CN101036962A - Low-silver lead-free solder - Google Patents
Low-silver lead-free solder Download PDFInfo
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- CN101036962A CN101036962A CN 200710200413 CN200710200413A CN101036962A CN 101036962 A CN101036962 A CN 101036962A CN 200710200413 CN200710200413 CN 200710200413 CN 200710200413 A CN200710200413 A CN 200710200413A CN 101036962 A CN101036962 A CN 101036962A
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Abstract
The invention discloses a low silver solder without lead. The solder is made of raw materials of following parts by weight: 94-98 parts by weight of tin, 0.1-1.5 parts by weight of Cu, 0.01-0.5 parts by weight of Ni, 0.01-0.05 parts by weight of Si, and 0.01-0.2 parts by weight of rare earths. The characteristic is that the dosage of Si is greatly reduced, which can save a mass of rare noble metal and reduce making cost. In addition, the solder has high antioxidation and anticorrosion without Zn as raw material. The solder has good wettability and welded mechanical reliability. If enterprise uses the solder as substitute of the solder with lead, without changing original welding procedure and device, capable of greatly reducing equipment modification cost of the enterprise. By no-lead testing and certificating, the lead content of the invention is far less than highest limit requirement.
Description
Technical field
The present invention relates to a kind of scolder, particularly a kind of lead-free solder.
Background technology
At present, generally use the Sn-Ag-Cu series lead-free solder to replace solder containing pb, its customer responsiveness is good, but its silver content up to 3%～4%, silver-colored cost accounts for the over half of totle drilling cost.The welding temperature of Sn-Ag-Cu series lead-free solder is higher than 30～50 ℃ of solder containing pbs in addition, originally use the application producer of solder containing pb to transform to welding equipment, even purchase no embedding Reflow Soldering and unleaded Wave soldering apparatus again, adjust welding condition, increased the improvement cost of enterprise.Another kind is usually used in the Sn/Ag series lead-free solder of hybrid circuit and electronics assembly industry, because of there is different cooldown rates the not same district of scolder so that its existence is easy to generate silver-colored phase transformation problem, thereby causes reliability to reduce.The wettability of two kinds of above-mentioned in addition scolders is also relatively poor.
The Sn-Zn series lead-free solder is because its fusing point is a scolder near Sn-Pb, have higher mechanical strength, can compatible existing processes equipment, Zn aboundresources, advantage such as cheap, be one of focus in the lead-free solder research.But the Sn-Zn lead-free solder remains in more problem on using, and generally because the Zn element reaction activity in this series solder is bigger, selective oxidation takes place easily, thereby causes the easy oxidation of Sn-Zn lead-free solder, corrosion resistance intersection and soldering paste to be difficult for preserving; The 2nd, the relatively poor and reason of alloy of this series solder non-oxidizability own, its wetability is relatively low, and application is restricted; The 3rd, Sn-Zn lead-free solder welding procedure and joint outward appearance are not as the Sn-Pb scolder, from present patent documentation, the research of Sn-Zn lead-free solder mainly concentrates in the simple test of adding alloying element and performance, and the research of doing aspect the physical arrangement of material and long service performance test is less, in addition, the scaling powder relevant with scolder, welding equipment slower development, therefore, it really can be applied to produce also need be further perfect.
The Sn-Cu series lead-free solder is because its composition is simple, and cost is low and receive publicity, but because this scolder fusing point is too high its application is restricted.
Though Sn-Bi-Cu series lead-free solder fusing point is lower than traditional Sn-Pb scolder, because its cost height, its application of processability official post is restricted.
Summary of the invention
The objective of the invention is to, a kind of low-silver lead-free solder is provided.This scolder have low silver, welding temperature lower, do not contain zinc, soldering reliability height, wettability better, cost of manufacture and the low characteristics of use cost.
Technical scheme of the present invention: make low-silver lead-free solder, this scolder comprises following materials of weight proportions, and consumption is a weight portion;
94～98 parts in tin, 0.1～1.5 part of copper,
1～5 part of bismuth, 0.01～0.5 part in nickel,
0.01～0.05 part of silver.
In the above-mentioned low-silver lead-free solder, also include 0.01～0.2 part of rare earth.
In the above-mentioned low-silver lead-free solder, described rare earth is mishmetal Re preferably.
Aforesaid low-silver lead-free solder can be made of conventional scolder preparation technology.
Compared with prior art, the present invention is to provide a kind of low-silver lead-free solder.The consumption that is characterized in silver significantly reduces, and consumption can be saved a large amount of rare precious metals less than 1% of other lead-free solder silver consumption, reduces cost of manufacture.The present invention as raw material, makes scolder have very high non-oxidizability and corrosion resistance without zinc in addition.Fusing point of the present invention besides is 215～218 ℃, have narrower solid-liquid two-phase region and just have good mobility when fusing point about 10 is spent being higher than, Mechanical Reliability after this makes the present invention have good wetability and welding good, and the actual welding temperature is compared variation not quite with the solder containing pb welding temperature, if enterprise uses the substitute of the present invention as solder containing pb, former Welding Technology and Equipment need not be changed, the scrap build cost of enterprise can be significantly reduced.By unleaded test and authentication, lead content of the present invention is 104.2ppm, much smaller than maximum require＜requirement of 1000ppm.
The performance test results of the present invention sees Table 1,
Table 1
| Pilot project | Result of the test |
| Fusing point (℃) | 215～218 |
| Density (g/cm 3) | 7.0 |
| Tensile strength (M.pa) | 68 |
| Percentage elongation (%) | 53 |
| Welding shear strength (M.pa) | 26 |
| Resistivity * 10 -6Ω m | 0.13 |
| Thermal coefficient of expansion | 210 * 10 -7/ K |
| Temperature shock-55 ℃-+125 ℃, 5 circulations are incubated 30min under each temperature. | Weld does not have cracking, embrittlement and mechanical damage. |
| 260 ℃ of copper corrosion tests are when arriving the copper cash fracture of 0.16mm | About 7min (the about 1min of Sn-Pb) |
The present invention and several typical lead-free solder performance comparison see Table 2,
Table 2
| Material property | Sn-57Bi | Sn3.8Ag1.0Cu | Sn0.7Cu | Sn-Pb | The present invention |
| Fusing point (℃) | 139 | 217 | 227 | 183 | 216 |
| Density (g/cm 3) | 7.39 | 7.33 | 8.4 | 7.0 | |
| Tensile strength (M.pa) | 74 | 52 | 28 | 44 | 68 |
| Percentage elongation (%) | 18 | 27 | 23 | 25 | 53 |
| Resistivity * 10 -6Ω·m | 0.15 | 0.17 | 0.13 | ||
| 260 ℃ of copper corrosion tests are when arriving the copper cash fracture of 0.16mm | About 2min | About 2min | About 7min |
Unleaded test of the present invention and authentication result see Table 3,
Table 3
| The present invention | Sample size (mg/kg) | Measuring accuracy (mg/kg) | Require maximum (mg/kg) |
| Cd | Do not detect | 2 | ＜100 |
| Cr(VI) | Do not detect | 2 | ＜1000 |
| Hg | Do not detect | 2 | ＜1000 |
| Pb | 104.2 | 2 | ＜1000 |
| The result | By | ||
The cost comparing result of each series leadless scolder and tin-lead solder sees Table 4,
Table 4
| Scolder series | Relative cost ratio: Sn63Pb37=1 |
| SnInAg(Bi) | 3.3-3.5 |
| SnAgCu | 2.9-3.3 |
| SnAg | 3.1 |
| SnAgBi(Cu) | 2.4-3.1 |
| SnAgBi(Cu) | 2.1-3.1 |
| SnBi | 1.7 |
| SnCu | 1.5 |
| SnCuBiNi (the present invention) | 1.4 |
The specific embodiment
Embodiment 1.With tin 96kg, copper 0.5kg, bismuth 3kg, nickel 0.49kg, silver-colored 0.01kg, scolder preparation technology routinely makes and gets product.(reasonability of prescription is examined in attention)
Finished product can be processed into ingot and bar through casting.Ingot can be in blocks through rolling processing.Bar can become silk through Wire Drawing.Finished product can also be through atomizing, and cream is processed in configuration then.
Embodiment 2.With tin 98kg, copper 0.5kg, bismuth 1kg, nickel 0.47kg, silver-colored 0.01kg, commercially available mishmetal Re0.02kg, scolder preparation technology routinely makes and gets product.The weld strength of this scolder and toughness are better than embodiment 1.
Finished product can be processed into ingot and bar through casting.Ingot can be in blocks through rolling processing.Bar can become silk through Wire Drawing.Finished product can also be through atomizing, and cream is processed in configuration then.
Claims (3)
1. a low-silver lead-free solder is characterized in that, this scolder comprises following materials of weight proportions, and consumption is a weight portion;
94～98 parts in tin, 0.1～1.5 part of copper,
1～5 part of bismuth, 0.01～0.5 part in nickel,
0.01～0.05 part of silver.
2. low-silver lead-free solder according to claim 1 is characterized in that, this scolder also includes 0.01～0.2 part of rare earth.
3. low-silver lead-free solder according to claim 2 is characterized in that, this rare earth is mishmetal Re.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710200413 CN101036962A (en) | 2007-04-06 | 2007-04-06 | Low-silver lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710200413 CN101036962A (en) | 2007-04-06 | 2007-04-06 | Low-silver lead-free solder |
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| Publication Number | Publication Date |
|---|---|
| CN101036962A true CN101036962A (en) | 2007-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710200413 Pending CN101036962A (en) | 2007-04-06 | 2007-04-06 | Low-silver lead-free solder |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581506A (en) * | 2012-01-19 | 2012-07-18 | 天津大学 | Bismuthstan silver system lead-free solder |
| CN103273219A (en) * | 2013-06-28 | 2013-09-04 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN104439751A (en) * | 2014-12-24 | 2015-03-25 | 深圳市亿铖达工业有限公司 | Novel low-melting-point lead-free solder |
-
2007
- 2007-04-06 CN CN 200710200413 patent/CN101036962A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581506A (en) * | 2012-01-19 | 2012-07-18 | 天津大学 | Bismuthstan silver system lead-free solder |
| CN103273219A (en) * | 2013-06-28 | 2013-09-04 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN103273219B (en) * | 2013-06-28 | 2015-04-15 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN104439751A (en) * | 2014-12-24 | 2015-03-25 | 深圳市亿铖达工业有限公司 | Novel low-melting-point lead-free solder |
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| C12 | Rejection of a patent application after its publication | ||
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Open date: 20070919 |