JPS5658941A - Solder alloy for sintered alloy - Google Patents

Solder alloy for sintered alloy

Info

Publication number
JPS5658941A
JPS5658941A JP13467279A JP13467279A JPS5658941A JP S5658941 A JPS5658941 A JP S5658941A JP 13467279 A JP13467279 A JP 13467279A JP 13467279 A JP13467279 A JP 13467279A JP S5658941 A JPS5658941 A JP S5658941A
Authority
JP
Japan
Prior art keywords
alloy
sintered
solder
soldering
solder alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13467279A
Other languages
Japanese (ja)
Other versions
JPS574696B2 (en
Inventor
Norihiko Saga
Takushi Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP13467279A priority Critical patent/JPS5658941A/en
Publication of JPS5658941A publication Critical patent/JPS5658941A/en
Publication of JPS574696B2 publication Critical patent/JPS574696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)

Abstract

PURPOSE:To obtain a solder alloy with slight impregnating properties suitable for soldering sintered iron alloys to each other, etc. by adding a specified amount of two or more among Co, Fe, Mn and Ag singly or combinedly to a Cu-Ni alloy. CONSTITUTION:This solder alloy is obtd. by adding two or more among 0.5- 5wt% each of Co, Fe and Mn and 0.2-5wt% Ag singly or combinedly to 60- 95wt% Cu and 5-40wt% Ni. 0.1-5wt% Sn may be substituted for part of the Cu. By this alloy composition the impregnating properties of the solder alloy are controlled to enable firm and sure soldering when sintered iron alloys are soldered to each other or to steel. In addition, the soldering of low density sintered alloy is enabled.
JP13467279A 1979-10-18 1979-10-18 Solder alloy for sintered alloy Granted JPS5658941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13467279A JPS5658941A (en) 1979-10-18 1979-10-18 Solder alloy for sintered alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13467279A JPS5658941A (en) 1979-10-18 1979-10-18 Solder alloy for sintered alloy

Publications (2)

Publication Number Publication Date
JPS5658941A true JPS5658941A (en) 1981-05-22
JPS574696B2 JPS574696B2 (en) 1982-01-27

Family

ID=15133860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13467279A Granted JPS5658941A (en) 1979-10-18 1979-10-18 Solder alloy for sintered alloy

Country Status (1)

Country Link
JP (1) JPS5658941A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6238797A (en) * 1985-08-14 1987-02-19 Shippo Metal Kogyo Kk Brazing filler metal
CN100443244C (en) * 2005-10-25 2008-12-17 哈尔滨工业大学 Mesothermal copper based solder without cadmium, and preparation method
JP2015199115A (en) * 2014-04-10 2015-11-12 住友金属鉱山株式会社 Copper alloy for solder joint
CN105499833A (en) * 2016-01-27 2016-04-20 江苏科技大学 High-temperature brazing material for brazing tungsten-copper alloy and copper or copper alloy and brazing method of high-temperature brazing material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6238797A (en) * 1985-08-14 1987-02-19 Shippo Metal Kogyo Kk Brazing filler metal
JPH0220359B2 (en) * 1985-08-14 1990-05-09 Shitsuho Metaru Kogyo Kk
CN100443244C (en) * 2005-10-25 2008-12-17 哈尔滨工业大学 Mesothermal copper based solder without cadmium, and preparation method
JP2015199115A (en) * 2014-04-10 2015-11-12 住友金属鉱山株式会社 Copper alloy for solder joint
CN105499833A (en) * 2016-01-27 2016-04-20 江苏科技大学 High-temperature brazing material for brazing tungsten-copper alloy and copper or copper alloy and brazing method of high-temperature brazing material

Also Published As

Publication number Publication date
JPS574696B2 (en) 1982-01-27

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