JPS6425929A - Copper alloy for electronic equipment - Google Patents
Copper alloy for electronic equipmentInfo
- Publication number
- JPS6425929A JPS6425929A JP18083787A JP18083787A JPS6425929A JP S6425929 A JPS6425929 A JP S6425929A JP 18083787 A JP18083787 A JP 18083787A JP 18083787 A JP18083787 A JP 18083787A JP S6425929 A JPS6425929 A JP S6425929A
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- contents
- electronic equipment
- precipitate
- regulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
Abstract
PURPOSE:To obtain a copper alloy for electronic equipment suitable for miniatuarized precision parts, by specifying a composition consisting of Sn, Ni, Co, Cr, Si, and Cu, limiting respective contents of O2 and S among impurities, and refining a precipitate. CONSTITUTION:A copper alloy for electronic equipment has a composition which consists of, by weight, 2.0-7.0% Sn, 1.0-6.0%, in total, of one or more elements among Ni, Co, and Cr, 0.1-2.0% Si, and the balance Cu with inevitable impurities and in which the contents of O2 and S among the above impurities are regulated to <=50ppm and <=20ppm, respectively, and the average grain size of a precipitate is also regulated to <=10mum, and this alloy has superior strength, workability, electric conductivity (thermal conductivity), corrosion resistance, heat resistance, etc. In the above copper alloy, it is preferable that the contents of Ni, Co, and Cr are regulated to 1.0-6.0%, <=1.5%, and 0.05-0.8%, respectively, and (Ni+Co+Cr)/Si=2-8 is satisfied, and it is also preferable to regulate the contents of O2 and S and the average grain size of the precipitate to <=30ppm, <=10ppm, and <=3mum, respectively. Moreover, the above copper alloy may further contain <=5.0%, in total, of prescribed amounts of Zn, Mn, Al, etc., if necessary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18083787A JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6425929A true JPS6425929A (en) | 1989-01-27 |
| JPH0425338B2 JPH0425338B2 (en) | 1992-04-30 |
Family
ID=16090224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18083787A Granted JPS6425929A (en) | 1987-07-20 | 1987-07-20 | Copper alloy for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6425929A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115538A (en) * | 1989-09-29 | 1991-05-16 | Tsuneaki Mikawa | Oxide dispersion strengthened special copper alloy |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| CN1063801C (en) * | 1998-01-14 | 2001-03-28 | 浙江大学 | High-strength high softening temp. copper based elastic material |
| US6379478B1 (en) * | 1998-08-21 | 2002-04-30 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
| FR2838454A1 (en) * | 2002-04-10 | 2003-10-17 | Clal Msx | Copper-nickel-tin alloy contains tellurium in form of nodules, has high mechanical characteristics for production of mechanical components |
| CN1327017C (en) * | 2004-07-22 | 2007-07-18 | 同济大学 | Novel elastic conductive alloy and its preparing method |
| WO2007124915A2 (en) * | 2006-04-28 | 2007-11-08 | Wieland-Werke Ag | Copper-nickel-tin alloy and its use |
| JP4725688B2 (en) * | 2008-04-25 | 2011-07-13 | 三菱マテリアル株式会社 | Material for interconnector for solar cell and interconnector for solar cell |
| CN107858551A (en) * | 2017-11-06 | 2018-03-30 | 江苏科技大学 | Wear-resisting nontoxic copper alloy of resistance welding electrode high-strength highly-conductive and preparation method thereof |
| CN110527860A (en) * | 2019-09-23 | 2019-12-03 | 四川博鑫铜业有限公司 | A kind of useless recycled copper refining agent and its preparation method and application |
| CN111471888A (en) * | 2020-05-09 | 2020-07-31 | 南京工程学院 | Nano intermetallic compound dispersion strengthening high-conductivity wear-resistant copper alloy and manufacturing method and application thereof |
| CN111519061A (en) * | 2019-02-01 | 2020-08-11 | 内蒙金属材料研究所 | Rare earth doped Cu-Cr-Zr alloy material and preparation method and application thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AP2014007819A0 (en) | 2012-01-27 | 2014-07-31 | Sure Chill Company Ltd | Refrigeration apparatus |
| EP3341665B1 (en) | 2015-09-11 | 2024-07-10 | The Sure Chill Company Limited | Portable refrigeration system and chilling panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (en) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | Copper alloy for lead for semiconductor |
| JPS6369933A (en) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical equipment and its production |
| JPS6386838A (en) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | Copper alloy for semiconductor lead |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
| JPS63274729A (en) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical appliance |
-
1987
- 1987-07-20 JP JP18083787A patent/JPS6425929A/en active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6362833A (en) * | 1986-09-02 | 1988-03-19 | Furukawa Electric Co Ltd:The | Copper alloy for lead for semiconductor |
| JPS6369933A (en) * | 1986-09-11 | 1988-03-30 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical equipment and its production |
| JPS6386838A (en) * | 1986-09-30 | 1988-04-18 | Furukawa Electric Co Ltd:The | Copper alloy for semiconductor lead |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
| JPS63274729A (en) * | 1987-04-30 | 1988-11-11 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical appliance |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03115538A (en) * | 1989-09-29 | 1991-05-16 | Tsuneaki Mikawa | Oxide dispersion strengthened special copper alloy |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| CN1063801C (en) * | 1998-01-14 | 2001-03-28 | 浙江大学 | High-strength high softening temp. copper based elastic material |
| US6379478B1 (en) * | 1998-08-21 | 2002-04-30 | The Miller Company | Copper based alloy featuring precipitation hardening and solid-solution hardening |
| FR2838454A1 (en) * | 2002-04-10 | 2003-10-17 | Clal Msx | Copper-nickel-tin alloy contains tellurium in form of nodules, has high mechanical characteristics for production of mechanical components |
| CN1327017C (en) * | 2004-07-22 | 2007-07-18 | 同济大学 | Novel elastic conductive alloy and its preparing method |
| WO2007124915A2 (en) * | 2006-04-28 | 2007-11-08 | Wieland-Werke Ag | Copper-nickel-tin alloy and its use |
| WO2007124915A3 (en) * | 2006-04-28 | 2008-03-13 | Wieland Werke Ag | Copper-nickel-tin alloy and its use |
| JP4725688B2 (en) * | 2008-04-25 | 2011-07-13 | 三菱マテリアル株式会社 | Material for interconnector for solar cell and interconnector for solar cell |
| CN107858551A (en) * | 2017-11-06 | 2018-03-30 | 江苏科技大学 | Wear-resisting nontoxic copper alloy of resistance welding electrode high-strength highly-conductive and preparation method thereof |
| CN111519061A (en) * | 2019-02-01 | 2020-08-11 | 内蒙金属材料研究所 | Rare earth doped Cu-Cr-Zr alloy material and preparation method and application thereof |
| CN110527860A (en) * | 2019-09-23 | 2019-12-03 | 四川博鑫铜业有限公司 | A kind of useless recycled copper refining agent and its preparation method and application |
| CN110527860B (en) * | 2019-09-23 | 2021-09-07 | 四川博鑫铜业有限公司 | Waste purple impure copper refining agent and preparation method and application thereof |
| CN111471888A (en) * | 2020-05-09 | 2020-07-31 | 南京工程学院 | Nano intermetallic compound dispersion strengthening high-conductivity wear-resistant copper alloy and manufacturing method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0425338B2 (en) | 1992-04-30 |
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