1997-12-12 | 1997-12-12 | Lead-base alloy powder used as solder for welding microphone head and its preparation process |
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| CN (1) | CN1055881C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4865893B2 (en) | 2009-09-28 | 2012-02-01 | パナソニック株式会社 | Die head and liquid applicator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121896A (en) * | 1981-01-21 | 1982-07-29 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
| CN87105076A (en) * | 1987-09-02 | 1988-03-09 | 沈阳黄金专科学校 | Lead-base alloy solder |
| CN1104950A (en) * | 1993-10-04 | 1995-07-12 | 成都市焊料厂 | Low tin high efficient welding material |
-
1997
- 1997-12-12 CN CN97120351A patent/CN1055881C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121896A (en) * | 1981-01-21 | 1982-07-29 | Senjiyu Kinzoku Kogyo Kk | Solder alloy |
| CN87105076A (en) * | 1987-09-02 | 1988-03-09 | 沈阳黄金专科学校 | Lead-base alloy solder |
| CN1104950A (en) * | 1993-10-04 | 1995-07-12 | 成都市焊料厂 | Low tin high efficient welding material |
Non-Patent Citations (1)
| Title |
|---|
| 焊接数据手册 第1版 1994.6.1 搏积和 孙玉林 机械工业出版社 * |
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| Publication number | Publication date |
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| CN1184015A (en) | 1998-06-10 |
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