JPS63130739A - High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material - Google Patents

High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material

Info

Publication number
JPS63130739A
JPS63130739A JP27515286A JP27515286A JPS63130739A JP S63130739 A JPS63130739 A JP S63130739A JP 27515286 A JP27515286 A JP 27515286A JP 27515286 A JP27515286 A JP 27515286A JP S63130739 A JPS63130739 A JP S63130739A
Authority
JP
Japan
Prior art keywords
copper alloy
si
content
material
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27515286A
Inventor
Tetsuo Kawahara
Hidehiko So
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP27515286A priority Critical patent/JPS63130739A/en
Publication of JPS63130739A publication Critical patent/JPS63130739A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve bendability, solderability, plating suitability, and etching characteristic by limiting S content among the impurities of a Cu-Ni-Si alloy with a specific composition to a specific value or below.
CONSTITUTION: This titled copper alloy has a composition which consists of, by weight, 0.4W4.0% Ni, 0.1W1.0% Si, and the balance Cu with inevitable impurities and in which S content among the above impurities is regulated to ≤0.0015%. Further, as auxiliaries, 0.001W3.0% of one or more elements among Zn, P, Sn, As, Cr, Mg, Mn, Sb, Fe, Co, Al, Ti, Zr, Be, Ag, Pb, B, and lanthanide elements and/or ≤0.0020% O may be incorporated in the above copper alloy. In this copper alloy, S is extremely easy to combine with Si and, when its content exceeds the upper limit, a large number of sulfides are formed and, moreover, O also combines with Si and, when its content exceeds the upper limit, a large number of inclusions are formed, so that bendability, solderability, plating suitability, and etching characteristic are remarkably deteriorated in both the above cases.
COPYRIGHT: (C)1988,JPO&Japio
JP27515286A 1986-11-20 1986-11-20 High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material Pending JPS63130739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27515286A JPS63130739A (en) 1986-11-20 1986-11-20 High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27515286A JPS63130739A (en) 1986-11-20 1986-11-20 High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material

Publications (1)

Publication Number Publication Date
JPS63130739A true JPS63130739A (en) 1988-06-02

Family

ID=17551396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27515286A Pending JPS63130739A (en) 1986-11-20 1986-11-20 High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material

Country Status (1)

Country Link
JP (1) JPS63130739A (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425929A (en) * 1987-07-20 1989-01-27 Furukawa Electric Co Ltd Copper alloy for electronic equipment
JPH01100231A (en) * 1987-10-12 1989-04-18 Furukawa Electric Co Ltd:The Copper alloy for high tensile electric and electronic equipment
JPH0247228A (en) * 1988-08-05 1990-02-16 Kobe Steel Ltd Copper alloy for terminal and connector having excellent strength and conductivity
JPH0266130A (en) * 1988-08-29 1990-03-06 Mitsubishi Shindoh Co Ltd Cu alloy for terminal and connector having less wear or blanking die
JPH02114404A (en) * 1988-10-25 1990-04-26 Sumitomo Electric Ind Ltd Thin cu alloy wire for electric/electronic apparatus
JPH02145737A (en) * 1988-11-24 1990-06-05 Dowa Mining Co Ltd High strength and high conductivity copper-base alloy
JPH02149626A (en) * 1988-11-30 1990-06-08 Kobe Steel Ltd Copper alloy for terminal and connector having excellent strength, electrical conductivity and migration resistance
JPH02282441A (en) * 1989-04-22 1990-11-20 Mitsubishi Electric Corp Copper alloy for electronic equipment
JPH0356636A (en) * 1989-07-25 1991-03-12 Mitsubishi Shindoh Co Ltd Connector for electric apparatus made of cu alloy
JPH03115538A (en) * 1989-09-29 1991-05-16 Tsuneaki Mikawa Oxide dispersion strengthened special copper alloy
JPH0559468A (en) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd Copper alloy for conductive spring
US5248351A (en) * 1988-04-12 1993-09-28 Mitsubishi Denki Kabushiki Kaisha Copper Ni-Si-P alloy for an electronic device
JPH05345941A (en) * 1992-06-11 1993-12-27 Mitsubishi Shindoh Co Ltd Lead frame material made of cu alloy for resin sealed semiconductor device
US5833920A (en) * 1996-02-20 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Copper alloy for electronic parts, lead-frame, semiconductor device and connector
CN1040891C (en) * 1992-11-04 1998-11-25 奥林公司 Copper alloy having high strength and conductivity
US6749699B2 (en) 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
US6893514B2 (en) 2000-12-15 2005-05-17 The Furukawa Electric Co., Ltd. High-mechanical strength copper alloy
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
US7172662B2 (en) 2000-07-25 2007-02-06 The Furukawa Electric Co., Ltd. Copper alloy material for parts of electronic and electric machinery and tools
KR100885824B1 (en) 2006-03-31 2009-02-26 닛코 킨조쿠 가부시키가이샤 Copper alloy having superior hot workability and method for producing same
US7648601B2 (en) 2002-03-12 2010-01-19 Furukawa Electric Co., Ltd. High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
US7727344B2 (en) 2000-04-28 2010-06-01 The Furukawa Electric Co., Ltd. Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
CN106011535A (en) * 2016-07-19 2016-10-12 山东大学 Rare earth oxide modified copper-nickel-silicon alloy material and preparation method and application thereof

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425338B2 (en) * 1987-07-20 1992-04-30 Furukawa Electric Co Ltd
JPS6425929A (en) * 1987-07-20 1989-01-27 Furukawa Electric Co Ltd Copper alloy for electronic equipment
JPH0425340B2 (en) * 1987-10-12 1992-04-30 Furukawa Electric Co Ltd
JPH01100231A (en) * 1987-10-12 1989-04-18 Furukawa Electric Co Ltd:The Copper alloy for high tensile electric and electronic equipment
US5248351A (en) * 1988-04-12 1993-09-28 Mitsubishi Denki Kabushiki Kaisha Copper Ni-Si-P alloy for an electronic device
JPH0247228A (en) * 1988-08-05 1990-02-16 Kobe Steel Ltd Copper alloy for terminal and connector having excellent strength and conductivity
JPH0266130A (en) * 1988-08-29 1990-03-06 Mitsubishi Shindoh Co Ltd Cu alloy for terminal and connector having less wear or blanking die
JPH0524217B2 (en) * 1988-08-29 1993-04-07 Mitsubishi Shindo Kk
JPH02114404A (en) * 1988-10-25 1990-04-26 Sumitomo Electric Ind Ltd Thin cu alloy wire for electric/electronic apparatus
JPH0478704B2 (en) * 1988-11-24 1992-12-11 Dowa Kogyo Kk
JPH02145737A (en) * 1988-11-24 1990-06-05 Dowa Mining Co Ltd High strength and high conductivity copper-base alloy
JPH02149626A (en) * 1988-11-30 1990-06-08 Kobe Steel Ltd Copper alloy for terminal and connector having excellent strength, electrical conductivity and migration resistance
JPH0472898B2 (en) * 1988-11-30 1992-11-19 Kobe Steel Ltd
JPH02282441A (en) * 1989-04-22 1990-11-20 Mitsubishi Electric Corp Copper alloy for electronic equipment
JPH0356636A (en) * 1989-07-25 1991-03-12 Mitsubishi Shindoh Co Ltd Connector for electric apparatus made of cu alloy
JPH03115538A (en) * 1989-09-29 1991-05-16 Tsuneaki Mikawa Oxide dispersion strengthened special copper alloy
JPH0530894B2 (en) * 1989-09-29 1993-05-11 Tsuneaki Mikawa
JPH0559468A (en) * 1991-04-24 1993-03-09 Nikko Kyodo Co Ltd Copper alloy for conductive spring
JPH05345941A (en) * 1992-06-11 1993-12-27 Mitsubishi Shindoh Co Ltd Lead frame material made of cu alloy for resin sealed semiconductor device
CN1040891C (en) * 1992-11-04 1998-11-25 奥林公司 Copper alloy having high strength and conductivity
US5833920A (en) * 1996-02-20 1998-11-10 Mitsubishi Denki Kabushiki Kaisha Copper alloy for electronic parts, lead-frame, semiconductor device and connector
US7727344B2 (en) 2000-04-28 2010-06-01 The Furukawa Electric Co., Ltd. Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
US7172662B2 (en) 2000-07-25 2007-02-06 The Furukawa Electric Co., Ltd. Copper alloy material for parts of electronic and electric machinery and tools
US6749699B2 (en) 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
US6893514B2 (en) 2000-12-15 2005-05-17 The Furukawa Electric Co., Ltd. High-mechanical strength copper alloy
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
US7648601B2 (en) 2002-03-12 2010-01-19 Furukawa Electric Co., Ltd. High-strength, high-conductivity copper alloy wire excellent in resistance to stress relaxation
KR100885824B1 (en) 2006-03-31 2009-02-26 닛코 킨조쿠 가부시키가이샤 Copper alloy having superior hot workability and method for producing same
CN106011535A (en) * 2016-07-19 2016-10-12 山东大学 Rare earth oxide modified copper-nickel-silicon alloy material and preparation method and application thereof

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