JPS60245754A - High strength copper alloy having high electric conductivity - Google Patents

High strength copper alloy having high electric conductivity

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Publication number
JPS60245754A
JPS60245754A JP10172484A JP10172484A JPS60245754A JP S60245754 A JPS60245754 A JP S60245754A JP 10172484 A JP10172484 A JP 10172484A JP 10172484 A JP10172484 A JP 10172484A JP S60245754 A JPS60245754 A JP S60245754A
Authority
JP
Japan
Prior art keywords
weight
alloy
spring
content
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10172484A
Other languages
Japanese (ja)
Inventor
Hirohito Miyashita
博仁 宮下
Morinori Kamio
守則 神尾
Masahiro Tsuji
正博 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP10172484A priority Critical patent/JPS60245754A/en
Publication of JPS60245754A publication Critical patent/JPS60245754A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain a Cu alloy having superior strength, spring characteristics and electric conductivity by adding specified amounts of Sn, P, Fe, Ni, and other elements to Cu and making the content of O2 as an impurity as low as possible. CONSTITUTION:A Cu alloy consisting of, by weight, 0.8-4.0% Sn, 0.01-0.4% P, 0.05-1.0% Fe, 0.05-1.0% Ni, 0.01-1.0% one or more among Al, Hf, Be, Mo, Te, Pb, Co, Zr, Nb, B, Mg, Mn, Si, Sb, Ti, In, As and Zn, and the balance Cu with impurities including O2 reduced to <=0.0020% is used as a material for a spring for an electric apparatus, a spring for an instrument or a spring for a switch or a connector. The Cu alloy has superior strength and spring characteristics without deteriorating the electric conductivity.

Description

【発明の詳細な説明】 本発明は、トランジスタや集積回路(IC)などの半導
体機器のリード材、コネクター、端子。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to lead materials, connectors, and terminals for semiconductor devices such as transistors and integrated circuits (ICs).

リレー、スイッチ等の導電性ばね材に適する銅合金に関
するものである。
This invention relates to a copper alloy suitable for conductive spring materials such as relays and switches.

従来、半導体機器のリード材としては、熱膨張係数が低
く、素子およびセラミックとの接着および封着性の良好
なコバール(Fe−z9N1−16co) 。
Conventionally, Kovar (Fe-z9N1-16co) has been used as a lead material for semiconductor devices because of its low coefficient of thermal expansion and good adhesion and sealing properties with elements and ceramics.

42合金(F13−42N1 )などの高ニッケル合金
が好んで使われてきた。しかし、近年、半導体回路の集
積度の向上に伴ない消費電力の高いIOが多くなってき
たことと、封止材料として樹脂が多く使用され、かつ素
子とリードフレームの接着も改良が加えられたことによ
り、使用されるリード材も放熱性のよい銅基合金が使わ
れるようになってきた。
High nickel alloys such as Alloy 42 (F13-42N1) have been preferred. However, in recent years, with the increase in the degree of integration of semiconductor circuits, the number of IOs with high power consumption has increased, resins are often used as sealing materials, and improvements have been made to the bonding between elements and lead frames. As a result, copper-based alloys with good heat dissipation properties have come to be used as lead materials.

一般に半導体機器のリード材としては以下のような特性
が要求されている。
Generally, lead materials for semiconductor devices are required to have the following properties.

(1)リードが電気信号伝達部であるとともに。(1) The lead is an electrical signal transmission part.

パッケージング工程中及び回路使用中に発生する熱を外
部に放出する機能を併せ持つことを要求される為、優れ
た熱及び電気伝導性を示すもの。
Materials that exhibit excellent thermal and electrical conductivity are required to have the ability to release heat generated during the packaging process and circuit use to the outside.

(2)リードとモールドとの密着性が半導体素子保護の
観点から重−であるため、リード材とモールド材の熱膨
張係数が近いこと。
(2) Since the adhesion between the lead and the mold is important from the viewpoint of protecting the semiconductor element, the thermal expansion coefficients of the lead material and the mold material should be similar.

(3) パッケージング時に種々の加熱工程が加わる為
、耐熱性が良好であること。
(3) Good heat resistance as various heating processes are added during packaging.

(4) リードはリード材は打抜き加工し、又曲げ加工
して作製されるものがほとんどである為。
(4) Most leads are made by punching or bending the lead material.

これらの加工性が良好なこと。These must have good workability.

(5)リードは表面に貴金属のメッキを行う為。(5) The surface of the lead is plated with precious metal.

これら貴金属とのメッキ密着性が良好であること。Good plating adhesion with these precious metals.

(6) パッケージング後に封止材の外に露出している
。いわゆるアウター・リード部にハンダ付けするものが
多いので良好なハンダ付は性を示すこと。
(6) Exposed outside the sealing material after packaging. Since many items are soldered to the so-called outer lead part, good soldering shows the properties.

(7) 機器の信頼性及び寿命の観点から耐食性が良好
なこと。
(7) Good corrosion resistance from the standpoint of equipment reliability and lifespan.

(8) 価格が低摩であること。(8) The price must be low.

これら各種の要求特性に対し、従来より使用されている
無酸素鋼、すす入り銅、鉄人シ銅。
Oxygen-free steel, soot-containing copper, and iron copper have been conventionally used to meet these various required characteristics.

りん青銅、コバール、42合金は何れも一長一短があり
、これら特性の全てを必ずしも満足し得るものではない
Phosphor bronze, Kovar, and 42 alloy all have advantages and disadvantages, and cannot necessarily satisfy all of these characteristics.

又、従来、電気機器用ばね、計測器用ばね。Also, conventional springs for electrical equipment and springs for measuring instruments.

スイッチ、コネクター等に用いられるばね用材料として
は、安価な黄銅、優れたばね特性及び耐食性を有する洋
白、あるいは優れたばね特性を有するりん青銅が使用さ
れていた。しかし。
As materials for springs used in switches, connectors, etc., inexpensive brass, nickel silver, which has excellent spring properties and corrosion resistance, or phosphor bronze, which has excellent spring properties, have been used. but.

黄銅は強度、ばね特性が劣っており、又9強度。Brass has inferior strength and spring characteristics, and has a strength of 9.

ばね特性の優れた洋白、りん青銅も洋白け18重量%の
Ni、りん青銅は8重量%のSnを含むため、原料の面
及び製造上熱間加工性が悪い等の加工上の制約も加わシ
高価な合金であった。
Nickel silver and phosphor bronze, both of which have excellent spring properties, also contain 18% by weight of Ni and 8% by weight of Sn, so there are processing constraints such as poor hot workability due to raw materials and manufacturing. In addition, it was an expensive alloy.

さらには電気機器用等に用いられる場合、電気伝導度が
低いという欠点を有していた。従って。
Furthermore, when used for electrical equipment, etc., it has a drawback of low electrical conductivity. Therefore.

導電性が良好であり、ばね特性に優れた安価な合金の現
出が待たれていた。
The emergence of an inexpensive alloy with good electrical conductivity and excellent spring properties has been awaited.

本発明はかかる点に鑑みなされたもので、従来の銅基合
金のもつ欠点を改良し、半導体機器のリード材及び導電
性ばね材として好適な諸物件を有する銅合金を提供しよ
うとするものである。
The present invention has been made in view of the above, and aims to improve the drawbacks of conventional copper-based alloys and provide a copper alloy having various properties suitable as lead materials and conductive spring materials for semiconductor devices. be.

本発明は、Sn 0.8−4.0重量4. Po、01
−0.4重量%、 Ni0.05〜1.0重量’11.
 Fe O,05−t 0重量%及びAI、 Hf、 
Be、 Mo、 Te、 Pb、 Co、 Zr、 N
b、 B、 Mg。
The present invention has Sn 0.8-4.0 weight 4. Po, 01
-0.4% by weight, Ni0.05-1.0% by weight'11.
FeO,05-t 0% by weight and AI, Hf,
Be, Mo, Te, Pb, Co, Zr, N
b, B, Mg.

Mn、 Si、 Sb、 Ti、 In、 As、 Z
nの1種又は2種以上を001〜1,0重量%を含み、
残部がCu及び不可避的な不純物から成る合金あるいは
この不可避不純物のうち酸素の含有量が0.0020重
量%以下とされる合金であって、半導体機器のリード材
用鋼合金として優れた電気及び熱伝導性。
Mn, Si, Sb, Ti, In, As, Z
Contains 001 to 1.0% by weight of one or more of n,
An alloy in which the balance consists of Cu and unavoidable impurities, or an alloy in which the content of oxygen among these unavoidable impurities is 0.0020% by weight or less, and is an excellent electrical and thermal steel alloy for lead materials of semiconductor devices. conductivity.

耐熱性、加工性、メッキ密着性、ハンダ付は性。Excellent heat resistance, workability, plating adhesion, and solderability.

耐食性等を有し、又導電性ばね材として優れた高力、ば
ね特性、導電性を併せ示すことを特徴とするものである
It is characterized by having corrosion resistance, etc., and also exhibiting excellent high strength, spring properties, and conductivity as a conductive spring material.

次に本発明合金を構成する合金成分の限定理由を説明す
る。anの含有量を0.8〜4.0重量憾とする理由は
、Sn含有量が08重量%未満ではPの共添を伴っても
期待する強度が得られず。
Next, the reason for limiting the alloy components constituting the alloy of the present invention will be explained. The reason for setting the content of an to 0.8 to 4.0% by weight is that when the Sn content is less than 0.8% by weight, the expected strength cannot be obtained even when P is co-added.

逆にSn含有量が4.0重量%をこえると導電率が低下
し9価格も上昇するためである。P含有量を0.01〜
0.4重量%とした理由は、P含有量が0.011重量
%満ではP含有による強度と耐熱性の向上は顕著ではな
(、p含有量が04重量%をこえるとSn含有量のいか
んにかかわらず導電率の低下が著しいためである。Ni
含有量を005〜1.0重量%とする理由は、 Ni含
有量が00505重量%では期待する強度が得られず、
10重量%をこえると導電率の低下が著しいためである
。Feの含有量を0.05〜1.0重量%とした理由は
、0.055重量%満ではFe含有による強度と耐熱性
の向上が顕著ではな(,1,0重量%をこえると導電率
の低下が著しいためである。さらに副成分としてAI、
 Hf、 Be。
Conversely, if the Sn content exceeds 4.0% by weight, the electrical conductivity will decrease and the price will also increase. P content from 0.01 to
The reason for setting it at 0.4% by weight is that when the P content is less than 0.011% by weight, the improvement in strength and heat resistance due to P content is not remarkable (but when the P content exceeds 0.04% by weight, the Sn content This is because the conductivity decreases significantly regardless of the Ni
The reason why the Ni content is set to 005 to 1.0% by weight is that the expected strength cannot be obtained when the Ni content is 00505% by weight.
This is because when the content exceeds 10% by weight, the conductivity decreases significantly. The reason for setting the Fe content to 0.05 to 1.0% by weight is that if it is less than 0.055% by weight, the improvement in strength and heat resistance due to Fe content is not remarkable (and if it exceeds 1.0% by weight, the conductivity is reduced). This is because the decrease in the rate is significant.In addition, AI, as a subcomponent,
Hf, Be.

λKo、 Te、 Pb、 Co、 Zr、 Nb、 
B、 Mg、 Mn、 Si、 Sb、 Ti、In、
 As。
λKo, Te, Pb, Co, Zr, Nb,
B, Mg, Mn, Si, Sb, Ti, In,
As.

Znの1種又は2種以上を含有すると強度、ばね特性を
向上させるが、その含有量がo、olfi−1i壬未満
ではその効果があまり期待できず、また10重重量%こ
えると導電率の低下が著しくなることから0.01〜1
.0重量%とした。まだ゛酸素含有量を0.0020重
量係重量%した理由は。
Containing one or more types of Zn improves strength and spring properties, but if the content is less than 10% by weight, the effect cannot be expected much, and if it exceeds 10% by weight, the electrical conductivity will decrease. 0.01 to 1, as the decrease will be significant.
.. It was set to 0% by weight. Why was the oxygen content set at 0.0020% by weight?

0、0020重量%をこえるとメッキ密着性が低下する
ためである。
This is because if it exceeds 0.0020% by weight, plating adhesion will decrease.

このような本発明合金は優れた強度、ばね特性、耐熱性
と電気伝導性を具備し、ハンダ付は性、メッキ密着性も
良好な銅合金である。又。
The alloy of the present invention is a copper alloy that has excellent strength, spring properties, heat resistance, and electrical conductivity, and also has good solderability and plating adhesion. or.

熱膨張係数はプラスチックに近く、半導体機器のリード
材としてはプラスチックパッケージ用に適している。従
って1本発明合金は半導体機器のリード材及び導電性ば
ね材として好適な材料であり、先行技術の合金において
このような総合的特性を兼備するものはない。
Its coefficient of thermal expansion is close to that of plastic, making it suitable for plastic packages as a lead material for semiconductor devices. Therefore, the alloy of the present invention is suitable as a lead material and a conductive spring material for semiconductor devices, and no prior art alloy has such comprehensive properties.

以下に本発明材料を実施例をもって説明する。The material of the present invention will be explained below with reference to Examples.

実施例 第1表に示される本発明合金に係る各種成分組成のイン
ゴットを電気銅あるいは無酸素鋼を原料として、高周波
溶解炉で大気、不活性又は還元性雰囲気中で溶解鋳造し
た。次にこれを800℃で熱間圧延して厚さ4mの板と
した後。
EXAMPLES Ingots having various compositions of the alloys of the present invention shown in Table 1 were melted and cast using electrolytic copper or oxygen-free steel as raw materials in a high-frequency melting furnace in air, an inert atmosphere, or a reducing atmosphere. This was then hot rolled at 800°C to form a 4m thick plate.

面側を行って冷間圧延で厚さ1.0調とした。これを5
00℃にて1時間焼鈍したのち、冷間圧延で厚さ08間
の板とし、リード材としての評価を行った。評価として
は強度、伸びを引張試験により、耐熱性を加熱時間5分
における軟化温度によシ、電気伝導性(放熱性)を導電
率(%IAC8)によって示した。ハンダ付は性は、垂
直式浸漬法で230℃±5℃のハンダ浴(すず60係、
鉛4o%)K5秒間浸漬し、ハンダのぬれの状態を目視
観察することにより評価した。
The surface side was cold rolled to a thickness of 1.0. This is 5
After annealing at 00°C for 1 hour, it was cold rolled into a plate with a thickness of 08°C and evaluated as a lead material. For evaluation, strength and elongation were determined by a tensile test, heat resistance was determined by softening temperature at a heating time of 5 minutes, and electrical conductivity (heat dissipation) was determined by electrical conductivity (%IAC8). For soldering, use the vertical immersion method in a soldering bath at 230°C ± 5°C (tin 60%,
The solder wetting condition was evaluated by visually observing the wetting state of the solder after immersing it in the solder for 5 seconds.

メッキ密着性は試料に厚さ3μのAgメッキを施こし、
450℃にて5分間加熱し2表面に発生するフクレの有
無を目視観察することにより評価した。これらの結果を
比較合金とともに第1表に示した。
Plating adhesion was determined by applying 3μ thick Ag plating to the sample.
Evaluation was made by heating at 450° C. for 5 minutes and visually observing the presence or absence of blisters generated on the surface of 2. These results are shown in Table 1 along with comparative alloys.

また、ばね材としての評価を行う為に、同一合金の1.
0鰭材を500℃にて1時間焼鈍したのち、冷間圧延で
厚さ0.5鵡の板とし、これを150〜500℃の各種
温度で歪とシ焼鈍を行い1強度、伸びを引張試験によシ
評価し、ばね性をKl)値により評価した、これに電気
伝導度の結果を加え、比較合金とともに第2表に示した
In addition, in order to evaluate it as a spring material, 1.
After annealing the 0-fin material at 500℃ for 1 hour, it was cold rolled into a plate with a thickness of 0.5mm, which was strained and annealed at various temperatures from 150 to 500℃ to increase the strength and elongation. The spring properties were evaluated by tests and the results of electrical conductivity were added to this and are shown in Table 2 together with comparative alloys.

なお、ハンダ付は性、メッキ密着性はリード材の結果と
ほとんど同一であったので割愛した。
Note that the soldering properties and plating adhesion were almost the same as the results for the lead material, so they were omitted.

Claims (2)

【特許請求の範囲】[Claims] (1) Eln 0.8−4.0重量%、P0.01〜
0.4重量係。 NiO,05−1,0重量%、FeO,05−1,0重
量壬及びAl、 Hf、 Be、 Mo、 Te、 P
b、 Co、 Zr、 Nb、 B、 Mg、 Mn、
 Si。 Eb、 Ti、In、 As、 Znの1種又は2′p
fi以上を0.01〜1.0重量係合み、残部がOu及
び不可避不純物から成ることを特徴とする高力高導電銅
合金。
(1) Eln 0.8-4.0% by weight, P0.01~
0.4 weight section. NiO, 05-1,0% by weight, FeO, 05-1,0% by weight and Al, Hf, Be, Mo, Te, P
b, Co, Zr, Nb, B, Mg, Mn,
Si. One of Eb, Ti, In, As, Zn or 2'p
A high-strength, high-conductivity copper alloy characterized in that fi or more is engaged by 0.01 to 1.0 weight, and the remainder consists of O and unavoidable impurities.
(2) Sn0.8−4.0重fgl p o、o 1
−0.4重量係。 NiO,05−1,0重量%、Fe0.05−1.0重
量壬及びAI、 Hf、 Be、 Mo、 Te、 P
b、 Co、 Zr、 Nb、 B、 Mg、 Mn、
 Si。 Sb、 Ti、 In、 As、 Znの1種又は2種
以上を001〜1.0重量係合み、残部がOu及び不可
避不純物から成り、該不純物のうち酸素の含有量が0.
0020重量係以下とされることを特徴とする高力高導
電銅合金。
(2) Sn0.8-4.0 heavy fgl po, o 1
-0.4 weight section. NiO, 0.05-1.0% by weight, Fe0.05-1.0% by weight and AI, Hf, Be, Mo, Te, P
b, Co, Zr, Nb, B, Mg, Mn,
Si. One or more of Sb, Ti, In, As, and Zn are incorporated by weight in the range of 0.001 to 1.0%, the remainder being O and inevitable impurities, and the content of oxygen among the impurities is 0.001 to 1.0% by weight.
A high-strength, high-conductivity copper alloy characterized by having a weight coefficient of 0020 or less.
JP10172484A 1984-05-22 1984-05-22 High strength copper alloy having high electric conductivity Pending JPS60245754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10172484A JPS60245754A (en) 1984-05-22 1984-05-22 High strength copper alloy having high electric conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10172484A JPS60245754A (en) 1984-05-22 1984-05-22 High strength copper alloy having high electric conductivity

Publications (1)

Publication Number Publication Date
JPS60245754A true JPS60245754A (en) 1985-12-05

Family

ID=14308239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10172484A Pending JPS60245754A (en) 1984-05-22 1984-05-22 High strength copper alloy having high electric conductivity

Country Status (1)

Country Link
JP (1) JPS60245754A (en)

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JPS62156242A (en) * 1985-12-27 1987-07-11 Mitsubishi Electric Corp Copper-base alloy
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JPS62227052A (en) * 1986-03-28 1987-10-06 Dowa Mining Co Ltd Copper-base alloy for terminal and connector and its production
JPS6345337A (en) * 1986-04-10 1988-02-26 Furukawa Electric Co Ltd:The Copper alloy for electronic and electric appliance and its production
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JPS6365038A (en) * 1986-09-08 1988-03-23 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical equipment
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US8986471B2 (en) 2007-12-21 2015-03-24 Mitsubishi Shindoh Co., Ltd. High strength and high thermal conductivity copper alloy tube and method for producing the same
CN105546177A (en) * 2015-12-29 2016-05-04 常熟市虞菱机械有限责任公司 Explosion-proof valve for gas pipeline
US9455058B2 (en) 2009-01-09 2016-09-27 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US9512506B2 (en) 2008-02-26 2016-12-06 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US10266917B2 (en) 2003-03-03 2019-04-23 Mitsubishi Shindoh Co., Ltd. Heat resistance copper alloy materials
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US10665462B2 (en) 2002-11-21 2020-05-26 Jx Nippon Mining & Metals Corporation Copper alloy sputtering target and semiconductor element wiring

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JPS6148545A (en) * 1984-08-11 1986-03-10 Dowa Mining Co Ltd High strength copper alloy for electrically conductive material
JPS634885B2 (en) * 1984-08-11 1988-02-01 Dowa Kogyo Kk
JPS61284946A (en) * 1985-06-11 1986-12-15 Mitsubishi Shindo Kk Cu alloy lead blank for semiconductor device
JPH0478701B2 (en) * 1985-06-11 1992-12-11 Mitsubishi Shindo Kk
JPS6299430A (en) * 1985-10-26 1987-05-08 Dowa Mining Co Ltd Copper alloy for terminal or connector and its manufacture
JPH0418016B2 (en) * 1985-10-26 1992-03-26 Dowa Kogyo Kk
JPS62156242A (en) * 1985-12-27 1987-07-11 Mitsubishi Electric Corp Copper-base alloy
JPS62161933A (en) * 1986-01-08 1987-07-17 Nakasato Kk Copper alloy for inexpensive electroconductive spring for electrical and electronic equipment
JPH0564225B2 (en) * 1986-03-07 1993-09-14 Mitsubishi Shindo Kk
JPS62207833A (en) * 1986-03-07 1987-09-12 Mitsubishi Shindo Kk Cu-alloy lead material for semiconductor device
JPH0314901B2 (en) * 1986-03-28 1991-02-27 Dowa Mining Co
JPS62227052A (en) * 1986-03-28 1987-10-06 Dowa Mining Co Ltd Copper-base alloy for terminal and connector and its production
JPS6345337A (en) * 1986-04-10 1988-02-26 Furukawa Electric Co Ltd:The Copper alloy for electronic and electric appliance and its production
JPS6365038A (en) * 1986-09-08 1988-03-23 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical equipment
JPS6365039A (en) * 1986-09-08 1988-03-23 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical equipment
US4851191A (en) * 1987-04-10 1989-07-25 Poong San Metal Corporation High strength and wear resistance copper alloys
JPS63312932A (en) * 1987-06-15 1988-12-21 Mitsubishi Electric Corp Copper based alloy for zigzag-in line-package
US4935202A (en) * 1987-10-30 1990-06-19 Ngk Insulators, Ltd. Electrically conductive spring materials
US5024815A (en) * 1989-05-23 1991-06-18 Yazaki Corporation Copper alloy with phosphorus and iron
JPH032341A (en) * 1989-05-26 1991-01-08 Dowa Mining Co Ltd High strength and high conductivity copper alloy
JPH0534409B2 (en) * 1989-05-26 1993-05-24 Dowa Mining Co
JPH0356636A (en) * 1989-07-25 1991-03-12 Mitsubishi Shindoh Co Ltd Connector for electric apparatus made of cu alloy
JPH0372043A (en) * 1989-08-11 1991-03-27 Sumitomo Metal Mining Co Ltd Copper alloy for backing plate
JPH06108184A (en) * 1991-11-14 1994-04-19 Sanpo Shindo Kogyo Kk Corrosion resisting copper-base alloy material
US5508001A (en) * 1992-11-13 1996-04-16 Mitsubishi Sindoh Co., Ltd. Copper based alloy for electrical and electronic parts excellent in hot workability and blankability
US5993574A (en) * 1996-10-28 1999-11-30 Brush Wellman, Inc. Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
US6001196A (en) * 1996-10-28 1999-12-14 Brush Wellman, Inc. Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
US5820701A (en) * 1996-11-07 1998-10-13 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
US10665462B2 (en) 2002-11-21 2020-05-26 Jx Nippon Mining & Metals Corporation Copper alloy sputtering target and semiconductor element wiring
US10266917B2 (en) 2003-03-03 2019-04-23 Mitsubishi Shindoh Co., Ltd. Heat resistance copper alloy materials
US8986471B2 (en) 2007-12-21 2015-03-24 Mitsubishi Shindoh Co., Ltd. High strength and high thermal conductivity copper alloy tube and method for producing the same
US9512506B2 (en) 2008-02-26 2016-12-06 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US10163539B2 (en) 2008-02-26 2018-12-25 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy rod or wire
US20110174417A1 (en) * 2008-03-28 2011-07-21 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy pipe, rod, or wire
US9163300B2 (en) * 2008-03-28 2015-10-20 Mitsubishi Shindoh Co., Ltd. High strength and high conductivity copper alloy pipe, rod, or wire
JP2009114539A (en) * 2008-11-04 2009-05-28 Nikko Kinzoku Kk Copper alloy sputtering target and semiconductor element wiring
US9455058B2 (en) 2009-01-09 2016-09-27 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
CN103540791A (en) * 2013-10-17 2014-01-29 常熟市良益金属材料有限公司 Copper-tin alloy
CN105546177A (en) * 2015-12-29 2016-05-04 常熟市虞菱机械有限责任公司 Explosion-proof valve for gas pipeline

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