JPS57187195A - Silver solder material - Google Patents

Silver solder material

Info

Publication number
JPS57187195A
JPS57187195A JP7200581A JP7200581A JPS57187195A JP S57187195 A JPS57187195 A JP S57187195A JP 7200581 A JP7200581 A JP 7200581A JP 7200581 A JP7200581 A JP 7200581A JP S57187195 A JPS57187195 A JP S57187195A
Authority
JP
Japan
Prior art keywords
silver solder
soldering
alloy
solder
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7200581A
Other languages
Japanese (ja)
Other versions
JPS6247117B2 (en
Inventor
Takashi Nara
Hiroto Daigo
Osamu Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Priority to JP7200581A priority Critical patent/JPS57187195A/en
Publication of JPS57187195A publication Critical patent/JPS57187195A/en
Publication of JPS6247117B2 publication Critical patent/JPS6247117B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To improve the surface state after soldering without damaging the basic capacity as a solder material, by adding small quantities of Si, Pb, Mg, etc. to an Ag-Cu alloy and adding Ge, Mn, Ni, etc. to it furthermore. CONSTITUTION:0.05-0.5% one or more out of Si, Pb, and Mg are added to the Ag-Cu alloy consisting of 50-95% Ag and 5-50% Cu, and further, 0.005-1% one or more of Ge, Mn, and Ni are added to this Ag-Cu alloy, thus obtaining a silver solder. Si, Pb, and Mg are metal elements easy to combine with oxygen and deoxidize the silver solder in the course of production and use of the silver solder and prevent the soldering surface from being rough by gas discharge when the silver solder is solidified. Ge, Mn, and Ni make the metallic organization minute for solidification of the silver solder to make the surface smooth. The soldering strength of this silver solder is approximately equivalent to that of the conventional soldering material in respect to the basic capacity, and the spread area is reduced slightly but it is not a problem in the practical use.
JP7200581A 1981-05-13 1981-05-13 Silver solder material Granted JPS57187195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7200581A JPS57187195A (en) 1981-05-13 1981-05-13 Silver solder material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7200581A JPS57187195A (en) 1981-05-13 1981-05-13 Silver solder material

Publications (2)

Publication Number Publication Date
JPS57187195A true JPS57187195A (en) 1982-11-17
JPS6247117B2 JPS6247117B2 (en) 1987-10-06

Family

ID=13476861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7200581A Granted JPS57187195A (en) 1981-05-13 1981-05-13 Silver solder material

Country Status (1)

Country Link
JP (1) JPS57187195A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589273U (en) * 1981-07-06 1983-01-21 日本鋼管株式会社 Rotating refractory pouring device
WO1996022400A1 (en) * 1995-01-18 1996-07-25 Apecs Investment Castings Pty. Ltd. Silver alloy compositions
AU688773B2 (en) * 1993-11-15 1998-03-19 Apecs Investment Castings Pty Ltd Silver alloy compositions
US6726877B1 (en) * 1993-11-15 2004-04-27 Anthony Phillip Eccles Silver alloy compositions
WO2005056213A1 (en) * 2003-12-10 2005-06-23 Middlesex Silver Co. Limited Silver chain manufacture
JP2008188670A (en) * 2007-01-12 2008-08-21 Terumo Corp Brazing material, guide wire, and joined assembly
CN109175783A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of quaternary alloy solder
CN109175784A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of novel oxidation-resistant quaternary alloy solder
CN110238559A (en) * 2019-06-17 2019-09-17 无锡日月合金材料有限公司 A kind of novel quaternary alloy solder and preparation method thereof
US10807201B2 (en) * 2014-11-18 2020-10-20 Baker Hughes Holdings Llc Braze materials and earth-boring tools comprising braze materials
WO2022116405A1 (en) * 2020-12-04 2022-06-09 杭州华光焊接新材料股份有限公司 Low-silver-content filler material for brazing vacuum electronic device, and preparation method therefor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867153A (en) * 1971-12-17 1973-09-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867153A (en) * 1971-12-17 1973-09-13

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589273U (en) * 1981-07-06 1983-01-21 日本鋼管株式会社 Rotating refractory pouring device
JPS6142673Y2 (en) * 1981-07-06 1986-12-03
AU688773B2 (en) * 1993-11-15 1998-03-19 Apecs Investment Castings Pty Ltd Silver alloy compositions
US6726877B1 (en) * 1993-11-15 2004-04-27 Anthony Phillip Eccles Silver alloy compositions
WO1996022400A1 (en) * 1995-01-18 1996-07-25 Apecs Investment Castings Pty. Ltd. Silver alloy compositions
WO2005056213A1 (en) * 2003-12-10 2005-06-23 Middlesex Silver Co. Limited Silver chain manufacture
JP2008188670A (en) * 2007-01-12 2008-08-21 Terumo Corp Brazing material, guide wire, and joined assembly
US10807201B2 (en) * 2014-11-18 2020-10-20 Baker Hughes Holdings Llc Braze materials and earth-boring tools comprising braze materials
CN109175783A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of quaternary alloy solder
CN109175784A (en) * 2018-10-31 2019-01-11 无锡日月合金材料有限公司 A kind of novel oxidation-resistant quaternary alloy solder
CN110238559A (en) * 2019-06-17 2019-09-17 无锡日月合金材料有限公司 A kind of novel quaternary alloy solder and preparation method thereof
WO2022116405A1 (en) * 2020-12-04 2022-06-09 杭州华光焊接新材料股份有限公司 Low-silver-content filler material for brazing vacuum electronic device, and preparation method therefor

Also Published As

Publication number Publication date
JPS6247117B2 (en) 1987-10-06

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