JPH02163331A - High strength and high conductivity copper alloy having excellent adhesion for oxidized film - Google Patents
High strength and high conductivity copper alloy having excellent adhesion for oxidized filmInfo
- Publication number
- JPH02163331A JPH02163331A JP31495888A JP31495888A JPH02163331A JP H02163331 A JPH02163331 A JP H02163331A JP 31495888 A JP31495888 A JP 31495888A JP 31495888 A JP31495888 A JP 31495888A JP H02163331 A JPH02163331 A JP H02163331A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- oxide film
- copper alloy
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 7
- 229910052745 lead Inorganic materials 0.000 claims abstract description 6
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 5
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 5
- 230000003746 surface roughness Effects 0.000 claims abstract description 5
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229910052796 boron Inorganic materials 0.000 claims abstract 4
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 4
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 3
- 229910052787 antimony Inorganic materials 0.000 claims abstract 3
- 229910052790 beryllium Inorganic materials 0.000 claims abstract 3
- 229910052804 chromium Inorganic materials 0.000 claims abstract 3
- 229910052742 iron Inorganic materials 0.000 claims abstract 3
- 229910052749 magnesium Inorganic materials 0.000 claims abstract 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract 3
- 229910052785 arsenic Inorganic materials 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 17
- 239000000956 alloy Substances 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はトランジスタや集積回路（ＩＣ）などの半導体
機器のリード材、コネクター、端子、リレー、スイッチ
等に用いられる、特に酸化膜密着性に優れた高力高導電
性銅合金に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention is used for lead materials, connectors, terminals, relays, switches, etc. of semiconductor devices such as transistors and integrated circuits (ICs), and is particularly suitable for oxide film adhesion. This invention relates to an excellent high-strength, high-conductivity copper alloy.
［従来の技術］
従来、半導体機器のリード材としては、熱膨張係数が低
く、素子及びセラミックスの接着及び到着性の良好なコ
バール（Ｐｅ −２９Ｎｉ −１８Ｃｏ）、４２合金（
Ｆｅ−４２Ｎｉ）などの高ニッケル合金が好んで使われ
てきた。しかし、近年、半導体回路の集積度の向上に伴
い消費電力の高いＩＣが多くなってきたことと、封止材
料として樹脂が多く使用され、かつ素子とリードフレー
ムの接着も改良が加えられたことにより、使用されるリ
ード材も放熱性のよい銅基合金が使われるようになって
きた。[Prior Art] Conventionally, as lead materials for semiconductor devices, Kovar (Pe-29Ni-18Co) and 42 alloy (
High nickel alloys such as Fe-42Ni) have been preferred. However, in recent years, as the degree of integration of semiconductor circuits has improved, the number of ICs with high power consumption has increased, resins have been increasingly used as sealing materials, and improvements have been made to the bonding between elements and lead frames. As a result, copper-based alloys with good heat dissipation properties have come to be used as lead materials.
又、従来、電気機器用ばね、計測器用ばね、スイッチ、
コネクター等に用いられるばね用材料としては、安価な
黄銅、優れたばね特性および耐食性を有する洋白、ある
いは優れたばね特性を有するりん青銅が使用されていた
。In addition, conventional springs for electrical equipment, springs for measuring instruments, switches,
As materials for springs used in connectors and the like, inexpensive brass, nickel silver, which has excellent spring properties and corrosion resistance, or phosphor bronze, which has excellent spring properties, have been used.
［発明が解決しようとする課′ＸＪ］
上述の半導体機器特にリード材に対する各種の要求特性
に対し、従来より使用されている無酸素鋼、錫入り銅、
りん青銅、コバール、４２合金はいずれも一長一短があ
り、これらの特性を全て満足するものではない。[Problem to be solved by the invention'
Phosphor bronze, Kovar, and 42 alloy all have advantages and disadvantages, and do not satisfy all of these characteristics.
しかし、近年半導体に対する信頼度の要求がより厳しく
なるとともに、小型化に対応した面付実装タイプが多く
なってきたため、従来問題とされていなかった酸化膜密
着性が非常に重要な特性項目となってきた。However, in recent years, reliability requirements for semiconductors have become more stringent, and surface mounting types have become more popular in response to miniaturization, so oxide film adhesion, which was not considered an issue in the past, has become an extremely important characteristic item. It's here.
すなわち、リードフレームはパッケージングの過程で熱
が加わるため、酸化膜が必ず生成される。樹脂等で封止
された場合、樹脂と酸化膜、酸化膜と母材との密着強度
を比べると、酸化膜と母材の密着強度が一般に低い。こ
の場合、酸化膜と母材との間に剥離が生じることがあり
、そこから水分等が入り、ＩＣの信頼性を著しく低下さ
せてしまう。従って、酸化膜密着性はリードフレーム材
等に用いられる高力高導電性鋼合金として最も重要な特
性の一つである。That is, since heat is applied to the lead frame during the packaging process, an oxide film is inevitably generated. When sealed with a resin or the like, the adhesion strength between the resin and the oxide film, and the oxide film and the base material are compared, and the adhesion strength between the oxide film and the base material is generally low. In this case, peeling may occur between the oxide film and the base material, allowing moisture and the like to enter therefrom, significantly reducing the reliability of the IC. Therefore, oxide film adhesion is one of the most important properties for high-strength, high-conductivity steel alloys used for lead frame materials and the like.
このような酸化膜密着性の厳しい要求に対し、現状の銅
合金では満足することができず、酸化膜密着性を改善し
た高力高導電性銅合金の出現が待たれていた。Current copper alloys cannot meet such strict requirements for oxide film adhesion, and the emergence of high-strength, high-conductivity copper alloys with improved oxide film adhesion has been awaited.
［課題を解決するための手段］
本発明はかかる点に鑑みなされたもので、半導体機器の
リード材として好適な２特性を有する鋼合金を提供しよ
うとするものである。[Means for Solving the Problems] The present invention has been made in view of the above points, and it is an object of the present invention to provide a steel alloy having two properties suitable as a lead material for semiconductor devices.
すなわち、本発明はＺｎＯ，１ｆｆ（量５以上１０重量
％以下を含み、さらにＢ ＳＰ −、Ｂ ｅ ｓ Ａ
１、Ａ、 ｓ ｓ Ｓ ｂ −、Ｓ ｔ ％ Ｔ
Ｉ ＳＣｒ ｓ Ｍ ｎ ｓ Ｍ ｇ ｓＦ
ｅ ｓ Ｃｏ、Ｎｔ、Ｚｒ、Ｍｏ、Ａｇ、 Ｃｄ
。That is, the present invention includes ZnO, 1ff (in an amount of 5 to 10% by weight, and further includes B SP -, B e s A
1, A, s s S b −, S t % T
I SCr s M n s M g sF
es Co, Nt, Zr, Mo, Ag, Cd
.
Ｐ ｂ、、Ｅ ｎｓ Ｈｆ ｓ Ｓ ｎｓ希土類元素か
らなる群より選択された１種又は２ＦＩｉ以上を総量で
０．０１ｆｆｉ量％以上１０重量％以下含み、残部Ｃｕ
および不可避的不純物からなることを特徴とする酸化膜
密着性に優れた高力高導電性銅合金およびＺｎＯ，１重
量％以上１０重量％以下を含み、さらにＢＳＰｓ Ｂｅ
５ＡＩＳＡＳ％ Ｓｂｓ Ｓ ｉ。Contains one or more FIi selected from the group consisting of rare earth elements in a total amount of 0.01% to 10% by weight, and the balance is Cu.
BSPs Be
5AISAS% Sbs Si.
Ｔ Ｒｓ Ｃｒ、Ｍｎ５Ｍｇ、Ｆｅ５Ｃｏ、Ｎｉ１Ｚｒ
、ＭｏＳＡｇ５Ｃｄｓ Ｐｂ、Ｉｎ、Ｈｆ。T Rs Cr, Mn5Mg, Fe5Co, Ni1Zr
, MoSAg5Cds Pb, In, Hf.
Ｓｎ、希土類元素からなる群より選択された１種又は２
ＦＩｉ以上を総量で０．旧重量％以上１０重量％以下含
み、残部Ｃｕおよび不可避的不純物からなり、表面粗さ
が、中心線平均粗さ（Ｒａ）で０．２０μ厘以下、最大
高さ（Ｒｍａｘ）で１．５μｍ以下であることを特徴と
する酸化膜密着性に優れた高力高導電性銅合金を提供し
ようとするものである。Sn, one or two selected from the group consisting of rare earth elements
FIi or above in total amount 0. Contains at least 10% by weight of old material, with the balance consisting of Cu and unavoidable impurities, and has a surface roughness of 0.20 μm or less in center line average roughness (Ra) and 1.5 μm or less in maximum height (Rmax). The present invention aims to provide a high-strength, high-conductivity copper alloy with excellent oxide film adhesion.
［発明の詳細な説明］
以下に本発明合金を構成する合金成分の限定理由を説明
する。[Detailed Description of the Invention] The reasons for limiting the alloy components constituting the alloy of the present invention will be explained below.
Ｚｎは銅や銅合金に含有することにより、銅および銅合
金の酸化膜密着性を改善する効果がある。Ｚｎの含有量
を０．１玉量％以上１０重量％以下と限定するのは、０
．Ｌｆｆｉｕ％未満では酸化膜密着性は改善されず、１
０重量％を越えると耐応力腐食割れ性が劣化するためで
ある。When Zn is contained in copper or copper alloy, it has the effect of improving the oxide film adhesion of copper and copper alloy. Limiting the Zn content to 0.1% by weight or more and 10% by weight or less is 0.
．． Below Lffiu%, oxide film adhesion is not improved;
This is because if it exceeds 0% by weight, stress corrosion cracking resistance will deteriorate.
Ｚｎ以外にＢＳＰＮ Ｂｅ、、ＡＬＳＡｓｓ ５ｂｓＳ
ｉｓ Ｔ ｉ ｓ Ｃｒ、Ｍｎ、Ｍｇ５Ｆｅ、Ｃ０％
Ｎｉ、Ｚ ｒ、Ｍｏ、Ａｇ、Ｃｄ、Ｐｂ、Ｉ ｎ。In addition to Zn, BSPN Be, ALSAs 5bsS
is Tis Cr, Mn, Mg5Fe, C0%
Ni, Zr, Mo, Ag, Cd, Pb, In.
Ｈｆ、Ｓｎ、希土類元素からなる群より選択された１ｇ
ｉ又は２種以上を含有するのは、Ｚｎのみの含有では強
度が不十分なため、強度を向上させるためである。含有
量を０．０１重量％以上、１０重量％以下限定するのは
０．０１重量％未満では強度向上の効果がなく、１０重
量％を越えると導電率が著しく低下するためである。1g selected from the group consisting of Hf, Sn, and rare earth elements
The reason for containing i or two or more is to improve the strength, since the strength is insufficient if only Zn is contained. The reason why the content is limited to 0.01% by weight or more and 10% by weight or less is that if it is less than 0.01% by weight, there is no effect of improving strength, and if it exceeds 10% by weight, the electrical conductivity will decrease significantly.
表面粗さを中心線平均粗さ（Ｒａ）で０．２０μｍ以下
、最大高さ（Ｒｍａｘ）で１．５μｍ以下とするのは、
表面を平滑にすることにより酸化膜密着性を向上させる
ためである。Setting the surface roughness to 0.20 μm or less in center line average roughness (Ra) and 1.5 μm or less in maximum height (Rmax) is as follows.
This is to improve oxide film adhesion by smoothing the surface.
次に本発明を実施例により具体的に説明する。Next, the present invention will be specifically explained using examples.
［実施例コ
第１表に示す本発明合金に係る各種成分組成のインゴッ
トを、電気銅あるいは無酸素銅を原料として高周波溶解
炉で、大気、又は不活性あるいは還元性雰囲気中で溶解
・鋳造を行った。[Example 1] Ingots having various component compositions of the alloy of the present invention shown in Table 1 were melted and cast using electrolytic copper or oxygen-free copper as a raw material in a high-frequency melting furnace in the air or in an inert or reducing atmosphere. went.
次にこれにインゴットの面側を行った後、８５０℃で１
時間加熱し、熱間圧延で５ｍｍの板とした後、冷間圧延
と中間焼鈍を適宜繰返し、最終的１：ｆ）、２５ｍの板
とし試験に供した。Next, after applying this to the ingot side, it was heated to 850℃ for 1
After heating for a period of time and hot rolling to form a 5 mm plate, cold rolling and intermediate annealing were repeated as appropriate to form a final 1:f), 25 m plate, which was used for testing.
リード材及びばね材としての評価項目として強度、引張
強さ、伸び、ばね限界値により評価した。電気伝導性（
放熱性）は導電率（％ＩＡＣ５）によって示した。繰り
返し曲げ性は曲げＲ０，２５ｍｍの折り曲げ治具を用い
、９０°往復曲げを行い破断までの回数を測定した。The evaluation items for lead material and spring material were strength, tensile strength, elongation, and spring limit value. Electrical conductivity (
Heat dissipation) was shown by electrical conductivity (%IAC5). Repeated bendability was measured by performing 90° reciprocating bending using a bending jig with a bending R0 of 25 mm and measuring the number of times until breakage.
半田付は性は、垂直式浸漬法によって、２３０±５℃の
半田浴（Ｓｎ６０％、Ｐ ｂ ４０％）に５秒間浸漬し
て半田のぬれの状態を目視観察することにより評価した
。半田の耐熱剥離性は、上記の方法で半田付けした試料
を大気中１５０℃、５００時間加熱後、０．２５ｍｍＨ
の９０″曲げを行い剥離の有無を評価した。Solderability was evaluated by vertical immersion method by immersing the sample in a solder bath (Sn 60%, Pb 40%) at 230±5° C. for 5 seconds and visually observing the state of solder wetting. The heat-resistant peelability of the solder was determined by heating the sample soldered by the above method in the air at 150°C for 500 hours, and then peeling the solder at 0.25 mmH.
90'' bending was performed to evaluate the presence or absence of peeling.
メツキ密着性は試料に厚さ ３μのＡｇメツキを施し、
４５０℃にて５分間加熱し、表面に発生するフクレの有
無を目視観察することにより評価した。プレス成形性は
打ち抜き加工後のブレス破面を観察することにより評価
した。The plating adhesion was determined by applying Ag plating with a thickness of 3μ to the sample.
The sample was heated at 450° C. for 5 minutes, and the presence or absence of blisters generated on the surface was visually observed to evaluate. Press formability was evaluated by observing the fractured surface of the press after punching.
耐熱性は加熱時間５分における軟化温度により評価した
。Heat resistance was evaluated based on the softening temperature at a heating time of 5 minutes.
酸化膜密着性は試料を２００〜５００℃の温度にて３分
間大気中で加熱して表面に酸化膜を生成させ、試料表面
に粘着テープをはり、テープを試料から一気にはがして
酸化膜の剥離の有無により評価を行った。酸化膜が剥離
し始める温度を第１表に示す。Oxide film adhesion is determined by heating the sample in the air at a temperature of 200 to 500°C for 3 minutes to form an oxide film on the surface, then applying adhesive tape to the sample surface and peeling off the tape from the sample at once to remove the oxide film. Evaluation was made based on the presence or absence of Table 1 shows the temperatures at which the oxide film begins to peel off.
〔発明の効果］
第１表において本発明合金Ｎｏ、４．７．８．９．１０
．１１は比較合金Ｎｏ、１４、Ｎｏ、１５またはＮｏ、
１７にＺｎ及びその他の元素を添加した合金である。Ｚ
ｎの添加により酸化膜密着性が著しく改浮されているこ
とが明らかである。また、本発明合金Ｎｏ、３は比較合
金Ｎｏ、ｌｆＳのＺｎ？１１度を高くした合金で、酸化
膜密着性が改善されている。[Effect of the invention] In Table 1, the invention alloy No. 4.7.8.9.10
．． 11 is comparative alloy No. 14, No. 15 or No.
This is an alloy in which Zn and other elements are added to No. 17. Z
It is clear that the oxide film adhesion was significantly improved by the addition of n. In addition, the present invention alloy No. 3 is the comparative alloy No. lfS Zn? This alloy has a higher temperature of 11 degrees and has improved oxide film adhesion.
本発明合金Ｎｏ、１２は、比較合金Ｎｏ、１８の表面粗
さを小さくした材料で、これにより他の２特性を維持し
たまま酸化膜密着性が改善されている。よって、本発明
合金は酸化膜密着性が著しく改善され、リードフレーム
等に用いられる高力高導電性銅合金として好適である。Alloy No. 12 of the present invention is a material in which the surface roughness of Comparative Alloy No. 18 is reduced, and thereby the oxide film adhesion is improved while maintaining the other two properties. Therefore, the alloy of the present invention has significantly improved oxide film adhesion and is suitable as a high-strength, high-conductivity copper alloy used in lead frames and the like.
Claims (2)
らに、Ｂ、Ｐ、Ｂｅ、Ａｌ、Ａｓ、Ｓｂ、Ｓｉ、Ｔｉ、
Ｃｒ、Ｍｎ、Ｍｇ、Ｆｅ、Ｃｏ、Ｎｉ、Ｚｒ、Ｍｏ、Ａ
ｇ、Ｃｄ、Ｐｂ、Ｉｎ、Ｈｆ、Ｓｎ、希土類元素からな
る群より選択された１種又は２種以上を総量で０．０１
重量％以上１０重量％以下含み、残部Ｃｕおよび不可避
的不純物からなることを特徴とする酸化膜密着性に優れ
た高力高導電性銅合金。(1) Contains 0.1% by weight or more and 10% by weight or less of Zn, and further contains B, P, Be, Al, As, Sb, Si, Ti,
Cr, Mn, Mg, Fe, Co, Ni, Zr, Mo, A
g, Cd, Pb, In, Hf, Sn, and one or more selected from the group consisting of rare earth elements in a total amount of 0.01
A high-strength, high-conductivity copper alloy with excellent oxide film adhesion, characterized by containing from 10% by weight to 10% by weight, with the remainder consisting of Cu and unavoidable impurities.
らにＢ、Ｐ、Ｂｅ、Ａｌ、ＡＳ、Ｓｂ、 Ｓｉ、Ｔｉ、Ｃｒ、Ｍｎ、Ｍｇ、Ｆｅ、Ｃｏ、Ｎｉ、Ｚ
ｒ、Ｍｏ、Ａｇ、Ｃｄ、Ｐｂ、Ｉｎ、Ｈｆ、Ｓｎ、希土
類元素からなる群より選択された１種又は２種以上を総
量で０．０１重量％以上１０重量％以下含み、残部Ｃｕ
および不可避的不純物からなり、表面粗さが、中心線平
均粗さ（Ｒａ）で０．２０μｍ以下、最大高さ（Ｒ＿ｍ
＿ａ＿ｘ）で１．５μｍ以下であることを特徴とする酸
化膜密着性に優れた高力高導電性銅合金。(2) Contains 0.1% by weight or more and 10% by weight or less of Zn, and further contains B, P, Be, Al, AS, Sb, Si, Ti, Cr, Mn, Mg, Fe, Co, Ni, Z
Contains one or more selected from the group consisting of r, Mo, Ag, Cd, Pb, In, Hf, Sn, and rare earth elements in a total amount of 0.01% by weight or more and 10% by weight or less, and the balance is Cu.
and unavoidable impurities, and the surface roughness is 0.20 μm or less in center line average roughness (Ra) and maximum height (R_m
A high-strength, high-conductivity copper alloy with excellent oxide film adhesion, characterized in that _a_x) is 1.5 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31495888A JPH02163331A (en) | 1988-12-15 | 1988-12-15 | High strength and high conductivity copper alloy having excellent adhesion for oxidized film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31495888A JPH02163331A (en) | 1988-12-15 | 1988-12-15 | High strength and high conductivity copper alloy having excellent adhesion for oxidized film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02163331A true JPH02163331A (en) | 1990-06-22 |
Family
ID=18059714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31495888A Pending JPH02163331A (en) | 1988-12-15 | 1988-12-15 | High strength and high conductivity copper alloy having excellent adhesion for oxidized film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02163331A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998048068A1 (en) * | 1997-04-18 | 1998-10-29 | Olin Corporation | Grain refined tin brass |
| US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
| US6749699B2 (en) | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
| JP2005187831A (en) * | 2003-12-24 | 2005-07-14 | Kobe Steel Ltd | Material for electric relay contact having excellent consumption-proof |
| JP2005187832A (en) * | 2003-12-24 | 2005-07-14 | Kobe Steel Ltd | Material for electric contact having excellent arc resistance |
| JP2007270171A (en) * | 2006-03-30 | 2007-10-18 | Dowa Holdings Co Ltd | High-conductivity copper-based alloy with excellent bendability, and its manufacturing method |
| CN110724850A (en) * | 2019-11-03 | 2020-01-24 | 霍山汇能汽车零部件制造有限公司 | Preparation method of radiator copper strip for automobile water tank |
| CN112143933A (en) * | 2020-08-18 | 2020-12-29 | 北京金鹏宝志科技有限公司 | Creep-resistant high-conductivity copper alloy in high-temperature environment |
-
1988
- 1988-12-15 JP JP31495888A patent/JPH02163331A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998048068A1 (en) * | 1997-04-18 | 1998-10-29 | Olin Corporation | Grain refined tin brass |
| US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
| US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
| US6074499A (en) * | 1998-01-09 | 2000-06-13 | South Dakoga School Of Mines And Technology | Boron-copper-magnesium-tin alloy and method for making same |
| US6749699B2 (en) | 2000-08-09 | 2004-06-15 | Olin Corporation | Silver containing copper alloy |
| CN1302145C (en) * | 2000-08-09 | 2007-02-28 | 奥林公司 | Silver containing copper alloy |
| JP2005187831A (en) * | 2003-12-24 | 2005-07-14 | Kobe Steel Ltd | Material for electric relay contact having excellent consumption-proof |
| JP2005187832A (en) * | 2003-12-24 | 2005-07-14 | Kobe Steel Ltd | Material for electric contact having excellent arc resistance |
| JP2007270171A (en) * | 2006-03-30 | 2007-10-18 | Dowa Holdings Co Ltd | High-conductivity copper-based alloy with excellent bendability, and its manufacturing method |
| CN110724850A (en) * | 2019-11-03 | 2020-01-24 | 霍山汇能汽车零部件制造有限公司 | Preparation method of radiator copper strip for automobile water tank |
| CN112143933A (en) * | 2020-08-18 | 2020-12-29 | 北京金鹏宝志科技有限公司 | Creep-resistant high-conductivity copper alloy in high-temperature environment |
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