JPS56127742A - Cu-mn alloy solder material free from generation of pinhole deficiency - Google Patents

Cu-mn alloy solder material free from generation of pinhole deficiency

Info

Publication number
JPS56127742A
JPS56127742A JP2994480A JP2994480A JPS56127742A JP S56127742 A JPS56127742 A JP S56127742A JP 2994480 A JP2994480 A JP 2994480A JP 2994480 A JP2994480 A JP 2994480A JP S56127742 A JPS56127742 A JP S56127742A
Authority
JP
Japan
Prior art keywords
solder material
alloy solder
pinhole
deficiency
generation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2994480A
Other languages
Japanese (ja)
Other versions
JPS6236800B2 (en
Inventor
Masaki Morikawa
Hideaki Yoshida
Kunio Kishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP2994480A priority Critical patent/JPS56127742A/en
Publication of JPS56127742A publication Critical patent/JPS56127742A/en
Publication of JPS6236800B2 publication Critical patent/JPS6236800B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To provide the titled Cu-Mn alloy solder material with excellent wettability and flowability which contains Mn, Zn and one or more of a metal out of Fe, Ni, Co in a predetermined ratio respectively and comprises the remainder of Cu. CONSTITUTION:The Cu-Mn alloy solder material consists of, in a wt% basis, 10- 45% Mn, 1-25% Zn, 1-15% one or more of Fe, Ni and Co, 0.001-0.8% one or more of B and Li and the remainder Cu. Further, in the aforementioned solder material composition, further, according to necessity, 0.01-3% Al is contained. Said Cu-Mn alloy solder material has solderability at a relatively low temp. as well as shows excellent flowability and wettability in soldering and, moreover, does not almost generate defficiencies such as pinholes in a soldered part. Further, by said solder material, a soldered part with high strength is formed.
JP2994480A 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency Granted JPS56127742A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2994480A JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2994480A JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Publications (2)

Publication Number Publication Date
JPS56127742A true JPS56127742A (en) 1981-10-06
JPS6236800B2 JPS6236800B2 (en) 1987-08-08

Family

ID=12290092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2994480A Granted JPS56127742A (en) 1980-03-10 1980-03-10 Cu-mn alloy solder material free from generation of pinhole deficiency

Country Status (1)

Country Link
JP (1) JPS56127742A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064158A (en) * 1983-09-19 1985-04-12 Sanyo Electric Co Ltd Manufacture of solar heat collector
KR100379147B1 (en) * 1995-02-02 2003-10-17 마츠다 가부시키가이샤 Hard soldering method
JP2012532759A (en) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Sheet brazing aid
CN108340092A (en) * 2018-03-02 2018-07-31 华北水利水电大学 A kind of brazing material and preparation method thereof for anode steel claw reparation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064158A (en) * 1983-09-19 1985-04-12 Sanyo Electric Co Ltd Manufacture of solar heat collector
KR100379147B1 (en) * 1995-02-02 2003-10-17 마츠다 가부시키가이샤 Hard soldering method
JP2012532759A (en) * 2009-07-08 2012-12-20 ベルケンホフ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Sheet brazing aid
CN108340092A (en) * 2018-03-02 2018-07-31 华北水利水电大学 A kind of brazing material and preparation method thereof for anode steel claw reparation
CN108340092B (en) * 2018-03-02 2020-01-10 华北水利水电大学 Brazing material for repairing anode steel claw and preparation method thereof

Also Published As

Publication number Publication date
JPS6236800B2 (en) 1987-08-08

Similar Documents

Publication Publication Date Title
TW411731B (en) Solder alloy
JPS5690942A (en) High-tensile electrically conductive copper alloy
JPS55134160A (en) Fe alloy with superior molten zinc erosion resistance
KR100328157B1 (en) Silver Alloy for Cadmium Member Solder
JPS56127742A (en) Cu-mn alloy solder material free from generation of pinhole deficiency
JPS56136951A (en) Brazing al material
KR840005987A (en) Homogeneous Low Melting Copper Base Alloys
JPS57187195A (en) Silver solder material
JPS5641096A (en) Low melting point cu-mn system soldering material having excellent wetting property and fluidity
JPS5760046A (en) Aluminum alloy for brazing
JPS5481777A (en) Lead frame structure with intermediate layer
JPS56165591A (en) Low melting point cu-mn base alloy brazing filler metal having good wetting property
JPS5658941A (en) Solder alloy for sintered alloy
JPS55152153A (en) Invar alloy having good welding property
JPS5770099A (en) Gold brazing filler metal
JPS5443151A (en) Metal solder
JPS53138954A (en) Metallic solder
JPS569095A (en) Low melting point hard solder material
JPS57158347A (en) Shape storage alloy
JPS5326718A (en) Copper alloy for decorative purposes
JPS5319131A (en) Cu alloy for base material of composite electric contact
JPS5365213A (en) Low alloy high toughness steel with excellent delayed fracture resistantproperty
JPS5594455A (en) Solder alloy
JPS56156736A (en) Co alloy with superior erosion resistance to molten zinc
JPS5471747A (en) Copper base brazing alloy