JP2594250B2 - Copper base alloy for connector and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is an excellent and suitable material for forming a minute current connector for signals used for electric wiring of transportation equipment, a pressure contact type connector used for electronic equipment, and an IC socket. The present invention relates to a copper-based alloy for a connector having strength, elasticity and electric conductivity, and excellent moldability, stress relaxation resistance and plating reliability, and a method for producing the same.

[0002]

2. Description of the Related Art In recent years, the internal mounting of electronic equipment has been
With the rapid increase in integration of C, LSI, and VLSIs, higher densities have been achieved, so that the connectors and IC sockets required for such functions have been required to have more functions and higher reliability. Was. In addition, with the development of car electronics, higher densities and lighter weights have been achieved in the electrical wiring of transportation equipment, and further multifunctionality, higher reliability, and smaller size of the connectors required for this are required. .

[0003] That is, as described above, the following characteristics are required for constituent materials of connectors and the like, which are required to have more functions and higher reliability.

In connection between a terminal and an electric wire, pressure welding is often employed in order to rationalize the connection in response to an increase in the number of electric wires due to a high density. Therefore, the constituent material of the terminal needs to have excellent strength and elasticity. Further, in order to ensure the electrical reliability of the terminal, it is necessary that the contact force of the spring is large and does not change with time. Therefore, the constituent material of the terminal is required to have excellent electric conductivity, stress relaxation resistance and corrosion resistance. Furthermore, the constituent material of the terminal is required to have excellent molding workability that can withstand complicated processing.

In order to improve the stability of the contact resistance of the terminal,
Plating is often applied. Therefore, the material of the terminal is excellent in plating properties, and diffusion occurs between the material and the plating layer due to the influence of the use environment and heat generation, and plating peeling occurs in a portion (fragile portion) where the diffusion occurs. Not required.

In an IC socket, the number of pins is increasing with an increase in the degree of integration.
There is a shift from types to pinlit arrays and chip carriers. The IC socket is E
It is widely deployed for use in P-ROMs and P-ROM writers, and for burn-in and aging of IC testers. Therefore, the constituent material of the IC socket needs to be excellent in strength, elasticity, electrical conductivity, heat resistance, and stress relaxation resistance, like the constituent material of the terminal.

Heretofore, phosphor bronze and beryllium copper have been mainly used as constituent materials of connectors for the above applications. However, when phosphor bronze is used as a press-fit type connector, there is a problem that sufficient strength and elasticity cannot be obtained. Also for IC sockets, especially I
When used for burn-in and aging of a C tester, the stress relaxation resistance and heat resistance were insufficient, and there were problems in reliability and durability. Furthermore, even when used as a general connector, there was a problem in reliability because the stress relaxation resistance was insufficient or plating peeling occurred.

[0008] On the other hand, beryllium copper has had a problem in terms of economy because it had to be subjected to aging treatment at 300 to 350 ° C after molding in order to impart strength and elasticity. Further, in the post-plating performed after the aging treatment after the forming process, there is a problem that plating is difficult to be uniformly electrodeposited on a complicatedly processed portion, and plating unevenness is likely to occur. On the other hand, in the pre-plating performed before the molding process, there is a problem that plating of a low melting point metal such as Sn or Sn-Pb cannot be performed, and the plating type is limited.

In order to solve the above problems, Cu-N
An i-Al-based or Cu-Ni-Al-B-based copper-based alloy for a connector and a method of producing the same are provided (Japanese Patent Application Nos. 62-84653, 62-209839, 62-9839). 306993
issue). However, according to these methods, Cu-N
In the case of i-Al-based and Cu-Ni-Al-B-based alloys, the problem of the reaction between the carbon mold and the additive element Ni in continuous casting is prominent in the presence of Al. There was a problem that it was remarkable. In addition, among the material properties of the sheet material obtained by the combination of the solution treatment, the aging treatment and the processing, there is a problem that the spring limit value particularly varies greatly.

[0010]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, and is excellent in strength, elasticity and electric conductivity, and excellent in moldability, stress relaxation resistance and plating reliability. An object of the present invention is to provide a copper-based alloy for a connector and a method for producing the same.

[0011]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies in order to achieve the above object, and as a result, have added appropriate amounts of Ni and Al at a regulated ratio, and further added Co, Cr and Ti.
It has been found that the above-mentioned problems can be solved by adding at least one of the above and Sn in an appropriate amount (and also adding an appropriate amount of B if necessary) and regulating the oxygen content, thereby achieving the present invention.

That is, according to the present invention, N
i: 5 to 15%, Al: 0.5 to 2.0%, Sn: 0.1 to 3.0
%, At least one of Co, Cr and Ti: 0.01
A copper-based alloy for a connector, which contains no more than 2.0% and the weight percentage ratio of Ni / Al is in the range of 3 to 10, and the oxygen content is 50 ppm or less, and the balance consists of Cu and unavoidable impurities; Ni: 5 to 15% by weight
%, Al: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B:
0.005 to 0.1%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the Ni / Al weight percentage ratio is in the range of 3 to 10, and the oxygen content is
Not more than 50 ppm, with the balance being Cu and unavoidable impurities;
Ni: 5 to 15%, Al: 0.5 to 2.0%, Sn: 0.1 to
3.0%, at least one of Co, Cr and Ti:
Continuously cast an alloy material containing 0.01 to 2.0%, the weight percentage ratio of Ni / Al is in the range of 3 to 10, and the oxygen content is 50 ppm or less, with the balance being Cu and unavoidable impurities. To obtain a blank, and press this blank
Cold rolling at a processing rate of 50% or more without elongation ,
A step of solution-treating the cold-rolled material at a temperature of 750 to 950 ° C for 10 to 600 seconds, a step of cold-rolling the solution-treated material at a processing rate of 30 to 90%, and a step of 5 to 3 at temperature
A method for producing a copper-base alloy for a connector, comprising a step of aging for 60 minutes;
i: 5 to 15%, Al: 0.5 to 2.0%, Sn: 0.1 to 3.0
%, B: 0.005 to 0.1%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the Ni
/ Range ratio of 3 to 10 weight percent of Al, and oxygen content is not more 50ppm or less, to obtain a material plate an alloy material the balance being Cu and unavoidable impurities by continuous casting, heat the material sheet Cold rolling at a working ratio of 50% or more without cold rolling, cold-rolled material at a temperature of 750 to 950 ° C for 10 to 6
Solution-treating for 00 seconds, cold-rolling the solution-treated material at a working ratio of 30 to 90%, and cold-rolling the material to 300 to 600%.
A method for producing a copper-based alloy for a connector, comprising a step of aging at a temperature of 5 ° C. for 5 to 360 minutes.

In the method for producing a copper-base alloy for a connector, the solution-treated material before cold rolling is subjected to an aging treatment at a temperature of 300 to 550 ° C. for 5 to 360 minutes, or at least a solution treatment step. By performing the treatment twice, a more suitable copper-based alloy for a connector can be obtained.

[0014]

First, the reason for limiting the range of the content of the alloy component of the present invention will be described below.

The copper-based alloy of the present invention has one feature in that the precipitation strengthening by the Ni-Al based intermetallic compound is attained. Therefore, Ni and Al are indispensable elements in the alloy of the present invention. Ni is an element that forms a compound with Al and contributes to the improvement of strength, elasticity, heat resistance, and stress relaxation resistance. It also refines the cast structure and reduces the crystal grains during solution treatment. Has the effect of blocking.

In order to exhibit such an effect, N
The content of i needs to be 5% or more by weight,
If it exceeds 15%, the electric conductivity is significantly reduced, and when a carbon mold is used in continuous casting, the reaction with the mold becomes noticeable and the soundness of the ingot is impaired.
On the other hand, if the content of Ni exceeds 15%, the solution treatment temperature becomes too high, which is disadvantageous in production and increases the material cost. Therefore, the content of Ni in the present invention is
The range was 5 to 15% by weight.

On the other hand, if the Al content is less than 0.5%,
Even when coexisting with steel, the improvement in strength, elasticity and heat resistance is small, and if it exceeds 2.0%, the precipitates become excessively large, reducing the alloy's ductility, formability, plating property, and castability. And is disadvantaged economically. Therefore, the content of Al in the present invention is in the range of 0.5 to 2.0% by weight.

The object of the present invention is advantageously achieved when Ni and Al are precipitated as a Ni—Al intermetallic compound. Requires that the weight percentage ratio of Ni / Al be limited. That is, when the weight percentage ratio of Ni / Al is smaller than 3, the amount of Al dissolved in the Cu matrix becomes excessively large, and the Ni / Al
If the weight percentage ratio is larger than 10, the amount of Ni dissolved in the Cu matrix becomes excessively large. As described above, if the amount of either Ni or Al that forms a solid solution in the Cu matrix becomes excessively large, the electrical conductivity decreases, and the strength and elasticity cannot be improved efficiently. Therefore, N in the present invention
The weight percentage ratio of i / Al was in the range of 3-10.

Sn has an effect of improving continuous castability using carbon casting. That is, Sn is Al
The reaction between Ni and carbon in the presence is efficiently prevented, which contributes to improving the soundness of the ingot and extending the life of the carbon mold. In addition, Sn forms a solid solution in the Cu matrix to improve strength and elasticity, and has an effect of particularly reducing variation in the spring limit value. The effect described above is not sufficient if the Sn content is less than 0.1% by weight, and if it exceeds 3.0%, spinodal decomposition occurs in the presence of Ni and a different phase is generated. When such a different phase is generated, the strength and elasticity can be further improved, but the moldability is significantly reduced, and the heat treatment becomes complicated, leading to an increase in cost. Therefore, the content of Sn in the present invention is 0.1 to
The range was 3.0% by weight.

Co, Cr, and Ti are not only advantageous in the production of alloys, such as preventing crystal grain coarsening in the solution treatment step and effectively suppressing grain boundary reactions in the aging treatment step, but also have strength, elasticity, and the like. Has the effect of further improving the electrical conductivity. Such an effect is exhibited by adding at least one of Co, Cr and Ti. However, if the content is less than 0.01% in weight%, the content is not sufficient. In addition, the moldability is significantly reduced, and the castability is also reduced, which is economically disadvantageous. Therefore, in the present invention, Co,
The content of at least one of Cr and Ti is 0.01 to
2.0%. The more preferable contents of Co, Cr and Ti are as follows: Co: 0.01 to 2.0% by weight, Cr: 0.01 to
1.5% by weight, Ti: 0.01 to 1.5% by weight.

B contributes as a deoxidizing agent at the time of melting and casting, and has an effect of preventing the crystal grains from coarsening at the time of solution treatment. However, when the B content is less than 0.005%, such an effect is obtained. Is not sufficiently exhibited, and if it exceeds 0.1%, the moldability decreases, which is economically disadvantageous. for that reason,
The content of B in the present invention is in the range of 0.005 to 0.1% by weight.

When O ₂ is contained in an amount of more than 50 ppm in the alloy, Al having a high affinity for oxygen is oxidized and Al ₂ is oxidized.
O ₃ is formed, and plating property and plating reliability deteriorate,
This leads to a reduction in the life of the press die. Further, when H ₂ gas is used in the production process of the alloy, hydrogen embrittlement may occur on the surface and inside. Therefore, the content of O _{2 in} the present invention is set to a range of 50 ppm or less.

The copper-base alloy of the present invention adjusted to such a composition has finely precipitated Ni-Al intermetallic compound, and has strength, elasticity, electric conductivity, moldability, stress relaxation resistance, and plating. Because it is excellent in various characteristics such as reliability,
A material having various characteristics required for recent connector materials can be obtained.

Next, a method for producing the copper-based alloy for a connector of the present invention will be described below.

First, in weight%, Ni: 5 to 15%,
Al: 0.5 to 2.0%, Sn: 0.1 to 3.0%, Co, Cr
And at least one of Ti: 0.01 to 2.0%, and the Ni / Al weight percentage ratio is in the range of 3 to 10, and the oxygen concentration is 50 ppm or less, and in some cases, B is 0.005 to 0.1. %, With the balance being continuously cast (melt cast) of an alloy material consisting of Cu and unavoidable impurities to produce a material plate (ingot).

It is desirable that the melting and casting be performed in an inert gas or reducing gas atmosphere. As the material of the casting mold for continuous casting, it is desirable to use carbon from the viewpoint of cooling (rapid cooling), consumption, reaction with molten metal, and running cost. Further, after casting, it is desirable that the ingot is rapidly cooled by secondary cooling. However, the quenching start temperature is desirably 800 ° C or higher.

Next, the produced ingot was subjected to a cold working ratio of 50.
Roll at% or more. In this case, hot rolling may be performed instead of cold rolling. However, in heating and rolling in an oxidizing atmosphere, Al as an additional element is internally oxidized to form Al ₂ O ₃ (a strong film), Undesirably, cracks tend to occur.
On the other hand, if the cold working ratio is less than 50%, the time required to eliminate segregation at the time of casting in the subsequent solution treatment step is extremely long, which is not preferable.

Next, the plate is heated at a temperature of 750 to 950 ° C.
Perform a solution treatment for 10 to 600 seconds. The processing temperature is 750
If the temperature is lower than 950 ° C, the solution does not sufficiently melt. If the temperature exceeds 950 ° C, the crystal grains become coarse in a short time. If the treatment time is less than 10 seconds, segregation during casting remains, so that the solution is not sufficiently performed.If the treatment time is more than 600 seconds, the crystal grains become coarse and uneconomical. The range was seconds.

Next, the obtained solution-treated material is subjected to pickling, if necessary, and then cold-rolled in the range of 30 to 90%. This is because, when the working ratio is less than 30%, the working strain imparted by working is small, and the strength and elasticity in the aging precipitation in the subsequent aging treatment step are not sufficiently improved, and
If the working ratio exceeds 90%, the development of rolling texture will be remarkable, and the mechanical properties will have directionality (anisotropic), and the formability will be reduced. Therefore, cold rolling before aging treatment The processing rate was in the range of 30 to 90%.

Next, heat treatment is performed at a temperature of 300 to 600 ° C. for 5 to 360 minutes as an aging treatment. If the treatment temperature is lower than 300 ° C, the time required for precipitation becomes too long, so it is not economical, and if the temperature exceeds 600 ° C, it becomes overaged,
300-600
° C. If the aging treatment time is less than 5 minutes, the formation of precipitates is insufficient, and if the aging treatment time is longer than 360 minutes, it is not preferable from the viewpoint of growth of precipitates and economical efficiency. The range was 360 minutes.

In the method of the present invention, if necessary, the solution-treated material (after cold rolling) obtained after the solution treatment may be added at a temperature of 300 to 550 ° C. for 5 to 360 minutes. Aging treatment (pre-aging treatment) may be performed. This aging treatment can be expected to further improve strength, elasticity, and electrical conductivity. If the treatment temperature in this aging treatment is less than 300 ° C., the time required for precipitation is too long and it is not economical.
If the temperature exceeds ℃, overaging occurs and further improvement of the characteristics cannot be expected. Regarding the treatment time, if the formation time is less than 5 minutes, the formation of precipitates is insufficient, and if the processing time is longer than 360 minutes, it is not preferable from the viewpoint of growth of the precipitates and economical efficiency. ~
The range was 360 minutes. However, the working ratio in the cold rolling after the pre-aging treatment is desirably 30 to 70%.
This is because if the working ratio is less than 30%, the strength and elasticity after the subsequent aging treatment are insufficient, and if the working ratio exceeds 70%, the moldability is significantly reduced.

Further, in the method of the present invention, the solution treatment step may be performed two or more times as necessary. By performing the solution treatment twice or more, the influence of the non-uniform structure and the segregation during casting can be almost eliminated. (If the influence of the casting structure is left, the elasticity and formability of the alloy are further improved. Improvement cannot be expected).

Through the above-described processing and heat treatment, a thin plate of a copper-based alloy having a structure in which a Ni-Al intermetallic compound is finely precipitated in a Cu matrix can be obtained. This copper-based alloy has both high strength, high elasticity, and high conductivity, and is excellent in moldability, plating properties, stress relaxation resistance, etc. This is a very suitable connector material to be used.

Now, the present invention will be described in further detail with reference to Examples. However, the scope of the present invention is not limited by the following examples.

[0035]

Example 1 Copper-based alloys (Sample Nos. 1-11: Sample Nos. 1-5 are alloys of the present invention, Sample Nos. 6-11 are comparative alloys) whose chemical component values (% by weight) are shown in Table 1. Was melted using a high-frequency melting furnace and continuously cast into a 10 × 100 × 10000 (mm) ingot. However, in the melt casting, the alloys of Sample Nos.
The test was performed in an atmosphere completely shielded by gas, and the No. 11 alloy was tested in the air. Further, carbon was used as a material of the mold, and the drawing was performed by a pulse method (average drawing speed 100 mm / min).

[0036]

[Table 1] After melting and casting, the surface of the obtained ingot was observed.
It was also described in.

Next, the ingot was rolled by cold rolling to a thickness of 2 mm (working rate: 80%), and was subjected to a solution treatment at a temperature of 850 ° C. for 180 seconds. After the solution treatment, cold rolling was performed again to a thickness of 0.6 mm (working rate: 70%), and the solution treatment was performed at a temperature of 850 ° C. for 150 seconds. Next, the obtained solution-treated material was pickled and buffed, cold-rolled to a thickness of 0.2 mm (working ratio 67%), and subjected to aging treatment at a temperature of 500 ° C. for 60 minutes. At the time of the heat treatment, oxidation of the material surface and inside was controlled as much as possible by setting the processing atmosphere to an inert gas or reducing gas atmosphere.

Using the test material obtained as described above, hardness, tensile strength, spring limit value, conductivity, bending workability, solderability, and characteristic variation were measured, and the results are shown in Table 1. . The hardness, tensile strength, spring limit value and conductivity were measured according to JIS Z 2244, JIS Z 2241, JIS H
Performed according to 3130 and JIS H 0505. The bending workability was measured by a 90 degree w bending test (CES-M0002-6, R =
0.2 mm, the bending axis was parallel to the rolling direction).

The solder adhesion was measured by performing solder plating on the surface (dip: Sn-40 wt% Pb, 260 ° C. × 5 sec, using weakly active rosin flux),
After heating for 00 hours, the test piece was bent 90 degrees w (R = 0.2 mm),
A peeling test was carried out with a cellophane tape, and those where the plating did not peel were evaluated as ○, and those that peeled were evaluated as x. For the measurement of the dispersion of the characteristics, a trial production was repeated three times in the same process, and the tensile strength and the spring limit value of the obtained test material were measured. The dispersion of the measured values was all within 5% of the average value. Were evaluated as ○, and those exceeding 5% were evaluated as ×.

Further, the stress relaxation characteristics (stress relaxation rate) of the alloy of the present invention of sample No. 3 and a commercially available phosphor bronze (C5210EH, 0.2 mm) were measured, and the results are shown in Table 2. Stress Measurement of relaxation property (stress relaxation ratio), 0.99 ° C. and bent into an arch shape so that the central portion Stress of the test piece is 40 kgf / mm ²
The bending after holding at a temperature of 200 ° C. for 500 hours was calculated as a stress relaxation rate. The stress relaxation rate (%) was calculated by the following equation.

Stress relaxation rate (%) = [(L ₁ -L ₂ ) /
(L ₁ −L ₀ )] × 100 In the above equation, L ₀ is the length (mm) of the jig, and L ₁ is
The starting sample length (mm), L _2, is the horizontal distance (mm) between sample ends after processing.

[0042]

[Table 2]

The following was confirmed from the results in Table 1. The alloys of the present invention of Sample Nos. 1 to 5 are excellent in balance between hardness, tensile strength, spring limit value and electrical conductivity, and excellent in bending workability, solder adhesion and castability, and furthermore, there is variation in characteristics. Due to its small size, it was very excellent as a copper base alloy for connectors.

On the other hand, Sn, Co, Cr and Ti
The comparative alloy of sample No. 6, which does not contain any of the above, was inferior in terms of castability and characteristic variation. Further, the comparative alloy of Sample No. 7, which had a larger amount of Ni and a larger percentage by weight of Ni / Al than specified in the present invention, had low conductivity and was inferior in moldability. Further, the comparative alloy of Sample No. 8 having a smaller amount of Al and having a larger percentage by weight of Ni / Al than specified in the present invention had low hardness, tensile strength and spring limit values, and was poorly balanced.

The comparative alloy of Sample No. 9 having a Sn content larger than that specified in the present invention was inferior in electrical conductivity, bending workability, castability and characteristic variations. Further, the comparative alloy of Sample No. 10 having a larger total content of Co and Ti than specified in the present invention was inferior in bending workability, solder adhesion, castability, and characteristic variation. Furthermore, Ni amount, Al amount, N
i / Al weight percentage ratio, Sn amount, and Co,
Although the total content of Cr and Ti is the value specified in the present invention, the comparative alloy of Sample No. 11 having a large oxygen content was inferior in bending workability, solder adhesion, castability, and characteristic variation.

On the other hand, from the results shown in Table 2, it was confirmed that the alloy of the present invention is more excellent in stress relaxation resistance than phosphor bronze which is a typical conventional connector material.

[0047]

Example 2 First, a copper-based alloy of the present invention showing the chemical component value (% by weight) of Sample No. 3 in Table 1 was cast, rolled and solution-treated in the same manner as in Example 1 to obtain a thickness. A solution treatment material of 0.6 mm was prepared. Next, the treated material is aged at a high temperature of 400 ° C. for 30 minutes, pickled, buffed, and
It was cold-rolled to 0.2 mm and aged at a temperature of 500 ° C. for 60 minutes.

The test material obtained as described above ("Sample A")
), The hardness, the tensile strength, the spring limit value, and the conductivity were measured, and the results are shown in Table 3. In addition, these measurements were based on Example 1. For reference, a test material (hereinafter referred to as “sample B”) was prepared from the sample of sample No. 3 in Table 1 in the same manner as in Example 1, and the hardness, tensile strength, spring limit value, and conductivity were measured. The measurement was performed, and the results are shown in Table 3.

[0049]

[Table 3]

As can be seen from Table 3, the solution treatment material obtained after the solution treatment is subjected to the aging treatment before the cold rolling treatment, whereby the hardness, tensile strength, spring limit value,
The conductivity was further improved.

[0051]

According to the development of the present invention, a copper-based alloy having excellent strength, elasticity and electric conductivity, and excellent in moldability, stress relaxation resistance and plating reliability has been obtained. Therefore, the copper-based alloy of the present invention can sufficiently cope with recent reductions in the size and weight of electrical components of transportation equipment, higher density of wiring, and higher density and higher reliability of internal mounting of electronic equipment.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H01B 1/02 H01B 1/02 A H01H 1/02 H01H 1/02 C H01R 13/03 H01R 13 / 03 A

Claims (4)

(57) [Claims] (1) Ni: 5 to 15% by weight,
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the ratio of the weight percentage of Ni / Al is in the range of 3 to 10, And the oxygen content is 50 ppm or less and the balance is C
Copper base alloy for connectors consisting of u and unavoidable impurities. 2. In weight%, Ni: 5 to 15%, A
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B: 0.005 to
0.1%, at least one of Co, Cr and Ti:
A copper-based alloy for a connector containing 0.01 to 2.0%, wherein the ratio of the weight percentage of Ni / Al is in the range of 3 to 10, and the oxygen content is 50 ppm or less, with the balance being Cu and unavoidable impurities. 3. Ni: 5 to 15% by weight, A
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, at least one of Co, Cr and Ti: 0.01 to 2.0%, and the ratio of the Ni / Al weight percentage is in the range of 3 to 10, And the oxygen content is 50 ppm or less and the balance is C
The alloy material consisting of u and unavoidable impurities is continuously cast to obtain a material plate, and this material plate is reduced to 50% without hot rolling.
Cold rolling process at the above processing rate, cold rolled material 750 ~ 950
Solution treatment at 10 ° C for 10-600 seconds, cold-rolling of solution-treated material at 30-90% reduction rate, and aging cold-rolled material at 300-600 ° C for 5-360 minutes A method for producing a copper-based alloy for a connector, comprising a step of treating. 4. Ni: 5 to 15% by weight, A
l: 0.5 to 2.0%, Sn: 0.1 to 3.0%, B: 0.005 to
0.1%, at least one of Co, Cr and Ti:
Continuously cast an alloy material containing 0.01 to 2.0%, the weight percentage ratio of Ni / Al is in the range of 3 to 10, and the oxygen content is 50 ppm or less, with the balance being Cu and unavoidable impurities. To obtain a blank, and press this blank
Cold rolling at a processing rate of 50% or more without elongation ,
A step of solution-treating the cold-rolled material at a temperature of 750 to 950 ° C for 10 to 600 seconds, a step of cold-rolling the solution-treated material at a processing rate of 30 to 90%, and a step of 5 to 3 at temperature
A method for producing a copper-based alloy for a connector, comprising a step of aging for 60 minutes.