JPH05311298A - Copper base alloy for connector and its manufacture - Google Patents

Abstract

PURPOSE:To obtain the objective copper base alloy for a connector having excellent strength, elasticity and electrical conductivity as well as excellent formability, stress relaxing resistance and plating reliability. CONSTITUTION:The objective copper base alloy constituted of, by weight, 10.8% Ni, 1.36% Al, 0.49% Sn, 0.13% Co and 0.11% Cr, in which the ratio of the weight percentage of Ni/Al is regulated to 7.9 and the concn. of oxygen to 0.00l3%, and the balance Cu with inevitable impurities shows the various properties of 244Hv hardness, 79.8kgf/mm<2> tensile strength, 63.4kgf/mm<2> spring limit value and 14.3IACS electrical conductivity, is excellent in 90 degrees w bendability, soldering adhesion and castability, is furthermore good in the dispersion of properties and is suitable as the construction material for a connector.

Description

Detailed Description of the Invention

[0001]

INDUSTRIAL APPLICABILITY The present invention is excellent as a constituent material for signal micro-current connectors used for electric wiring of transportation equipment, pressure contact type connectors used for electronic equipment, IC sockets and the like. The present invention relates to a copper-based alloy for connectors, which has strength, elasticity, and electrical conductivity, and has excellent formability, stress relaxation resistance, and plating reliability, and a method for producing the same.

[0002]

2. Description of the Related Art In recent years, internal mounting of electronic equipment has been
As the density of C, LSI, and VLSI has been rapidly increased, the densities have been increased. Therefore, the connectors and IC sockets required for this are required to have more functions and higher reliability. It was In addition, with the development of car electronics, the electrical wiring of transportation equipment is becoming higher in density and lighter in weight, and there is a demand for further multifunctionalization, higher reliability, and smaller size of the connectors required for this. ..

That is, the following characteristics are required for the constituent materials of the connector and the like, which are required to be more multifunctional and highly reliable as described above.

In the connection between the terminal and the electric wire, crimping is often adopted in order to rationalize the connection with the increase in the number of electric wires accompanying the higher density. Therefore, the constituent material of the terminal needs to have excellent strength and elasticity. Further, in order to secure the electrical reliability of the terminal, it is necessary that the contact force of the spring is large and does not change with time. Therefore, the constituent material of the terminal is required to have excellent electrical conductivity, stress relaxation resistance and corrosion resistance. Further, the constituent material of the terminal is required to have excellent moldability capable of withstanding complicated processing.

Further, in order to improve the stability of the contact resistance of the terminal,
Often plated. Therefore, the constituent material of the terminal has excellent plating properties, and diffusion occurs between the material and the plating layer due to the thermal influence of the operating environment and heat generation, and plating peeling occurs at the portion where this diffusion has occurred (weakened portion). It is required not to.

In the IC socket, the number of pins is increasing as the degree of integration is improved, and the mounting method is DIP.
It is shifting from type to pin array and chip carrier. In addition, IC sockets are often used E
It is widely used for P-ROMs and P-ROM writers, and for burn-in and aging of IC testers. Therefore, the constituent material of the IC socket needs to be excellent in strength, elasticity, electrical conductivity, heat resistance, and stress relaxation resistance, like the constituent material of the terminal.

Conventionally, phosphor bronze or beryllium copper has been mainly used as the constituent material of the connector in the above-mentioned applications. However, when phosphor bronze is used as a pressure contact type connector, there is a problem that sufficient strength and elasticity cannot be obtained. For IC sockets, especially I
When used for burn-in and aging of a C tester, the stress relaxation resistance and heat resistance were insufficient, and there were problems in reliability and durability. Further, even when it is used as a general connector, the stress relaxation resistance may be insufficient or the plating may be peeled off, resulting in a problem in reliability.

On the other hand, beryllium copper had a problem in terms of economy because it had to be subjected to an aging treatment at 300 to 350 ° C. after molding in order to have strength and elasticity. Further, in the post-plating performed after the aging treatment after the forming process, there is a problem that it is difficult for the plating to be uniformly electrodeposited on the complicatedly processed portion, and uneven plating is likely to occur. On the other hand, in the pre-plating that is performed before the molding process, there is a problem that a low melting point metal such as Sn or Sn-Pb cannot be plated, and the type of plating is limited.

In order to solve the above problems, Cu-N
An i-Al-based or Cu-Ni-Al-B-based copper-based alloy for connectors and a method for producing the same are provided (Japanese Patent Application Nos. 62-84653, 62-209839 and 62-62). 306993
issue). However, according to these methods, Cu-N
In the case of the i-Al-based alloy and the Cu-Ni-Al-B-based alloy, the problem of the reaction between the carbon template and Ni as an additional element in continuous casting is significant in the presence of Al, so that the yield during casting is reduced. There was a serious problem. Further, among the material properties of the plate material obtained by the combination of the solution treatment, the aging treatment, and the processing, there is a problem that especially the spring limit value greatly varies.

[0010]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the conventional techniques and is excellent in strength, elasticity and electrical conductivity, and is excellent in moldability, stress relaxation resistance and plating reliability. An object is to provide a copper-based alloy for connectors and a method for manufacturing the same.

[0011]

Means for Solving the Problems As a result of earnest research for achieving the above-mentioned object, the present inventors have added Ni and Al in appropriate amounts in a regulated ratio, and further added Co, Cr and Ti.
It was found that the above problems can be solved by adding at least one of them and Sn in an appropriate amount (B is also added in an appropriate amount if necessary) and the oxygen content is regulated, and the present invention has been achieved.

That is, according to the present invention, in% by weight, N
i: 5 to 15%, Al: 0.5 to 2.0%, Sn: 0.1 to 3.0
%, At least one of Co, Cr and Ti: 0.01
Copper-based alloy for connectors, which contains ~ 2.0% and has a Ni / Al weight percentage ratio in the range of 3-10, an oxygen content of 50 ppm or less, and the balance Cu and inevitable impurities; and % By weight, Ni: 5-15
%, Al: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B:
0.005 to 0.1%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the above Ni / Al weight percentage ratio is in the range of 3 to 10, and the oxygen content is
A copper-based alloy for connectors, which has a content of 50 ppm or less and the balance of Cu and unavoidable impurities;
Ni: 5-15%, Al: 0.5-2.0%, Sn: 0.1-
3.0%, at least one of Co, Cr and Ti:
An alloy material containing 0.01 to 2.0% and having a Ni / Al weight percentage ratio in the range of 3 to 10 and an oxygen content of 50 ppm or less and the balance being Cu and inevitable impurities is continuously cast. To obtain a material plate, cold rolling this material plate at a processing rate of 50% or more, cold-rolled material at 750 to 950 ℃
Solution treatment at 10 to 600 seconds, cold rolling the solution treated material at a processing rate of 30 to 90%, and cold rolling material at 300 to 600 ℃ for 5 to 360 minutes A method for producing a copper-based alloy for a connector, comprising: 5 to 15% by weight, and Al:
0.5-2.0%, Sn: 0.1-3.0%, B: 0.005-0.1
%, At least one of Co, Cr and Ti: 0.01
~ 2.0%, the above Ni / Al weight percentage ratio is in the range of 3 to 10, the oxygen content is 50 ppm or less, and the balance is Cu and inevitable impurities. The process of obtaining a material plate and cold rolling the material plate at a processing rate of 50% or more, the step of solution heat treating the cold rolled material at a temperature of 750 to 950 ° C for 10 to 600 seconds, the solution heat treatment material
Cold rolling with cold rolling at a processing rate of 30-90%
Provided is a method for producing a copper-based alloy for a connector, which comprises a step of aging treatment at a temperature of 300 to 600 ° C. for 5 to 360 minutes.

In the above-mentioned method for producing a copper-based alloy for a connector, the solution-treated material before cold rolling is subjected to an aging treatment at a temperature of 300 to 550 ° C. for 5 to 360 minutes, or at least a solution treatment step. By performing twice, a more suitable copper-based alloy for connectors can be obtained.

[0014]

First, the reason for limiting the range of the content of the alloy component of the present invention will be described below.

Since the copper-based alloy of the present invention is characterized in that it is precipitation strengthened by the Ni-Al intermetallic compound, Ni and Al are essential elements in the alloy of the present invention. Ni is an element that forms a compound with Al and contributes to the improvement of strength, elasticity, heat resistance, and stress relaxation resistance properties. Further, it makes the cast structure fine and coarsens the crystal grains during solution treatment. It has a blocking effect.

In order to exert such an effect, N
The content of i must be 5% or more in weight%,
If it exceeds 15%, the electrical conductivity will be remarkably reduced, and when a carbon mold is used in continuous casting, the reaction with the mold will be remarkable and the soundness of the ingot will be impaired.
On the other hand, if the Ni content exceeds 15%, the solution heat treatment temperature becomes too high, which is disadvantageous in manufacturing and the material cost becomes high. Therefore, the content of Ni in the present invention is
The range was 5 to 15% by weight.

On the other hand, if the Al content is less than 0.5%, the Ni content is
Strength, elasticity, and heat resistance are not improved even in the presence of and when it exceeds 2.0%, precipitates become excessive and ductility, formability and platability of the alloy deteriorate, and castability decreases. However, it becomes economically disadvantageous. Therefore, the Al content in the present invention is in the range of 0.5 to 2.0% by weight.

The objects of the present invention are advantageously achieved when Ni and Al are precipitated as Ni-Al intermetallic compounds, but in order to sufficiently exert the strengthening by the Ni-Al intermetallic compounds. Therefore, it is necessary to limit the weight percentage ratio of Ni / Al. That is, when the weight percentage ratio of Ni / Al is smaller than 3, the amount of Al dissolved in the Cu matrix becomes excessively large, and Ni / Al
When the ratio of the weight percentage of is larger than 10, the amount of Ni dissolved in the Cu matrix becomes excessively large. As described above, if the amount of either Ni or Al dissolved in the Cu matrix becomes excessively large, the electrical conductivity is lowered, and the strength and elasticity cannot be efficiently improved. Therefore, N in the present invention
The weight percentage ratio of i / Al was in the range of 3-10.

Sn has the function of improving the continuous castability using carbon casting. That is, Sn is Al
It effectively prevents the reaction between Ni and carbon in the presence, and contributes to the improvement of the soundness of the ingot and the life of the carbon mold. Further, Sn has the effect of forming a solid solution in the Cu matrix to improve the strength and elasticity, and particularly to reduce the variation of the spring limit value. The above effect is not sufficient if the Sn content is less than 0.1% by weight, and if it exceeds 3.0%, spinodal decomposition occurs in the coexistence with Ni and a different phase occurs. When such a different phase is generated, the strength and elasticity can be further improved, but the moldability is remarkably lowered, and the heat treatment is complicated, leading to an increase in cost, which is not preferable. Therefore, the Sn content in the present invention is 0.1 to
The range was 3.0% by weight.

Co, Cr, and Ti are not only advantageous in the production of alloys, such as prevention of crystal grain coarsening in the solution treatment step and effective suppression of grain boundary reaction in the aging treatment step, but also strength and elasticity. , And has the effect of further improving the electrical conductivity. Such effects are exhibited by adding at least one of Co, Cr and Ti, but the content is not sufficient if less than 0.01% by weight, and if the content exceeds 2.0%, electrical conductivity is increased. In addition, the molding processability is significantly deteriorated, and the castability is also decreased, which is economically disadvantageous. Therefore, Co in the present invention,
The content of at least one of Cr and Ti is 0.01 to
It was set to 2.0%. The more preferable contents of Co, Cr and Ti are: Co: 0.01-2.0 wt%, Cr: 0.01-
1.5% by weight, Ti: 0.01 to 1.5% by weight.

B contributes as a deoxidizing agent during melting and casting, and has an effect of preventing coarsening of crystal grains during solution treatment. However, when the B content is less than 0.005%, such an effect is obtained. Is not sufficiently exhibited, and if it exceeds 0.1%, the formability is deteriorated, which is economically disadvantageous. for that reason,
The content of B in the present invention is in the range of 0.005 to 0.1% by weight.

When O ₂ is contained in the alloy in an amount of more than 50 ppm, Al having a large affinity with oxygen is oxidized and Al ₂
O ₃ is formed, deterioration of plating property and plating reliability,
This leads to a reduction in the life of the press die. Further, when H ₂ gas is used in the process of manufacturing the alloy, hydrogen embrittlement may occur on the surface and inside. Therefore, the content of O _{2 in} the present invention is set in the range of 50 ppm or less.

The copper-based alloy of the present invention adjusted to such a composition has finely deposited Ni-Al intermetallic compound, and has strength, elasticity, electrical conductivity, moldability, stress relaxation resistance, and plating. Because it has various characteristics such as reliability,
It is possible to use a material having various properties required for a recent material for connectors.

Next, a method for producing the copper-based alloy for connectors of the present invention will be described below.

First, in weight%, Ni: 5 to 15%,
Al: 0.5-2.0%, Sn: 0.1-3.0%, Co, Cr
And at least one of Ti: 0.01 to 2.0%, the Ni / Al weight percentage ratio is in the range of 3 to 10, the oxygen concentration is 50 ppm or less, and B is 0.005 to 0.1 in some cases. %, With the balance being Cu and unavoidable impurities, an alloy material is continuously cast (melt cast) to produce a material plate (ingot).

It is desirable that the melting and casting be performed in an inert gas or reducing gas atmosphere. Further, as a material of the casting mold for continuous casting, it is desirable to use carbon from the viewpoint of cooling (quick cooling), consumption, reaction with molten metal, and running cost. Furthermore, it is desirable that the ingot be rapidly cooled by secondary cooling after casting. However, the quenching start temperature is preferably 800 ° C or higher.

Next, the cold working rate of the produced ingot is set to 50.
Roll over%. In this case, hot rolling may be performed instead of cold rolling, but heating and rolling in an oxidizing atmosphere causes internal oxidation of the additive element Al to form Al ₂ O ₃ (a strong film), It is not desirable because cracking easily occurs.
Further, if the cold working ratio is less than 50%, the time required for eliminating the segregation during casting is significantly lengthened in the subsequent solution treatment step, which is not preferable.

Then, the plate material was heated at a temperature of 750 to 950 ° C.
Solution treatment is applied for 10 to 600 seconds. The processing temperature is 750
If the temperature is lower than ℃, the solution is not sufficiently formed, and if the temperature exceeds 950 ℃, the crystal grains become coarse in a short time. Therefore, the range is set to 750 to 950 ℃. Further, if the treatment time is less than 10 seconds, the solution is not sufficiently solutionized because segregation at the time of casting remains, and if it exceeds 600 seconds, the crystal grains become coarse and it is not economical, so 10 to 600. It was set to the range of seconds.

Next, the solution treated material thus obtained is pickled, if necessary, and then cold rolled in the range of 30 to 90%. This is because if the working rate is less than 30%, the working strain imparted by working is small, and the strength and elasticity in the aging precipitation in the subsequent aging treatment step are not sufficiently improved, and
If the workability exceeds 90%, the texture of rolling will be significantly developed and the mechanical properties will have directionality (anisotropic), which will reduce the formability and formability, so cold rolling before aging treatment will occur. The processing rate was in the range of 30 to 90%.

Next, as an aging treatment, a heat treatment is performed at a temperature of 300 to 600 ° C. for 5 to 360 minutes. If the treatment temperature is lower than 300 ° C, the time required for precipitation becomes too long, which is not economical, and if the temperature exceeds 600 ° C, overaging may occur.
300-600 because further improvement of characteristics cannot be expected
It was set in the range of ° C. If the aging treatment time is less than 5 minutes, the formation of precipitates is insufficient, and if the aging treatment time is longer than 360 minutes, it is not preferable from the viewpoint of growth of the precipitates and economical efficiency. The range was 360 minutes.

Further, in the method of the present invention, if necessary, the solution heat-treated material obtained before the solution heat treatment (before the cold rolling treatment) is performed at a temperature of 300 to 550 ° C. for 5 to 360 minutes. Aging treatment (pre-aging treatment) may be performed. This aging treatment can be expected to further improve strength, elasticity, and electric conductivity. If the treatment temperature in this aging treatment is less than 300 ° C, the time required for precipitation is too long, which is not economical.
If the temperature exceeds ° C, overaging will occur and further improvement of the characteristics cannot be expected, so the range was set to 300 to 550 ° C. Regarding the treatment time, if the formation time is less than 5 minutes, the formation of precipitates is insufficient, and if the treatment time is longer than 360 minutes, it is not preferable from the viewpoint of growth of the precipitates and economical efficiency. ~
The range was 360 minutes. However, the working rate in cold rolling after the pre-aging treatment is preferably 30 to 70%.
This is because if the processing rate is less than 30%, the strength and elasticity after the subsequent aging treatment are insufficient, and if the processing rate exceeds 70%, the moldability is markedly deteriorated.

Further, in the method of the present invention, the solution treatment step may be carried out twice or more, if necessary. By carrying out the solution heat treatment twice or more, it becomes possible to almost eliminate the influence of the non-uniform structure and segregation during casting (If the influence of the cast structure is left, the elasticity and formability of this alloy will be further improved. Can no longer be expected to improve).

By undergoing the above-mentioned processing and heat treatment, it becomes possible to obtain a copper-based alloy thin plate having a structure in which the Ni-Al intermetallic compound is finely precipitated in the Cu matrix. This copper-based alloy has high strength, high elasticity, and high conductivity, and is excellent in moldability, plating properties, stress relaxation resistance, etc., so it is used in recent electric and electronic parts, transportation equipment, etc. It is a very suitable connector material to be used.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention is not limited by the following examples.

[0035]

Example 1 Copper-based alloys whose chemical composition values (% by weight) are shown in Table 1 (Sample Nos. 1 to 11: Sample Nos. 1 to 5 of the present invention, Samples Nos. 6 to 11 are comparative alloys) Was melted using a high-frequency melting furnace and continuously cast into a 10 × 100 × 10000 (mm) ingot. However, melt casting is performed using Ar for the alloys of sample Nos. 1 to 10.
It was carried out in an atmosphere completely shielded with gas, and in the atmosphere of No. 11 alloy. Further, carbon was used as the material of the mold, and the drawing was performed by a pulse method (average drawing speed 100 mm / min).

[0036]

[Table 1] After melting and casting, the surface of the obtained ingot was observed, and those without defects were marked with ◯, and those with defects were marked with x.
Also described in.

Next, the ingot was cold-rolled to a thickness of 2 mm (working rate 80%), and this was subjected to solution treatment at a temperature of 850 ° C. for 180 seconds. After the solution treatment, cold rolling (working rate 70%) was performed again to a thickness of 0.6 mm, and solution treatment was performed at a temperature of 850 ° C for 150 seconds. Next, the solution treated material obtained was pickled, buffed, cold-rolled to a thickness of 0.2 mm (working rate 67%), and aged at a temperature of 500 ° C. for 60 minutes. During the heat treatment, the atmosphere of the material and the inside of the material were controlled as much as possible by controlling the atmosphere of the atmosphere of the inert gas or the reducing gas.

Using the test materials obtained as described above, hardness, tensile strength, spring limit value, conductivity, bending workability, solderability, and characteristic variation were measured, and the results are also shown in Table 1. .. The hardness, tensile strength, spring limit value and conductivity are measured according to JIS Z 2244, JIS Z 2241 and JIS H, respectively.
It carried out according to 3130 and JIS H 0505. In addition, the bending workability is measured by 90 degree w bending test (CES-M0002-6, R =
0.2 mm, the bending axis was parallel to the rolling direction), the sample with a good central mountain surface was evaluated as ◯, and the sample with cracks was evaluated as x.

The solder adhesion was measured by solder plating (dip: Sn-40 wt% Pb, 260 ° C x 5 sec, weakly active rosin flux was used) on the surface, and then at 5 ° C at 5 ° C.
After heating for 00 hours, bend the test piece 90 degrees w (R = 0.2 mm),
A peeling test was carried out using cellophane tape, and those in which the plating did not peel off were evaluated as ◯, and those peeled off were evaluated as x. To measure the variation in properties, repeat trial production three times in the same process, measure the tensile strength and spring limit value of the obtained test material, and the variation in this measured value is all within 5% of the average value. The samples were evaluated as ◯, and those exceeding 5% were evaluated as x.

The stress relaxation characteristics (stress relaxation rate) of the alloy of the present invention of Sample No. 3 and commercially available phosphor bronze (C5210EH, 0.2 mm) were measured, and the results are shown in Table 2. The stress relaxation characteristics (stress relaxation rate) were measured by bending the test piece into an arch shape at a stress of 40 kgf / mm ² at 150 ° C and
The bending behavior after 500 hours of holding at 200 ° C was calculated as the stress relaxation rate. The stress relaxation rate (%) was calculated by the following formula.

Stress relaxation rate (%) = [(L ₁ -L ₂ ) /
(L ₁ −L ₀ )] × 100 In the above formula, L ₀ is the jig length (mm), and L ₁ is
The starting sample length (mm) and L ₂ are the horizontal distance (mm) between the processed sample ends.

[0042]

[Table 2]

From the results shown in Table 1, the following was confirmed. The alloys of the present invention of Sample Nos. 1 to 5 are excellent in balance of hardness, tensile strength, spring limit value and conductivity, and are excellent in bending workability, solder adhesion and castability, and have variations in properties. Since it was small, it was a very excellent copper-based alloy for connectors.

On the other hand, Sn, Co, Cr and Ti
The comparative alloy of Sample No. 6 containing neither of these was inferior in terms of castability and property variation. Further, the comparative alloy of Sample No. 7, which had a larger amount of Ni and a larger ratio of Ni / Al weight percentage than those specified in the present invention, had a low electrical conductivity and was inferior in moldability. Further, the comparative alloy of Sample No. 8 having a smaller amount of Al and a higher Ni / Al weight percentage ratio than those specified in the present invention had poor hardness, tensile strength and spring limit value, and was out of balance.

Further, the comparative alloy of Sample No. 9 in which the amount of Sn was larger than that specified in the present invention was inferior in terms of electrical conductivity, bending workability, castability and property variation. Further, the comparative alloy of Sample No. 10 having a larger total content of Co and Ti than specified in the present invention was inferior in bending workability, solder adhesion, castability and property variation. Furthermore, Ni content, Al content, N
i / Al weight percentage ratio, Sn content, and Co,
Although the total content of Cr and Ti is the value specified in the present invention, the comparative alloy of Sample No. 11 having a large oxygen content was inferior in bending workability, solder adhesion, castability and property variation.

On the other hand, from the results of Table 2, it was confirmed that the alloy of the present invention is superior in stress relaxation resistance property to phosphor bronze which is a typical conventional connector material.

[0047]

Example 2 First, the copper-based alloy of the present invention showing the chemical composition value (% by weight) of sample No. 3 in Table 1 was subjected to casting, rolling and solution treatment in the same manner as in Example 1 to obtain the thickness. A 0.6 mm solution heat treated material was prepared. Then, the treated material is aged at a high temperature of 400 ° C for 30 minutes, pickled and buffed, and then the thickness
It was cold-rolled to 0.2 mm and aged at a temperature of 500 ° C for 60 minutes.

The test material obtained as described above (“Sample A”)
The hardness, the tensile strength, the spring limit value, and the electrical conductivity were measured, and the results are shown in Table 3. Note that these measurements were based on Example 1. For reference, a test material (referred to as “Sample B”) was prepared from the sample No. 3 in Table 1 by the same method as in Example 1, and the hardness, tensile strength, spring limit value, and conductivity were determined. The measurement was performed, and the results are also shown in Table 3.

[0049]

[Table 3]

As can be seen from Table 3, by subjecting the solution heat-treated material obtained after the solution heat treatment to the aging treatment before the cold rolling treatment, the hardness, the tensile strength, the spring limit value,
The conductivity is further improved.

[0051]

As a result of the development of the present invention, it has become possible to obtain a copper-based alloy that is excellent in strength, elasticity, and electrical conductivity, as well as in moldability, stress relaxation resistance, and plating reliability. Therefore, the copper-based alloy of the present invention can sufficiently cope with the recent reduction in size and weight of electrical equipment for transportation equipment, high density of wiring and high density and high reliability of internal mounting of electronic equipment.

Claims (4)

[Claims] 1. In weight%, Ni: 5-15%, A
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the Ni / Al weight percentage ratio is in the range of 3 to 10, And the oxygen content is 50 ppm or less, and the balance is C
Copper-based alloy for connectors, which comprises u and unavoidable impurities. 2. Ni: 5 to 15% by weight, A
1: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B: 0.005 to
0.1%, at least one of Co, Cr and Ti:
A copper-based alloy for connectors, which contains 0.01 to 2.0%, has a Ni / Al weight percentage ratio in the range of 3 to 10, an oxygen content of 50 ppm or less, and the balance Cu and inevitable impurities. 3. In weight%, Ni: 5-15%, A
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the Ni / Al weight percentage ratio is in the range of 3 to 10, And the oxygen content is 50 ppm or less, and the balance is C
A process of continuously casting an alloy material consisting of u and unavoidable impurities to obtain a raw material plate, and cold rolling the raw material plate at a processing rate of 50% or more. The cold rolled material is 10 to 600 at a temperature of 750 to 950 ° C. Solution treatment for seconds, cold rolling the solution treated material at a working rate of 30 to 90%, and aging the cold rolled material at a temperature of 300 to 600 ° C for 5 to 360 minutes. A method for producing a copper-based alloy for a connector. 4. In weight%, Ni: 5-15%, A
1: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B: 0.005 to
0.1%, at least one of Co, Cr and Ti:
An alloy material containing 0.01 to 2.0% and having a Ni / Al weight percentage ratio in the range of 3 to 10 and an oxygen content of 50 ppm or less and the balance being Cu and inevitable impurities is continuously cast. To obtain a material plate, cold rolling this material plate at a processing rate of 50% or more, cold-rolled material at 750 to 950 ℃
Solution treatment at 10 to 600 seconds, cold rolling the solution treated material at a processing rate of 30 to 90%, and cold rolling material at 300 to 600 ℃ for 5 to 360 minutes A method of manufacturing a copper-based alloy for a connector, comprising: