JP5297855B2 - Copper alloy sheet and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a Cu-Fe-P-based copper alloy sheet having high strength, superior electrical conductivity and superior thermal resistance, and to provide a method for manufacturing the copper alloy sheet at a low cost. <P>SOLUTION: This manufacturing method includes: preparing an ingot by melting a raw material of a copper alloy which has a composition comprising, by mass%, 1.5-3.0% Fe, 0.01-0.2% P, 0.01-0.5% Zn, 0.5% or less Sn and the balance Cu with unavoidable impurities and by casting the melt; heating and holding the ingot; then hot-rolling the ingot at 450-1,000&deg;C so that the reduction ratio in a temperature range of 450-600&deg;C becomes 20% or more; subsequently age-annealing the hot-rolled plate so that the electroconductivity after the age annealing becomes 60-70% IACS; after that, cold-rolling the plate with the reduction ratio of 80% or more; and then annealing the cold-rolled sheet at a low temperature of 150-450&deg;C. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a copper alloy sheet and a method for manufacturing the same, and more particularly to a Cu—Fe—P copper alloy sheet used for a lead frame and the method for manufacturing the same.

  Materials used for electrical and electronic parts such as lead frames are required to have high strength and excellent conductivity and heat resistance. In particular, the lead frame is generally processed into a shape having a large number of pins by a stamping process (press punching process), and is heat-treated at a high temperature in order to remove distortion during the stamping process. Is required. As such a material, a Cu—Fe—P based copper alloy such as CDA194 alloy is used.

  In recent years, with the increase in capacity, miniaturization, and high functionality of semiconductor devices that use lead frames and the like, materials used for lead frames and the like are required to have higher strength and conductivity.

  Therefore, it has been proposed to add Mg as a new additive element to a lead material made of a Cu—Fe—P based copper alloy to improve strength and heat resistance without impairing conductivity (for example, patents). Reference 1). Also, the Cu-Fe-P-based copper alloy material is subjected to solution heat treatment and intermediate cold rolling before aging treatment at high and low temperatures to improve strength and heat resistance without causing a decrease in conductivity. (For example, refer to Patent Document 2). Furthermore, it is proposed that Cu-Fe-P-based copper alloy materials be subjected to high-temperature and low-temperature two-step aging treatment after hot working and before cold working to improve conductivity without losing high strength. (For example, see Patent Document 3).

Japanese Examined Patent Publication No. 64-449 (2nd page) Japanese Patent No. 3896793 (paragraph numbers 0010-0012) Japanese Patent Laid-Open No. 10-324935 (paragraph number 0007-0015)

  However, when Mg is added as a new element as in Patent Document 1, the number of management items for manufacturing a copper alloy increases, and the cost increases. Further, as in Patent Document 2, solution heat treatment and intermediate cold rolling are performed before high temperature and low temperature aging treatment, or as shown in Patent Document 3, high temperature and low temperature after hot working and before cold working. When the two-stage aging treatment is performed, the number of processes increases, complicated temperature management becomes necessary, and the cost increases.

  Therefore, in view of such conventional problems, the present invention provides a copper alloy sheet material capable of producing a Cu-Fe-P-based copper alloy sheet material having high strength and excellent conductivity and heat resistance at low cost, and It aims at providing the manufacturing method.

  As a result of intensive studies to solve the above problems, the present inventors have found that 1.5 to 3.0% by mass of Fe, 0.01 to 0.2% by mass of P, and 0.01 to 0. After heating and holding an ingot obtained by melting and casting a copper alloy material having a composition containing 5% by mass of Zn and 0.5% by mass or less of Sn and the balance being Cu and inevitable impurities, 600 Hot rolling is performed at 1000 ° C. to 450 ° C. so that the degree of work is 20% or more in the temperature range of ℃ to 450 ° C., and then age annealing is performed so that the electrical conductivity after aging annealing is 60 to 70% IACS. As a result, it was found that a Cu—Fe—P-based copper alloy sheet material having high strength and excellent electrical conductivity and heat resistance can be produced at low cost, and the present invention has been completed.

  That is, the method for producing a copper alloy sheet according to the present invention comprises 1.5 to 3.0% by mass of Fe, 0.01 to 0.2% by mass of P, and 0.01 to 0.5% by mass of Zn. And after heating and holding the ingot which melt | dissolved and cast the raw material of the copper alloy which has Sn and 0.5 mass% or less Sn and the remainder is a composition which is Cu and an unavoidable impurity, it is 600 to 450 degreeC. It is characterized by performing hot rolling at 1000 ° C. to 450 ° C. so that the workability becomes 20% or more in the temperature range, and then performing aging annealing so that the electrical conductivity after aging annealing is 60 to 70% IACS. And

  In this method for producing a copper alloy sheet, the content of Fe in the raw material of the copper alloy is 2.1 to 3.0% by mass, the content of P is 0.015 to 0.15% by mass, and the content of Zn is It is preferable that 0.02 to 0.2 mass% and the Sn content is 0.1 mass% or less. Moreover, it is preferable to perform cold rolling after performing an aging treatment, and it is preferable that the workability of cold rolling is 80% or more. Moreover, it is preferable to perform low temperature annealing at 150-450 degreeC after performing cold rolling. Furthermore, it is preferable to perform aging annealing at 400-650 degreeC for 5 to 15 hours.

  Further, the copper alloy sheet according to the present invention comprises 1.5 to 3.0% by mass of Fe, 0.01 to 0.2% by mass of P, 0.01 to 0.5% by mass of Zn, 0% 0.5% by mass or less of Sn, the balance being Cu and unavoidable impurities, conductivity of 60% IACS or more, Vickers hardness HV of 150 or more, after holding at 450 ° C. for 30 minutes Vickers hardness HV is 140 or more.

In this copper alloy sheet, the Fe content is 2.1 to 3.0 mass%, the P content is 0.015 to 0.15 mass%, and the Zn content is 0.02 to 0.2 mass%. The Sn content is preferably 0.1% by mass or less. Further, if the X-ray diffraction intensity of the {220} crystal plane on the plate surface of this copper alloy sheet is I {220}, and the X-ray diffraction intensity of the {220} crystal plane of the pure copper standard powder is I ₀ {220}, I {220} / I ₀ {220} is preferably 3.5 or more, and I {220} / I ₀ {220} after being held at 450 ° C. for 30 minutes is preferably 3.0 or more.

  According to the present invention, a Cu—Fe—P-based copper alloy sheet material having high strength and excellent electrical conductivity and heat resistance can be produced at low cost.

  In the embodiment of the method for producing a copper alloy sheet according to the present invention, 1.5 to 3.0 mass% Fe, 0.01 to 0.2 mass% P, and 0.01 to 0.5 mass% After heating and holding an ingot obtained by melting and casting a raw material of a copper alloy having a composition containing Zn and 0.5 mass% or less of Sn and the balance being Cu and inevitable impurities, 600 ° C. to 450 ° C. Perform hot rolling at 1000 ° C. to 450 ° C. so that the workability is 20% or more in the temperature range of ° C., and then perform aging annealing so that the electrical conductivity after aging annealing is 60 to 70% IACS, Then, after performing cold rolling with a workability of 80% or more, preferably 90% or more, low-temperature annealing is performed at 150 to 450 ° C.

  Fe has an effect of improving the strength of the copper alloy sheet, but if the content is less than 1.5% by mass, the strength is not sufficiently improved, and if it exceeds 3.0% by mass, the conductivity decreases. The Fe content is preferably 1.5 to 3.0 mass%, more preferably 2.1 to 3.0 mass%.

  P has a deoxidizing action of the molten metal and has an action of improving conductivity and strength by forming and precipitating a compound with Fe. However, when its content is less than 0.01% by mass, these actions are not achieved. When it exceeds 0.2% by mass, these actions are saturated and not economical, so the P content is preferably 0.01-0.2% by mass, preferably 0.015-0. More preferably, it is 15 mass%.

  Zn, like P, has a deoxidizing action of the molten metal, but if its content is less than 0.01% by mass, the deoxidizing action is insufficient, and if it exceeds 0.5% by mass, the deoxidizing action is saturated. Therefore, the Zn content is preferably 0.01 to 0.5% by mass, and more preferably 0.02 to 0.2% by mass.

  Sn has the effect of improving the heat resistance of the copper alloy sheet, but if its content exceeds 0.5% by mass, it segregates macroscopically and the hot workability decreases, so the Sn content is 0.5% by mass. % Or less is preferable, and 0.1% by mass or less is more preferable.

  In addition, when using the scrap of an electronic material etc. as a raw material of a copper alloy board | plate material, the element mixed in the scrap may be inevitably mixed in the raw material. Moreover, when manufacturing many types of copper alloys, if the raw materials of the respective copper alloys are melted in the same melting furnace, the components of the previous copper alloy may be mixed in the raw materials, though only slightly. Examples of such inevitable impurities include Ni, Mg, Ca, Al, Si, Cr, Mn, Zr, Ag, Cd, Be, Ti, Co, S, Au, Pt, Pb, Bi, and Sb, respectively. You may contain in 0.02 mass% or less and the total 0.05 mass% or less range.

  According to the embodiment of the method for producing a copper alloy sheet according to the present invention, an ingot for melting and casting a copper alloy raw material can be produced by an ordinary continuous or semi-continuous casting method of a copper alloy.

  This ingot is hot-rolled after being held in a heating furnace at a temperature of about 900 to 1000 ° C. for 2 hours or more. The temperature during the hot rolling is about 1000 ° C. to 350 ° C., but the degree of work is 10% or more, preferably 20% or more in the temperature range of 600 ° C. to 350 ° C., preferably 600 ° C. to 450 ° C. Hot rolling is performed. It is considered that fine Fe or Fe-P compounds are precipitated in the copper matrix by this hot rolling. In hot rolling in the temperature range of 600 ° C. to 350 ° C., preferably in the low temperature range of 600 ° C. to 450 ° C., the formation of fine precipitates that do not occur in the high temperature range and the fineness due to the dynamic precipitation of intermetallic compounds. Therefore, even if the temperature of the subsequent aging annealing treatment is lowered and the time is shortened, both the hardness and the conductivity can be increased. Further, if the electrical conductivity after hot rolling is less than 40% IACS, the progress of precipitation of Fe or Fe-P compounds is insufficient, and it is difficult to refine the precipitates obtained by subsequent aging annealing treatment. On the other hand, if the electrical conductivity after hot rolling exceeds 85% IACS, the precipitates may become coarse, so the electrical conductivity after hot rolling is 40-85% IACS. 40 to 60% IACS is more preferable, and 40 to 50% IACS is most preferable. However, by performing the above hot rolling, the conductivity after hot rolling is set within this range. be able to.

  The aging annealing after the hot rolling is performed so that the electrical conductivity after the aging annealing is 60 to 70% IACS. If the electrical conductivity after aging annealing is lower than 60% IACS, a copper alloy sheet with high electrical conductivity cannot be produced. On the other hand, if the electrical conductivity after aging annealing is higher than 70% IACS, the hardness after heating is high. Or the precipitate becomes coarse and the flexibility is lowered. Thus, in order for the electrical conductivity after aging annealing to be 60 to 70% IACS, it is preferable to perform aging annealing at 400 to 650 ° C. for 5 to 15 hours. It is considered that the electrical conductivity tends to be high and the heat resistance tends to deteriorate as the temperature and time are increased. Therefore, it is preferable to perform aging annealing under appropriate conditions according to the characteristics required for the copper alloy sheet. In addition, when it is difficult in terms of equipment, it is thought that there is no problem even if aging annealing is performed after hot rolling the copper alloy sheet material, then chamfering and cold rolling, but pickling after aging annealing is not a problem. The cost increases because it needs to be done.

  Further, the final cold rolling after aging annealing is performed so as to obtain a desired plate thickness. Generally, as the degree of processing increases, the strength increases, but the heat resistance is considered to decrease. However, the copper alloy sheet produced by the embodiment of the method for producing a copper alloy sheet according to the present invention has excellent heat resistance even when the workability of the final cold rolling is 80% or more, preferably 90% or more. Have. Further, depending on the required strength and plate thickness, it is necessary to perform low temperature annealing after the final cold rolling. This low-temperature annealing is a strain relief annealing, and is performed to recover the lowered conductivity by increasing the workability.

The embodiment of the copper alloy sheet according to the present invention is 1.5 to 3.0% by mass, preferably 2.1 to 3.0% by mass of Fe and 0.01 to 0.2% by mass, preferably 0. .015 to 0.15 mass% P, 0.01 to 0.5 mass%, preferably 0.02 to 0.2 mass% Zn, and 0.5 mass% or less, preferably 0.1 mass% %, Sn is a plate material made of a u-Fe-P alloy having the composition of Cu and inevitable impurities, the conductivity is 60% IACS or more, the Vickers hardness HV is 150 or more, 450 The Vickers hardness HV after holding at 30 ° C. for 30 minutes is 140 or more. Further, if the X-ray diffraction intensity of the {220} crystal plane on the plate surface of this copper alloy sheet is I {220}, and the X-ray diffraction intensity of the {220} crystal plane of the pure copper standard powder is I ₀ {220}, I {220} / I ₀ {220} is preferably 3.5 or more, and I {220} / I ₀ {220} after being held at 450 ° C. for 30 minutes is preferably 3.0 or more.

  Hereinafter, examples of the copper alloy sheet material and the manufacturing method thereof according to the present invention will be described in detail.

[Examples 1-7]
Copper alloy of chemical composition shown in Table 1 (2.12 mass% Fe, 0.029 mass% P, 0.08 mass% Zn, 0.024 mass% Sn, the balance being Cu and A copper alloy composed of inevitable impurities) was melted in a high-frequency melting furnace to prepare seven ingots having a thickness of 30 mm × width of 50 mm × length of 150 mm.

  These ingots were held at 900 to 950 ° C. for 3 hours in a heating furnace, and then hot rolled at 900 to 450 ° C. to obtain a rolled material having a plate thickness of 10 mm. The hot rolling was performed for 9 passes in a temperature range of 900 to 600 ° C., then for 1 pass in a temperature range of 600 to 450 ° C., and the degree of work performed in the temperature range of 600 to 450 ° C. was 30%. The electrical conductivity after hot rolling was measured and found to be 42.9% IACS.

  Next, the obtained rolled material was subjected to isothermal aging in an annealing furnace at 550 ° C. for 5 hours (Example 1), 550 ° C. for 7 hours (Example 2), and 550 ° C. for 9 hours (Example 3). The reaction was quenched at 550 ° C. for 15 hours (Example 4), 450 ° C. for 9 hours (Example 5), 500 ° C. for 9 hours (Example 6), and 600 ° C. for 9 hours (Example 7). The electrical conductivity after the aging treatment was measured in accordance with the electrical conductivity measurement method of JIS H0505. The results were 62.5% IACS (Example 1), 64.7% IACS (Example 2), and 66.1% IACS (implemented). Example 3), 68.7% IACS (Example 4), 63.7% IACS (Example 5), 66.3% IACS (Example 6), 64.0% IACS (Example 7), All were 60 to 70% IACS.

  Finally, after polishing the front and back surfaces of the rolled material after aging annealing, performing finish cold rolling at a workability (rolling rate) of 99%, performing low temperature annealing for 30 minutes in a 300 ° C. annealing furnace Thus, a copper alloy plate material having a plate thickness of 0.125 mm was produced. The production conditions for these copper alloy sheets are shown in Tables 1 and 2.

  The electrical conductivity of the copper alloy sheet material thus obtained was measured according to the electrical conductivity measurement method of JIS H0505. The results were 60.0% IACS (Example 1), 61.5% IACS (Example 2), 63, respectively. 0.0% IACS (Example 3), 64.5% IACS (Example 4), 61.2% IACS (Example 5), 63.3% IACS (Example 6), 62.5% IACS (implemented) Example 7), both of which were 60% IACS or higher.

  Moreover, when the Vickers hardness HV of the obtained copper alloy sheet material was measured in accordance with JIS Z2244, 170 (Example 1), 169 (Example 2), 169 (Example 3), 165 (Example), respectively. 4), 165 (Example 5), 166 (Example 6), and 165 (Example 7), all of which were 150 or more.

Further, the X-ray diffraction intensity of the obtained copper alloy sheet was measured. The X-ray diffraction intensity (X-ray diffraction integrated intensity) is measured by preparing a sample of a copper alloy sheet material polished with a # 1500 water-resistant paper and using an X-ray diffractometer (XRD). , By measuring the X-ray diffraction intensity (intensity of reflection diffraction area) I {220} of the {220} plane on the polished surface of the sample under the conditions of Mo-Kα ray, tube voltage 20 kV, and tube current 2 mA. . On the other hand, using the same X-ray diffractometer, the X-ray diffraction intensity I ₀ {220} of the {220} plane of pure copper standard powder was also measured under the same measurement conditions. Using these measured values, the X-ray diffraction intensity ratio I {220} / I ₀ {220} was determined. As a result, I {220} / I ₀ {220} is 4.1 (Example 1), 3.8 (Example 2), 3.7 (Example 3), and 4.1 (Example 4), respectively. 3.9 (Example 5), 3.9 (Example 6), and 3.9 (Example 7), all of which were 3.5 or more.

  Next, after performing the heat resistance test which hold | maintains the obtained copper alloy board | plate material at 450 degreeC for 30 minute (s), when Vickers hardness HV was measured, 153 (Example 1), 147 (Example 2), 146 ( Example 3), 142 (Example 4), 146 (Example 5), 145 (Example 6), and 148 (Example 7), all of which were 140 or more.

Further, the copper alloy sheet after the heat resistance test holding at 450 ° C. 30 minutes, similarly to the method described above, by measuring the X-ray diffraction intensity, obtains the X-ray diffraction intensity ratio _{I {220} / I 0 {} 220} As a result, 4.1 (Example 1), 3.9 (Example 2), 4.4 (Example 3), 3.8 (Example 4), 3.9 (Example 5), 4 respectively. 2 (Example 6) and 3.6 (Example 7), both of which were 3.0 or more.

  These results are shown in Table 3.

[Comparative Examples 1-3]
The same method as in Examples 1 to 7 except that the isothermal aging was 0 hour at 550 ° C (Comparative Example 1), 1 hour at 550 ° C (Comparative Example 2), and 3 hours at 550 ° C (Comparative Example 3). Thus, a copper alloy sheet was produced. The electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 42.9% IAC. Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 41.9% IACS (Comparative Example 1), 57.1% IACS (Comparative Example 2), and 58.9% IACS, respectively. (Comparative Example 3) All were lower than 60% IACS. The production conditions for these copper alloy sheets are shown in Tables 4 and 5.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, the copper alloy obtained by the comparative example 1 for sheet material in the same manner as in example 1-7, it was determined before and after the heat resistance test _{I {220} / I 0 {} 220}. The electrical conductivity before the heat test is 42.5% IACS (Comparative Example 1), 55.4% IACS (Comparative Example 2), and 56.3% IACS (Comparative Example 3), respectively, all from 60% IACS. It was low. The Vickers hardness HV before the heat test was 171 (Comparative Example 1), 170 (Comparative Example 2), and 166 (Comparative Example 3), respectively, which were 150 or more. Further, the Vickers hardness HV after the heat resistance test was 156 (Comparative Example 1), 152 (Comparative Example 2), and 153 (Comparative Example 3), respectively, which were 140 or more. Further, the copper alloy sheet obtained in Comparative Example _{1, I {220} / I} 0 {220} before heat resistance test 3.7, I _{220} after the heat resistance test / I 0 {220} 4. 0, respectively 3.5 or more and 3.0 or more. These results are shown in Table 6.

[Examples 8 to 9]
A copper alloy sheet was produced in the same manner as in Example 4 except that the rolling ratios in finish cold rolling were 90% (Example 8) and 80% (Example 9), respectively. In addition, the electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 42.9% IACS. Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 68.7% IACS (Example 8) and 68.7% IACS (Example 9), respectively. -70% IACS. The production conditions for these copper alloy sheets are shown in Tables 1 and 2.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat test was 64.0% IACS (Example 8) and 65.0% IACS (Example 9), respectively, both of which were 60% IACS or more. The Vickers hardness HV before the heat resistance test was 166 (Example 8) and 155 (Example 9), respectively, and each was 150 or more. Moreover, the Vickers hardness HV after the heat test was 145 (Example 8) and 141 (Example 9), respectively, and both were 140 or more. I {220} / I ₀ {220} before the heat test was 3.8 (Example 8) and 3.6 (Example 9), respectively, and both were 3.5 or more. Moreover, I {220} / I ₀ {220} after the heat test was 3.6 (Example 8) and 3.8 (Example 9), respectively, and both were 3.0 or more. These results are shown in Table 3.

[Examples 10 to 14]
Copper alloys having chemical components shown in Table 1 (in Example 10, 2.10 mass% Fe, 0.030 mass% P, 0.08 mass% Zn, and 0.020 mass% Sn) A copper alloy comprising the remainder of Cu, in Example 11, a copper alloy comprising 1.50 mass% Fe, 0.100 mass% P and 0.20 mass% Zn, with the remainder comprising Cu In Example 12, a copper alloy containing 2.20% by mass of Fe, 0.010% by mass of P, 0.09% by mass of Zn, and 0.070% by mass of Sn, with the balance being Cu In Example 13, a copper alloy containing 2.70% by mass of Fe, 0.100% by mass of P, 0.14% by mass of Zn and 0.030% by mass of Sn, with the balance being Cu. In Example 14, 3.00 mass% Fe, 0.050 mass% P, 0.02 mass% Zn, It includes a .100% by weight of Sn, except the balance to produce an ingot of copper alloy) composed of Cu, in the same manner as in Example 3, to prepare a copper alloy sheet. The electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 66.1% IACS (Example 10), 67.0% IACS (Example 11), and 63.5% IACS, respectively. (Example 12), 64.7% IACS (Example 13), 63.2% IACS (Example 14), and all were 60-70% IACS. The production conditions for these copper alloy sheets are shown in Tables 1 and 2.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat test was 63.0% IACS (Example 10), 65.5% IACS (Example 11), 61.0% IACS (Example 12), and 62.0% IACS (Example), respectively. 13) and 60.8% IACS (Example 14), both of which were 60% IACS or more. The Vickers hardness HV before the heat test is 169 (Example 10), 160 (Example 11), 162 (Example 12), 164 (Example 13), and 166 (Example 14), respectively. It was 150 or more. The Vickers hardness HV after the heat resistance test is 146 (Example 10), 147 (Example 11), 146 (Example 12), 144 (Example 13), and 146 (Example 14), respectively. All were 140 or more. I {220} / I ₀ {220} before the heat test is 3.7 (Example 10), 3.9 (Example 11), 3.6 (Example 12), and 3.8 (Example), respectively. 13) 4.0 (Example 14), and all were 3.5 or more. Further, I {220} / I ₀ {220} after the heat resistance test is 4.4 (Example 10), 3.8 (Example 11), 4.1 (Example 12), and 3.9 (Example), respectively. Example 13) and 4.0 (Example 14), both of which were 3.0 or more. These results are shown in Table 3.

[Examples 15 to 17]
According to the same method as in Example 3, except that the workability of hot rolling at 600 ° C. to 450 ° C. was 20% (Example 15), 40% (Example 16), and 50% (Example 17), respectively. A copper alloy sheet was prepared. The electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 40.8% IACS (Example 15), 43.1% IACS (Example 16), and 43.6%, respectively. IACS (Example 17). Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 62.7% IACS (Example 15), 63.5% IACS (Example 16), and 63.3% IACS, respectively. (Example 17) and all were 60 to 70% IACS. The production conditions for these copper alloy sheets are shown in Tables 1 and 2.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat resistance test is 63.0% IACS (Example 15), 64.2% IACS (Example 16), and 63.5% IACS (Example 17), respectively, each of which is 60% IACS or more. Met. The Vickers hardness HV before the heat test was 168 (Example 15), 169 (Example 16), and 167 (Example 17), respectively, and all were 150 or more. Moreover, the Vickers hardness HV after the heat test was 145 (Example 15), 146 (Example 16), and 145 (Example 17), respectively, and each was 140 or more. I {220} / I ₀ {220} before the heat test is 3.8 (Example 15), 3.6 (Example 16), and 3.9 (Example 17), respectively. It was 5 or more. Further, I {220} / I ₀ {220} after the heat resistance test is 4.2 (Example 15), 3.8 (Example 16), and 3.9 (Example 17), respectively. It was 3.0 or more. These results are shown in Table 3.

[Comparative Examples 4 to 5]
Copper alloys having chemical components shown in Table 1 (in Comparative Example 4, 2.20 mass% Fe, 0.029 mass% P, 0.10 mass% Zn, and 0.027 mass% Sn) In the comparative example 5, the copper alloy including the balance, Cu, 2.22 mass% Fe, 0.036 mass% P, 0.09 mass% Zn, and 0.067 mass% Sn Ingot, and the remainder is made of Cu), in which instead of hot rolling at 900 to 450 ° C., hot rolling is performed for 10 passes at 900 to 600, and isothermal aging is performed at 570 ° C. for 8 hours. Produced the copper alloy sheet | seat by the method similar to Examples 1-7. In addition, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 66.0% IACS (Comparative Example 4) and 65.8% IACS (Comparative Example 5), respectively. -70% IACS. The production conditions for these copper alloy sheets are shown in Tables 4 and 5.

  Moreover, about the obtained copper alloy board | plate material, the electrical conductivity before a heat test and the Vickers hardness HV before and behind a heat test were measured by the method similar to Examples 1-7. The electrical conductivity before the heat test was 63.0% IACS (Comparative Example 4) and 62.7% IACS (Comparative Example 5), respectively, and both were 60% IACS or more. The Vickers hardness HV before the heat test was 156 (Comparative Example 4) and 170 (Comparative Example 5), respectively, and both were 150 or more, but the Vickers hardness HV after the heat test was 95 (Comparative). Examples 4) and 123 (Comparative Example 5), both of which were lower than 140. These results are shown in Table 6.

[Comparative Example 6]
A copper alloy sheet was produced in the same manner as in Examples 1 to 7, except that the isothermal aging was changed to 550 ° C. for 20 hours (Comparative Example 2). In addition, the electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 42.9% IACS. Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 73.8% IACS, which was higher than 70% IACS. The production conditions for this copper alloy sheet are shown in Tables 4 and 5.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The conductivity before the heat test was 66.0% IACS, which was 60% IACS or more. The Vickers hardness HV before the heat test was 165 and 150 or more, but the Vickers hardness HV after the heat test was 112, which was lower than 140. I {220} / I ₀ {220} before the heat test was 3.8 and 3.5 or more, but I {220} / I ₀ {220} after the heat test was 1.8. Lower than 3.0. These results are shown in Table 6.

[Comparative Examples 7 to 14]
Instead of hot rolling at 900 to 450 ° C., 10 passes of hot rolling at 900 to 600 are performed, and isothermal aging is performed at 550 ° C. for 7 hours (Comparative Example 7), 550 ° C. for 9 hours (Comparative Example 8), and 15 hours (Comparative Example 9), 550 ° C. for 20 hours (Comparative Example 10), 450 ° C. for 9 hours (Comparative Example 11), 500 ° C. for 9 hours (Comparative Example 12), 550 ° C. for 9 hours (Comparative Example 13) ), A copper alloy sheet was produced by the same method as in Examples 1 to 7, except that the test was performed at 600 ° C. for 9 hours (Comparative Example 14). The electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 38.3% IACS. Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 60.4% IACS (Comparative Example 7), 65.2% IACS (Comparative Example 8), and 67.2% IACS, respectively. (Comparative Example 9), 70.2% IACS (Comparative Example 10), 62.0% IACS (Comparative Example 11), 64.8% IACS (Comparative Example 12), 65.2% IACS (Comparative Example 13), It was 63.8% IACS (Comparative Example 14), and all were 60 to 70% IACS. The production conditions for these copper alloy sheets are shown in Tables 4 and 5.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat resistance test was 58.5% IACS (Comparative Example 7), 61.5% IACS (Comparative Example 8), 63.8% IACS (Comparative Example 9), and 64.5% IACS (Comparative Example), respectively. 10), 59.0% IACS (Comparative Example 11), 62.0% IACS (Comparative Example 12), 61.6% IACS (Comparative Example 13), and 61.0% IACS (Comparative Example 14). In Examples 8-10 and 12-14, it was 60% IACS or higher, but in Comparative Examples 7 and 11, it was lower than 60% IACS. The Vickers hardness HV before the heat resistance test was 166 (Comparative Example 7), 164 (Comparative Example 8), 163 (Comparative Example 9), 160 (Comparative Example 10), 165 (Comparative Example 11), 163 (Comparative Example), respectively. 12), 164 (Comparative Example 13), and 166 (Comparative Example 14), all of which were 150 or more. Further, the Vickers hardness HV after the heat test is 140 (Comparative Example 7), 135 (Comparative Example 8), 98 (Comparative Example 9), 95 (Comparative Example 10), 128 (Comparative Example 11), 115 ( Comparative Examples 12), 135 (Comparative Example 13), and 132 (Comparative Example 14), which were 140 or more in Comparative Example 7, but were lower than 140 in other Comparative Examples 8-14. I {220} / I ₀ {220} before the heat test is 4.0 (Comparative Example 7), 3.9 (Comparative Example 8), 4.0 (Comparative Example 9), 4.0 (Comparative Example), respectively. 10), 3.9 (Comparative Example 11), 3.9 (Comparative Example 12), 3.9 (Comparative Example 13), and 3.9 (Comparative Example 14), and all were 3.5 or more. . Further, I {220} / I ₀ {220} after the heat resistance test is 3.8 (Comparative Example 7), 2.9 (Comparative Example 8), 1.8 (Comparative Example 9), and 1.8 (Comparative Example 9), respectively. Comparative Example 10), 2.5 (Comparative Example 11), 2.2 (Comparative Example 12), 2.9 (Comparative Example 13), and 2.9 (Comparative Example 14). Although it was above, in other comparative examples 8-14, all were lower than 3.0. These results are shown in Table 6.

[Comparative Example 15]
A copper alloy sheet was produced in the same manner as in Example 4 except that the rolling rate in finish cold rolling was set to 70%. In addition, the electrical conductivity after hot rolling measured by the same method as in Examples 1 to 7 was 42.9% IACS. Moreover, the electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 68.7% IACS and 60 to 70% IACS. The production conditions for this copper alloy sheet are shown in Tables 4 and 5.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat test was 65.2% IACS, which was 60% IACS or more. The Vickers hardness HV before the heat test was 148, lower than 150, and the Vickers hardness HV after the heat test was 138, lower than 140. I {220} / I ₀ {220} before the heat test is 3.5 and 3.5 or more, and I {220} / I ₀ {220} after the heat test is 3.6, 3 0.0 or more. These results are shown in Table 6.

[Comparative Examples 16 to 20]
Copper alloys having chemical components shown in Table 1 (in Comparative Example 16, 2.10 mass% Fe, 0.030 mass% P, 0.08 mass% Zn, and 0.020 mass% Sn) In the comparative example 17, the copper alloy which contains 1.50 mass% Fe, 0.100 mass% P, and 0.20 mass% Zn, and the remainder consists of Cu. In Comparative Example 18, a copper alloy containing 2.20% by mass of Fe, 0.010% by mass of P, 0.09% by mass of Zn, and 0.070% by mass of Sn, with the balance being Cu. In Comparative Example 19, a copper alloy containing 2.70% by mass of Fe, 0.100% by mass of P, 0.14% by mass of Zn, and 0.030% by mass of Sn, with the balance being Cu. In Comparative Example 20, 3.00 mass% Fe, 0.050 mass% P, 0.02 mass% Zn, Ingot was made except that the ingot was made from a copper alloy containing 100% by mass of Sn and the balance being made of Cu), and hot rolling was performed 10 passes at 900 to 600 instead of hot rolling at 900 to 450 ° C. A copper alloy sheet was produced in the same manner as in Example 3. The electrical conductivity after the aging treatment measured by the same method as in Examples 1 to 7 was 65.2% IACS (Comparative Example 16), 67.2% IACS (Comparative Example 17), and 64.2% IACS, respectively. (Comparative Example 18), 64.6% IACS (Comparative Example 19), 62.7% IACS (Comparative Example 20), and all were 60 to 70% IACS. The production conditions for these copper alloy sheets are shown in Tables 4 and 5.

Moreover, about the obtained copper alloy board | plate material, while measuring the electrical conductivity before a heat test, the Vickers hardness HV before and behind a heat test by the method similar to Examples 1-7, I {220} / before and after a heat test. I ₀ {220} was determined. The electrical conductivity before the heat test was 61.5% IACS (Comparative Example 16), 64.2% IACS (Comparative Example 17), 61.2% IACS (Comparative Example 18), and 61.6% IACS (Comparative Example), respectively. 19) and 59.8% IACS (Comparative Example 20). In Comparative Examples 16 to 19, it was 60% IACS or more, but in Comparative Example 20, it was lower than 60% IACS. The Vickers hardness HV before the heat test is 164 (Comparative Example 16), 163 (Comparative Example 17), 162 (Comparative Example 18), 165 (Comparative Example 19), and 165 (Comparative Example 20), respectively. It was 150 or more. The Vickers hardness HV after the heat resistance test is 135 (Comparative Example 16), 130 (Comparative Example 17), 136 (Comparative Example 18), 128 (Comparative Example 19), and 120 (Comparative Example 20), respectively. Both were lower than 140. I {220} / I ₀ {220} before the heat resistance test is 3.9 (Comparative Example 16), 3.8 (Comparative Example 17), 3.9 (Comparative Example 18), and 3.9 (Comparative Example), respectively. 19) 4.0 (Comparative Example 20), and all were 3.5 or more. Further, I {220} / I ₀ {220} after the heat test is 2.9 (Comparative Example 16), 2.1 (Comparative Example 17), 2.8 (Comparative Example 18), and 2.5 ( Comparative Examples 19) and 2.2 (Comparative Example 20), both of which were lower than 3.0. These results are shown in Table 6.

Claims (4)

1.5 to 3.0% by mass of Fe, 0.01 to 0.2% by mass of P, 0.01 to 0.5% by mass of Zn, and 0.5% by mass or less of Sn, After heating and holding an ingot obtained by melting and casting a raw material of a copper alloy having a composition in which the balance is Cu and inevitable impurities, the workability is set to 20% or more in a temperature range of 600 ° C. to 450 ° C. Hot rolling is performed at 1000 ° C. to 450 ° C., and then cold rolling is performed so that the workability becomes 80% or more after aging annealing so that the electrical conductivity after aging annealing is 60 to 70% IACS. A method for producing a copper alloy sheet, characterized in that: The content of Fe in the raw material of the copper alloy is 2.1 to 3.0% by mass, the content of P is 0.015 to 0.15% by mass, and the content of Zn is 0.02 to 0.2% by mass. %, Sn content is 0.1 mass% or less, The manufacturing method of the copper alloy board | plate material of Claim 1 characterized by the above-mentioned. And performing a low-temperature annealing at 150 to 450 ° C. after performing the cold rolling, a manufacturing method of the copper alloy sheet according to claim 1 or 2. The said age-aging annealing is performed for 5 to 15 hours at 400-650 degreeC, The manufacturing method of the copper alloy board | plate material in any one of Claims 1 thru | or 3 characterized by the above-mentioned.