JPS64240A - High tensile high electroconductive copper alloy - Google Patents

High tensile high electroconductive copper alloy

Info

Publication number
JPS64240A
JPS64240A JP15604887A JP15604887A JPS64240A JP S64240 A JPS64240 A JP S64240A JP 15604887 A JP15604887 A JP 15604887A JP 15604887 A JP15604887 A JP 15604887A JP S64240 A JPS64240 A JP S64240A
Authority
JP
Japan
Prior art keywords
compound
copper alloy
electroconductive copper
alloy
kinds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15604887A
Other languages
Japanese (ja)
Other versions
JPH0830233B2 (en
JPH01240A (en
Inventor
Masato Asai
Yoshimasa Oyama
Shigeo Shinozaki
Toru Tanigawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP62156048A priority Critical patent/JPH0830233B2/en
Publication of JPS64240A publication Critical patent/JPS64240A/en
Publication of JPH01240A publication Critical patent/JPH01240A/en
Publication of JPH0830233B2 publication Critical patent/JPH0830233B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To develop the titled Cu alloy having excellent strength, workability, electrical and heat conductivity, corrosion resistance and heat resistance by adding specific amounts of Ni, Si, etc., to Cu and dispersing and depositing the compound of Ni and Si into the Cu matrix.
CONSTITUTION: Said Cu alloy has the compsn. formed by adding, by weight, 4.0W10.0% Ni and 0.6W5.0% Si and 0.01W5.0% total of one or more kinds among 0.05W5.0% Zn, 0.01W5.0% Mn, 0.005W0.8% Mg, 0.005W0.8% Ca, 0.05W1.0% Cd and 0.001W0.5% Ag to Cu or furthermore adding 0.005W0.5% total of one or more kinds among 0.01W0.4% Cr, 0.005W0.4% V, 0.005W0.4% Ti, 0.005W0.2% Y, 0.005W0.2% Zr, 0.01W0.4% Co, 0.01W0.4% Fe-P compound, 0.01W0.4% Cr-P compound and 0.01W0.4% Co-P compound thereto and contg. <50ppm O2 and <10ppm S.
COPYRIGHT: (C)1989,JPO&Japio
JP62156048A 1987-06-23 1987-06-23 High strength and high conductivity copper alloy Expired - Fee Related JPH0830233B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62156048A JPH0830233B2 (en) 1987-06-23 1987-06-23 High strength and high conductivity copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62156048A JPH0830233B2 (en) 1987-06-23 1987-06-23 High strength and high conductivity copper alloy

Publications (3)

Publication Number Publication Date
JPS64240A true JPS64240A (en) 1989-01-05
JPH01240A JPH01240A (en) 1989-01-05
JPH0830233B2 JPH0830233B2 (en) 1996-03-27

Family

ID=15619179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62156048A Expired - Fee Related JPH0830233B2 (en) 1987-06-23 1987-06-23 High strength and high conductivity copper alloy

Country Status (1)

Country Link
JP (1) JPH0830233B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05311298A (en) * 1992-05-13 1993-11-22 Dowa Mining Co Ltd Copper base alloy for connector and its manufacture
EP0652624A1 (en) * 1993-11-05 1995-05-10 Hitachi, Ltd. Rotor for dynamo electric machine
JP2014019888A (en) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The High strength copper alloy material, and method of manufacturing the same
JP2014019889A (en) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The Copper alloy material having excellent strength and plating property and production method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Lead material for semiconductor apparatus
JPS6045698A (en) * 1983-08-19 1985-03-12 株式会社協立有機工業研究所 Papermaking method for performing internal sizing of amphoteric starch
JPS60158650A (en) * 1984-01-28 1985-08-20 Kobe Steel Ltd Lead material for semiconductor apparatus
JPS61250134A (en) * 1985-04-26 1986-11-07 オリン　コ−ポレ−シヨン Multipurpose copper alloy having proper conductivity and high strength

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Lead material for semiconductor apparatus
JPS6045698A (en) * 1983-08-19 1985-03-12 株式会社協立有機工業研究所 Papermaking method for performing internal sizing of amphoteric starch
JPS60158650A (en) * 1984-01-28 1985-08-20 Kobe Steel Ltd Lead material for semiconductor apparatus
JPS61250134A (en) * 1985-04-26 1986-11-07 オリン　コ−ポレ−シヨン Multipurpose copper alloy having proper conductivity and high strength

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05311298A (en) * 1992-05-13 1993-11-22 Dowa Mining Co Ltd Copper base alloy for connector and its manufacture
EP0652624A1 (en) * 1993-11-05 1995-05-10 Hitachi, Ltd. Rotor for dynamo electric machine
US5459363A (en) * 1993-11-05 1995-10-17 Hitachi, Ltd. Rotor for dynamo electric machine
JP2014019888A (en) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The High strength copper alloy material, and method of manufacturing the same
JP2014019889A (en) * 2012-07-13 2014-02-03 Furukawa Electric Co Ltd:The Copper alloy material having excellent strength and plating property and production method thereof

Also Published As

Publication number Publication date
JPH0830233B2 (en) 1996-03-27

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees