JPS5695492A - Copper-group brazing alloy - Google Patents

Copper-group brazing alloy

Info

Publication number
JPS5695492A
JPS5695492A JP17097979A JP17097979A JPS5695492A JP S5695492 A JPS5695492 A JP S5695492A JP 17097979 A JP17097979 A JP 17097979A JP 17097979 A JP17097979 A JP 17097979A JP S5695492 A JPS5695492 A JP S5695492A
Authority
JP
Japan
Prior art keywords
copper
brazing alloy
alloy
group brazing
bonding strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17097979A
Other languages
Japanese (ja)
Other versions
JPS6113911B2 (en
Inventor
Masatoshi Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP17097979A priority Critical patent/JPS5695492A/en
Publication of JPS5695492A publication Critical patent/JPS5695492A/en
Publication of JPS6113911B2 publication Critical patent/JPS6113911B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prepare an inexpensive copper-group brazing alloy that has bonding strength equivalent to that of silver solder by combining and including Zn, Ag, Mn, Ni, and Sn by proper amounts. CONSTITUTION:The alloy consists of 25.1-34.9wt% Zn, 10-14.9wt% Ag, 2- 4.9wt% Mn, 1-2wt% Ni, and 0.1-5wt% Sb and Cu for the remainder. This alloy contains a small amount of silver and is inexpensive, excellent in fluidity its bonding strength is superior to the convertional silver solder. Further, no Cd harmful to the human body is contained.
JP17097979A 1979-12-28 1979-12-28 Copper-group brazing alloy Granted JPS5695492A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17097979A JPS5695492A (en) 1979-12-28 1979-12-28 Copper-group brazing alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17097979A JPS5695492A (en) 1979-12-28 1979-12-28 Copper-group brazing alloy

Publications (2)

Publication Number Publication Date
JPS5695492A true JPS5695492A (en) 1981-08-01
JPS6113911B2 JPS6113911B2 (en) 1986-04-16

Family

ID=15914882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17097979A Granted JPS5695492A (en) 1979-12-28 1979-12-28 Copper-group brazing alloy

Country Status (1)

Country Link
JP (1) JPS5695492A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689105A (en) * 2012-06-11 2012-09-26 杭州华光焊接新材料股份有限公司 Indium-containing active copper-based solder
CN103506771A (en) * 2012-11-23 2014-01-15 广东美芝制冷设备有限公司 Solder composition and preparing method and application thereof
CN113664412A (en) * 2021-09-01 2021-11-19 上海科弗新材料科技有限公司 Material for diamond brazing and preparation method thereof
CN114571137A (en) * 2022-05-09 2022-06-03 中机智能装备创新研究院(宁波)有限公司 Copper-based brazing paste, copper-based pre-alloy and preparation method thereof
CN114918576A (en) * 2022-06-23 2022-08-19 北京安泰六九新材料科技有限公司 Tungsten carbide binding target material and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102689105A (en) * 2012-06-11 2012-09-26 杭州华光焊接新材料股份有限公司 Indium-containing active copper-based solder
CN103506771A (en) * 2012-11-23 2014-01-15 广东美芝制冷设备有限公司 Solder composition and preparing method and application thereof
CN113664412A (en) * 2021-09-01 2021-11-19 上海科弗新材料科技有限公司 Material for diamond brazing and preparation method thereof
CN113664412B (en) * 2021-09-01 2024-02-06 上海科弗新材料科技有限公司 Material for diamond brazing and preparation method thereof
CN114571137A (en) * 2022-05-09 2022-06-03 中机智能装备创新研究院(宁波)有限公司 Copper-based brazing paste, copper-based pre-alloy and preparation method thereof
CN114918576A (en) * 2022-06-23 2022-08-19 北京安泰六九新材料科技有限公司 Tungsten carbide binding target material and preparation method thereof
CN114918576B (en) * 2022-06-23 2023-08-18 北京安泰六九新材料科技有限公司 Tungsten carbide binding target and preparation method thereof

Also Published As

Publication number Publication date
JPS6113911B2 (en) 1986-04-16

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