JPS56109157A - Brazed structural body of al material and cu material - Google Patents

Brazed structural body of al material and cu material

Info

Publication number
JPS56109157A
JPS56109157A JP1229380A JP1229380A JPS56109157A JP S56109157 A JPS56109157 A JP S56109157A JP 1229380 A JP1229380 A JP 1229380A JP 1229380 A JP1229380 A JP 1229380A JP S56109157 A JPS56109157 A JP S56109157A
Authority
JP
Japan
Prior art keywords
brazed
filler metal
brazing filler
structural body
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1229380A
Other languages
Japanese (ja)
Inventor
Tatsuo Shimizu
Yoshihiko Kuwahata
Tomio Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1229380A priority Critical patent/JPS56109157A/en
Publication of JPS56109157A publication Critical patent/JPS56109157A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE: To braze an Al material and a Cu material in a short time with good workability by beforehand forming an Ni plating layer or an Ni clad layer on the joining part of said materials.
CONSTITUTION: In the case of making a brazed structural body by joining an Al material and a Cu material by way of a brazing filler metal, Ni plating is beforehand applied on the joining part at least one of the Al material and the Cu material, to form a plating layer. It is equally well to form an Ni clad layer in place of the plating layer. After this, the Al material and the Cu material are brazed by using a brazing filler metal, for example, a brazing filler metal consisting of, for example, Al-Si or an alloy consisting essentially of Al-Si.
COPYRIGHT: (C)1981,JPO&Japio
JP1229380A 1980-02-04 1980-02-04 Brazed structural body of al material and cu material Pending JPS56109157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1229380A JPS56109157A (en) 1980-02-04 1980-02-04 Brazed structural body of al material and cu material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1229380A JPS56109157A (en) 1980-02-04 1980-02-04 Brazed structural body of al material and cu material

Publications (1)

Publication Number Publication Date
JPS56109157A true JPS56109157A (en) 1981-08-29

Family

ID=11801279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1229380A Pending JPS56109157A (en) 1980-02-04 1980-02-04 Brazed structural body of al material and cu material

Country Status (1)

Country Link
JP (1) JPS56109157A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100967A (en) * 1981-12-08 1983-06-15 Nec Home Electronics Ltd Manufacture of metallic parts
JPS59150659A (en) * 1983-02-17 1984-08-28 Showa Alum Corp Method for forming porous layer on surface of copper material
JPS6030573A (en) * 1983-07-28 1985-02-16 Tanaka Kikinzoku Kogyo Kk Brazing method by pd-contg. ag solder
JPS63108968A (en) * 1986-10-27 1988-05-13 Aichi Steel Works Ltd Method for soldering aluminum or aluminum group alloy
WO2010124948A1 (en) * 2009-04-30 2010-11-04 Siemens Aktiengesellschaft COMPONENT FOR GUIDING AN ELECTRIC CURRENT SUCH BETWEEN AN Al ALLOY MATERIAL AND A Cu ALLOY CONTACT PIECE; METHOD FOR THE PRODUCTION THEREOF
WO2022199061A1 (en) * 2021-03-23 2022-09-29 浙江永旺焊材制造有限公司 Self-fluxing brazing alloy applied to welding of aluminum-copper dissimilar materials and welding method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58100967A (en) * 1981-12-08 1983-06-15 Nec Home Electronics Ltd Manufacture of metallic parts
JPS59150659A (en) * 1983-02-17 1984-08-28 Showa Alum Corp Method for forming porous layer on surface of copper material
JPS6030573A (en) * 1983-07-28 1985-02-16 Tanaka Kikinzoku Kogyo Kk Brazing method by pd-contg. ag solder
JPH035910B2 (en) * 1983-07-28 1991-01-28 Tanaka Precious Metal Ind
JPS63108968A (en) * 1986-10-27 1988-05-13 Aichi Steel Works Ltd Method for soldering aluminum or aluminum group alloy
WO2010124948A1 (en) * 2009-04-30 2010-11-04 Siemens Aktiengesellschaft COMPONENT FOR GUIDING AN ELECTRIC CURRENT SUCH BETWEEN AN Al ALLOY MATERIAL AND A Cu ALLOY CONTACT PIECE; METHOD FOR THE PRODUCTION THEREOF
WO2022199061A1 (en) * 2021-03-23 2022-09-29 浙江永旺焊材制造有限公司 Self-fluxing brazing alloy applied to welding of aluminum-copper dissimilar materials and welding method

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