JPS5597444A - Copper alloy for spring - Google Patents

Copper alloy for spring

Info

Publication number
JPS5597444A
JPS5597444A JP370679A JP370679A JPS5597444A JP S5597444 A JPS5597444 A JP S5597444A JP 370679 A JP370679 A JP 370679A JP 370679 A JP370679 A JP 370679A JP S5597444 A JPS5597444 A JP S5597444A
Authority
JP
Japan
Prior art keywords
alloy
spring
moreover
copper alloy
strain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP370679A
Other languages
Japanese (ja)
Inventor
Teruo Nakanishi
Koji Nakajima
Toshihiko Mori
Kenji Kubozono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP370679A priority Critical patent/JPS5597444A/en
Publication of JPS5597444A publication Critical patent/JPS5597444A/en
Pending legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To improve castability by a method wherein, to copper alloy with excellent strength, elasticity, strain and corrosion resistance and soldering property obtained by adding a specific amount of Ni, Zn, Al to Cu, moreover, Mn, B, Mg or the like are added.
CONSTITUTION: A spring alloy is made from Cu alloy containing Ni; 3W10%, Zn; 5W20%, Al; 0.05W3%. This alloy is excellent in strain and corrosion resistance, solderability and has good creep property as well as it's material cost low. Moreover, it's castability can be enhanced by including at least one or more of M; 0.03W0.80%, B; 0.002W0.003%, Mg; 0.01W0.3%. Moreover, if this alloy is annealed at 100W450°C, it's spring property and strength can be improved.
COPYRIGHT: (C)1980,JPO&Japio
JP370679A 1979-01-16 1979-01-16 Copper alloy for spring Pending JPS5597444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP370679A JPS5597444A (en) 1979-01-16 1979-01-16 Copper alloy for spring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP370679A JPS5597444A (en) 1979-01-16 1979-01-16 Copper alloy for spring

Publications (1)

Publication Number Publication Date
JPS5597444A true JPS5597444A (en) 1980-07-24

Family

ID=11564792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP370679A Pending JPS5597444A (en) 1979-01-16 1979-01-16 Copper alloy for spring

Country Status (1)

Country Link
JP (1) JPS5597444A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042738A (en) * 1990-04-20 1992-01-07 Poongsan Corp Electrical part, copper alloy for it, and manufacture thereof
JP2002318248A (en) * 2001-04-20 2002-10-31 Kanai Hiroaki Probe pin for probe card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042738A (en) * 1990-04-20 1992-01-07 Poongsan Corp Electrical part, copper alloy for it, and manufacture thereof
JPH0565570B2 (en) * 1990-04-20 1993-09-20 Puungusan Corp
JP2002318248A (en) * 2001-04-20 2002-10-31 Kanai Hiroaki Probe pin for probe card

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