JPH0266130A - Cu alloy for terminal and connector having less wear or blanking die - Google Patents
Cu alloy for terminal and connector having less wear or blanking dieInfo
- Publication number
- JPH0266130A JPH0266130A JP21452788A JP21452788A JPH0266130A JP H0266130 A JPH0266130 A JP H0266130A JP 21452788 A JP21452788 A JP 21452788A JP 21452788 A JP21452788 A JP 21452788A JP H0266130 A JPH0266130 A JP H0266130A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- die
- wear
- content
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 229910052718 tin Inorganic materials 0.000 claims abstract description 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052745 lead Inorganic materials 0.000 claims abstract 3
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 238000004080 punching Methods 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- 229910000711 U alloy Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000003353 gold alloy Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 241000287531 Psittacidae Species 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、端子・コネクタの製造に際して用いられる
打抜金型の摩耗がきわめて少なく、シたかって、打抜金
型の使用寿命の延命化を可能とするばかりでなく、端子
・コネクタに要求される強度、ばね性、耐熱クリープ性
、およびはんだの耐熱剥離性を具備したＣｕ合金に関す
るものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention has extremely low wear on punching dies used in the manufacture of terminals and connectors, thereby extending the useful life of the punching dies. The present invention relates to a Cu alloy that not only enables the above-mentioned properties, but also has the strength, spring properties, heat-resistant creep properties, and heat-resistant peeling properties of solder required for terminals and connectors.
一般に、端子・コネクタは、ＣＵ金合金して、特開昭６
３−７６８３９号公報に記載されるＮｉ、Ｓｉ。Generally, terminals and connectors are made of CU gold alloy.
Ni and Si described in Publication No. 3-76839.
Ｚｎ％およびＣａを主要合金成分とし、これにＭｇ、Ｂ
。Zn% and Ca are the main alloy components, and Mg, B
.
Ｃｒ、Ｍｎ、Ｃｏ、希土類元素、ＡＩ、Ｓｎ、およびＴ
１のうちの１種または２種以上を含有させたＣｕ合金や
。Cr, Mn, Co, rare earth elements, AI, Sn, and T
A Cu alloy containing one or more of the following.
特開昭６３−６２８３４号公報に記載されるＮ１および
８１を主要合金成分とし、これｉ’ｃＺｎ、 Ｐ 、
ａｎ。The main alloy components are N1 and 81 described in JP-A-63-62834, and these are i'cZn, P,
an.
Ａｓ、Ｃｒ、Ｍｇ、Ｍｎ、 Ｂｂ、ＩＰｅ、Ｃｏ、ＡＩ
、Ｔｉ、Ｚｒ、 Ｂｅ。As, Cr, Mg, Mn, Bb, IPe, Co, AI
, Ti, Zr, Be.
Ａｇ、Ｐｂ、Ｂ、および希土類元素のうちの１ｍまたは
２種以上を含有させたＣｕ合金などを用い、これらのＣ
ｕ合金の板材あるいは条材から金型を用いて所定形状の
端子・コネクタ素材を打抜加工し、ついで前記打抜加工
と同時に、あるいは別工程として前記素材を最終形状に
プレス成形する基本工程によって製造されている。These C
The basic process is to punch out a terminal/connector material of a predetermined shape from a U-alloy plate or strip using a die, and then press-form the material into the final shape either simultaneously with the punching or as a separate process. Manufactured.
しかし、上記の従来ＣＵ金合金おいては、これの板材あ
るいは条材の金型による打抜加工に際して。However, in the conventional CU gold alloy mentioned above, when punching the plate material or strip material using a die.
金型の摩耗（打抜金型摩耗）がはやく、寸法精度の面か
ら金型の使用寿命が短かくならざるを得ないのが現状で
ある。The current situation is that die wear (punching die wear) is rapid, and the service life of the die is inevitably shortened in terms of dimensional accuracy.
そこで１本発明者等は、上述のような観点から。 Therefore, the inventors of the present invention, etc., from the above-mentioned viewpoint.
打抜金型を極力摩耗させない端子・コネクタ用Ｃｕ合金
を開発すべく研究を行なった結果、Ｃｕ−Ｎｉ −８１
−Ｚｎ−８ｎ系合金にｓＭｇ、Ｃａ、およびｐｂを共存
含有させると、金型による打抜加工に際して金型の摩耗
が著しく低減するようになシ、さらに合金成分として含
有するＮｉ、 ８１． Ｚｎ、およびＳｎによって端子
・コネクタに要求される強度、ばね性、耐熱クリープ性
、およびはんだの耐熱剥離性を具備するようになるとい
う知見を得たのである。As a result of research to develop a Cu alloy for terminals and connectors that causes minimal wear on punching dies, Cu-Ni -81
- By co-containing sMg, Ca, and PB in the Zn-8n alloy, the wear of the die will be significantly reduced during punching using the die, and Ni, which is further contained as an alloy component, 81. It was discovered that Zn and Sn provide the strength, springiness, heat creep resistance, and heat peeling resistance of solder required for terminals and connectors.
この発明は、上記知見にもとづいてなされたものであっ
て１重量−で（以下−は重量ｓを示す）。This invention was made based on the above-mentioned knowledge, and is 1 weight - (hereinafter - indicates weight s).
Ｎｉ： ０．５〜３ ｓ、 ８ｉ：
０．０２〜Ｏ６７％。Ni: 0.5-3s, 8i:
0.02-67%.
Ｚｎ： Ｏ，ｌ〜３ ％、 Ｓｎ ：
Ｏ，１〜０．９４％Ｍｇ：Ｏ，ＯＯｌ 〜Ｏ−２％、
Ｃａ：Ｏ，ＯＯｌ 〜０．０１先Ｐｂ ：
０．００１〜Ｑ、Ｏ１％。Zn: O, l~3%, Sn:
O, 1 to 0.94% Mg: O, OOl to O-2%,
Ca:O,OOl ~0.01 ahead Pb:
0.001~Q, O1%.
を含有し、残りがＣｕと不可避不純物からなる組成を有
する打抜金型摩耗の少ない端子・コネクタ用Ｃｕ合金に
特徴を有するものである。The Cu alloy for terminals and connectors has a composition with the remainder consisting of Cu and unavoidable impurities, and is characterized by low wear on the punching die.
つぎに、この発明のＣｕ合金の成分組成を上記の通シに
限定した理由を説明する。Next, the reason why the composition of the Cu alloy of the present invention is limited to the above-mentioned standard will be explained.
（ａ） Ｎｉおよび８１
これらの成分は、共存した状態で化合物を形成し、もっ
て導電性の大幅な低下なく１強度を向上させると共に、
軟化温度を高めて、耐熱クリープ性金向上させる作用を
もつが、その含有量が、Ｎｉ：０．５１未満でも、また
８ｉ：Ｑ、０２％未満でも化合物の形成が不十分で、前
記作用に所望の効果が得られず、−万Ｎ１の含有量が３
−ｆ：越えても、また８１の含有量がＯ，フチを越えて
も熱間加工性が低下するようになることから、その含有
量を、それぞれＮｉ：０．５〜３ Ｌ ８１： ０．０
２〜０．１−と定めた。(a) Ni and 81 These components form a compound in the coexistence state, thereby improving the strength without significantly reducing the conductivity, and
It has the effect of increasing the softening temperature and improving the heat creep resistance of gold, but if the Ni content is less than 0.51% or 8i:Q less than 02%, the formation of the compound is insufficient and the above effect cannot be achieved. The desired effect was not obtained, and the content of -10,000 N1 was 3
-f: Even if the content of 81 exceeds O, the hot workability decreases even if the content exceeds the edge, so the content is changed to Ni: 0.5 to 3 L 81: 0 .0
It was set as 2 to 0.1-.
（ｂ） Ｚｎ
Ｚｎ成分には、はんだの耐熱剥離性を向上させるほか、
鋳造性を改善する作用があるが、その含有量がＯ，１４
未満では前記作用に所望の効果が得られず、一方その含
有量が３ｓを越えると、はんだ付は性が損なわれるよう
になることから、その含有量をＯ，ｌ−３％と定めた。(b) Zn The Zn component not only improves the heat peeling properties of solder, but also
It has the effect of improving castability, but its content is O,14
If the content is less than 3%, the desired effect cannot be obtained, while if the content exceeds 3s, the soldering properties will be impaired, so the content was set at 0.1%.
（ｃ） ５ｎ
８ｎ成分には、ばね性を一段と向上させる作用があるが
、その含有量がＯ，１４未満では所望のばね性を確保す
ることができず、一方その含有量が０．９−を越えると
導電性に低下傾向が現われるようになることから、その
含有量を０．１〜０．９−と定めた。(c) The 5n 8n component has the effect of further improving the springiness, but if the content is less than O.14, the desired springiness cannot be secured; If the content exceeds 0.1 to 0.9, the conductivity tends to decrease, so the content was determined to be 0.1 to 0.9.
ｆａ） ｕｇ ＊ ｃａ ＊ およびｐｂこれらの成分
には、３者が共存した状態で打抜金型の摩耗を著しく低
減する作用があシ、シたがってこれら３成分のうちのい
ずれかの成分でも所定量含有しない場合、すなわちいず
れかの成分でも、その含有量がｏ、 ｏ Ｏｌチ未満に
なると、打抜金型の摩耗低減効果が得られず、一方その
含有量が、 Ｍｇ１Ｃあっては０．２−を越えると、Ｃ
ｕ合金溶湯調製後の鋳塊への鋳造性が悪化し、鋳塊欠陥
が増加するようになり、またＣａにあっては０．Ｏｌチ
を越えると、添加含有時の酸化消耗が激しく、含有歩留
が著しく低下するようになって経済的でなく。fa) ug * ca * and pb These components have the effect of significantly reducing the wear of the punching die when the three components coexist, therefore, even if any of these three components If the predetermined amount of Mg1C is not included, that is, if the content of any component is less than o, ool, the effect of reducing the wear of the punching die cannot be obtained, whereas if the content is Mg1C, it will be 0 If it exceeds .2-, C
Castability into an ingot after preparing a molten U alloy deteriorates, ingot defects increase, and Ca content is 0. If it exceeds 100 ml, oxidation consumption will be severe during addition, and the yield will drop significantly, making it uneconomical.
さらＫｐｂにあっては０．０１−を越えると、鋳造時に
結晶粒界に析出するようになシ、熱間圧延性が低下する
ようになることから、その含有量をそれぞれＭｇ：（Ｌ
ＯＯＩ〜α２ ％、 Ｃａ ： ０．００１〜０．０１
％＆およびＰＩ）：０．００１〜Ｑ、Ｏｌ−と定めた
。Furthermore, when Kpb exceeds 0.01-, it tends to precipitate at grain boundaries during casting and hot rollability decreases, so the content of Mg: (L
OOI~α2%, Ca: 0.001~0.01
% & and PI): 0.001 to Q, Ol-.
つぎに、この発明のＣｕ合金を実施例によ）具体的に説
明する。Next, the Cu alloy of the present invention will be specifically explained using examples.
通常の低周波溝型溶解炉を用い、木炭被覆下の大気雰囲
気中で、それぞれ第１表に示されるＣｕ合金溶湯をｖ４
製し、半連続鋳造法により厚さ：１６０ＷＸ＠： ４５
０ｓｍＸ長さ：２４００ｆｉの寸法をもった鋳塊に鋳造
し、この鋳塊に、１５０〜９００℃の範囲内の所定の圧
延開始温度で熱間圧延を施して、厚さ：１０１ＩａｌＩ
の熱延板とした後、直ちに水冷し、スケール除去の面削
を行ない、ついでこの熱延板に、冷間圧延と焼鈍とを繰
シ返し施し、５〇−の圧延率にて仕上げ圧延を行なって
厚さ： ０．２５騙の条材とし、最終的に２５０〜！５
５０℃の範囲内の所定温度１ｃ１時間保持の条件で焼鈍
を施すことによって本発明Ｃｕ合金材１〜１０および比
較ＣＵ合金材１〜８を製造した。Using an ordinary low-frequency groove-type melting furnace, the Cu alloy melts shown in Table 1 were melted into v4 in an atmospheric atmosphere under charcoal coating.
Thickness: 160WX@: 45 by semi-continuous casting method.
An ingot with dimensions of 0sm x length: 2400fi is cast, and this ingot is hot rolled at a predetermined rolling start temperature within the range of 150 to 900°C to obtain a thickness of 101IalI.
After being made into a hot-rolled sheet, it was immediately cooled with water and subjected to face milling to remove scale, and then this hot-rolled sheet was subjected to repeated cold rolling and annealing, and finish rolling was performed at a rolling rate of 50-. Thickness: I made a strip of 0.25mm, and the final thickness was 250~! 5
Cu alloy materials 1 to 10 of the present invention and comparative CU alloy materials 1 to 8 were manufactured by annealing under the condition of holding at a predetermined temperature of 1 c for 1 hour within the range of 50°C.
なお、比較Ｃｕ合金材１〜Ｂは、いずれも構成成分のう
ちのいずれかの成分含有量（第１表に葺印を付す）がこ
の発明の範囲から外れた組成をもつものである。Note that Comparative Cu alloy materials 1 to B all have compositions in which the content of one of the constituent components (marked in Table 1) is outside the scope of the present invention.
つぎに、この結果得られ九各種のＣｕ合金材について、
引張試験、はんだの熱剥離試験、および打抜金型摩耗試
験を行ない、かっばね限界値を測定すると共に、応力緩
和車を算定し、耐熱クリープ性を評価した。Next, regarding the nine types of Cu alloy materials obtained as a result,
A tensile test, a solder thermal peeling test, and a punching die wear test were conducted to measure the cap spring limit, calculate the stress relaxation wheel, and evaluate the heat creep resistance.
なお、引張試験は、圧延方向に干行く採取したＪＩ８５
号試験片を用いて行ない、引張強さと伸びｔ−測定した
。In addition, the tensile test was conducted using JI85 samples taken as they dried in the rolling direction.
The tensile strength and elongation t were measured using a No. 1 test piece.
また、はんだの熱剥離試験は、厚さ：０．２５１１Ｊｌ
ｘ幅：１５ｗＸ長さ：６０ｍＥＩｇの寸法をもった試験
片ヲ、ロジン７ラツクスで処理し、温度：２３０℃の６
０チＳｎ −４０チルｂ合金のはんだ浴中に浸漬して、
その表面に前記はんだを付着させ、この状態で、大気中
、温度：１５０℃Ｋ１００Ｏ時間保持の条件で加熱し、
加熱後、試験片を１８０°密着曲げし、再び１８０°曲
げ戻す条件で行ない、この１８０＠曲げ部におけるはん
だ剥離の有無を観察し丸。In addition, the thermal peeling test of solder was conducted with a thickness of 0.2511 Jl.
A test piece with the dimensions x width: 15w x length: 60mEIg was treated with rosin 7lux and heated at 60°C at a temperature of 230°C.
Immersed in a solder bath of 0 Chi Sn-40 Chi B alloy,
The solder is attached to the surface, and in this state, heated in the atmosphere at a temperature of 150 ° C. K 100 O for a period of time,
After heating, the test piece was closely bent by 180° and then bent back by 180°, and the presence or absence of solder peeling at this 180° bent portion was observed.
さらに、打抜金型摩耗試験は、金型として市販のＣｏ：
ｌ ６チ、ｗｅ：残ｐからなる組成を有するｗｅ基超
硬合金製のものを用い、直径：５１１１１の円形チップ
を１００万個打抜き、打抜加工開始から２０個の穴径と
１００万個の打抜加工終了直前の２０個の穴径をそれぞ
れ測定し、それぞれの２０個の平均値から変化量を求め
て金型の摩耗量とし。Furthermore, the punching die wear test was conducted using commercially available Co as the die.
1 million circular chips with a diameter of 51111 were punched using a material made of we-based cemented carbide having a composition consisting of l 6chi, we: residual p, and 20 hole diameters and 1 million chips were punched from the start of the punching process. The diameter of each of the 20 holes was measured just before the end of the punching process, and the amount of change was determined from the average value of each of the 20 holes, which was determined as the amount of wear on the mold.
第１表の比較ＣＵ合金材５の摩耗量を１とし、これに対
する相対値として表わした。The wear amount of Comparative CU alloy material 5 in Table 1 is assumed to be 1, and the values are expressed as relative values to this.
また、ばね限界値は、ＪＸＢ・Ｈ３１３０のモーメント
式試験によシ測定した。Further, the spring limit value was measured by a moment type test of JXB H3130.
さらに、耐熱クリープ性を評価するための応力緩和率は
、厚さ：０．２５鵡Ｘ＠：１２．フ鵡×長さ：１２０ｉ
ｍ（以下Ｌ０とする）の寸法をもった試験片を使用し、
この試験片を長さ：１ｌＯ１１１Ｘ深さ＝３Ｂの水平縦
長溝を有する治具に前記試験片の中央部が上方に膨出す
るように彎曲セットしくこの時の試験片の両端部間の距
離二１１０ｍをＬｌとする）、この状態で温度：１５０
Ｃに１０００時間保持し、加熱後、前記治具から取りは
ずした状態における前記試験片の両端部間の距離（以下
Ｌ２とする）を測定し、計算式：
％式％
により算出することによシ求めた。したがって、応力緩
和率の値が小さければ小さいほど、長時間の熱応力に対
する変化（なじみ性）が低いことになり、耐熱クリーブ
性のすぐれたものであることを示している。これらの結
果を第１表に示した。Furthermore, the stress relaxation rate for evaluating heat-resistant creep property is: thickness: 0.25 x @: 12. Parrot x length: 120i
Using a test piece with dimensions of m (hereinafter referred to as L0),
This test piece was set in a jig having a horizontal longitudinal groove of length: 1 lO 111 x depth = 3 B in a curved manner so that the center part of the test piece bulged upward. At this time, the distance between both ends of the test piece was 2. 110m is Ll), temperature in this state: 150
C for 1000 hours, and after heating, measure the distance between both ends of the test piece (hereinafter referred to as L2) in the state of removing it from the jig, and calculate it using the formula: % formula %. I asked for it. Therefore, the smaller the value of the stress relaxation rate, the lower the change (compatibility) with long-term thermal stress, indicating that the material has excellent heat-resistant cleaving properties. These results are shown in Table 1.
第１表に示される結果から１本発明Ｃｕ合金材１〜１０
は、いずれもこれの打抜加工に用いられる金型の摩耗が
、従来端子・コネクタ用ＣＵ合合材と同等の金型平均摩
耗率を示す比較Ｃｕ合金材５〜８に比して著しく少なく
、その上端子・コネクタに要求される５ ｓ ｋｙｆ
／ ＪＥ１２以上の引張強さおよび３５に９ｆ／■２以
上のばね限界値を十分に余裕をもって具備し、かつすぐ
れた耐熱クリープ性およびはんだの耐熱剥離性を有する
のく対して、比較Ｃｕ合金材１〜８に見られるように、
構成成分のうちのいずれかの成分含有量でもこの発明の
範囲から低い方に外れると上記の特性のうちの少なくと
もいずれかの性質が劣ったものになることが明らかであ
る。From the results shown in Table 1, 1 the present invention Cu alloy materials 1 to 10
The wear of the molds used for punching them is significantly lower than Comparative Cu alloy materials 5 to 8, which have the same average mold wear rate as conventional CU composite materials for terminals and connectors. In addition, 5 s kyf required for terminals and connectors
/Comparative Cu alloy material has a tensile strength of JE12 or more, a spring limit value of 35 to 9f/■2 or more with sufficient margin, and has excellent heat-resistant creep property and heat-resistant peeling property of solder. As seen in 1-8,
It is clear that if the content of any of the constituent components is lower than the range of the present invention, at least one of the above-mentioned properties will be inferior.
また、上記の本発明ＣＵ合金材１〜１０は、いずれも端
子・コネクタに要求される３ ０ ％ （ＩＡＣ８Ｓ）
以上の高い導を率を示し丸。In addition, all of the above-mentioned CU alloy materials 1 to 10 of the present invention have a content of 30% (IAC8S) required for terminals and connectors.
A circle indicates a higher conductivity rate.
上述のように、この発明のＣｕ合金は、端子・コネクタ
に要求される強度、ばね性、耐熱クリープ性、およびは
んだの耐熱剥離性を具備した上で、端子・コネクタの製
造に際して用いられる打抜金型の摩耗を著しく低減する
ことを可能とし、打抜金型の使用寿命の延命化に寄与し
、大なる経済効果をもたらすなど工業上有用な特性を有
するのである。As mentioned above, the Cu alloy of the present invention has the strength, spring properties, heat creep resistance, and heat peeling resistance of solder required for terminals and connectors, and can also be used for punching used in the manufacture of terminals and connectors. It has industrially useful properties such as making it possible to significantly reduce the wear of the die, contributing to extending the useful life of the punching die, and bringing about great economic effects.
Claims (1)
、Ｚｎ：０．１〜３％、Ｓｎ：０．１〜０．９％、Ｍｇ
：０．００１〜０．２％、Ｃａ：０．００１〜０．０１
％、Ｐｂ：０．００１〜０．０１％、 を含有し、残りがＣｕと不可避不純物からなる組成（以
上重量％）を有することを特徴とする打抜金型摩耗の少
ない端子・コネクタ用Ｃｕ合金。(1) Ni: 0.5-3%, Si: 0.02-0.7%
, Zn: 0.1-3%, Sn: 0.1-0.9%, Mg
:0.001~0.2%, Ca:0.001~0.01
%, Pb: 0.001 to 0.01%, and the remainder is Cu and unavoidable impurities (weight %). alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21452788A JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21452788A JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266130A true JPH0266130A (en) | 1990-03-06 |
| JPH0524217B2 JPH0524217B2 (en) | 1993-04-07 |
Family
ID=16657200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21452788A Granted JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266130A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04276036A (en) * | 1991-03-01 | 1992-10-01 | Mitsubishi Shindoh Co Ltd | Cu alloy sheet material for electrical and electronic parts having effect of suppressing wear in blanking die |
| US6334915B1 (en) | 1998-03-26 | 2002-01-01 | Kabushiki Kaish Kobe Seiko Sho | Copper alloy sheet for electronic parts |
| JP2017179512A (en) * | 2016-03-31 | 2017-10-05 | Ｊｘ金属株式会社 | Cu-Ni-Si-BASED COPPER ALLOY AND MANUFACTURING METHOD THEREFOR |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127842A (en) * | 1984-11-24 | 1986-06-16 | Kobe Steel Ltd | Copper alloy for terminal and connector and its manufacture |
| JPS6376839A (en) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment and its production |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
-
1988
- 1988-08-29 JP JP21452788A patent/JPH0266130A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127842A (en) * | 1984-11-24 | 1986-06-16 | Kobe Steel Ltd | Copper alloy for terminal and connector and its manufacture |
| JPS6376839A (en) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment and its production |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04276036A (en) * | 1991-03-01 | 1992-10-01 | Mitsubishi Shindoh Co Ltd | Cu alloy sheet material for electrical and electronic parts having effect of suppressing wear in blanking die |
| US6334915B1 (en) | 1998-03-26 | 2002-01-01 | Kabushiki Kaish Kobe Seiko Sho | Copper alloy sheet for electronic parts |
| KR100336173B1 (en) * | 1998-03-26 | 2002-05-09 | 구마모토 마사히로 | Copper alloy sheet for electronic parts |
| JP2017179512A (en) * | 2016-03-31 | 2017-10-05 | Ｊｘ金属株式会社 | Cu-Ni-Si-BASED COPPER ALLOY AND MANUFACTURING METHOD THEREFOR |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0524217B2 (en) | 1993-04-07 |
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