JPS5695491A - Copper-group brazing alloy - Google Patents
Copper-group brazing alloyInfo
- Publication number
- JPS5695491A JPS5695491A JP17097879A JP17097879A JPS5695491A JP S5695491 A JPS5695491 A JP S5695491A JP 17097879 A JP17097879 A JP 17097879A JP 17097879 A JP17097879 A JP 17097879A JP S5695491 A JPS5695491 A JP S5695491A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- brazing alloy
- alloy
- group brazing
- bonding strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To prepare an inexpensive copper-group brazing alloy that provides superior operation and large bonding strength, by combining and including Zn, Ag, Sn, and Sb by adequate amounts. CONSTITUTION:The alloy consists of 25.1-29.9wt% Zn, 10-14.9wt% Ag, 0.5- 1.5wt% Sn, 0.1-5wt% Sb, and Cu for the remainder. Because of small content of Ag, this alloy is inexpensive and excellent in fluidity having bonding strength equivalent to that of silver solder and contains no Cd harmful to the human body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17097879A JPS5695491A (en) | 1979-12-28 | 1979-12-28 | Copper-group brazing alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17097879A JPS5695491A (en) | 1979-12-28 | 1979-12-28 | Copper-group brazing alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5695491A true JPS5695491A (en) | 1981-08-01 |
JPS6113910B2 JPS6113910B2 (en) | 1986-04-16 |
Family
ID=15914866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17097879A Granted JPS5695491A (en) | 1979-12-28 | 1979-12-28 | Copper-group brazing alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5695491A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITVI20120335A1 (en) * | 2012-12-17 | 2014-06-18 | One Karat Gold S R L | LEAGUE FOR THE PRODUCTION OF JEWELRY |
CN113664412A (en) * | 2021-09-01 | 2021-11-19 | 上海科弗新材料科技有限公司 | Material for diamond brazing and preparation method thereof |
-
1979
- 1979-12-28 JP JP17097879A patent/JPS5695491A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITVI20120335A1 (en) * | 2012-12-17 | 2014-06-18 | One Karat Gold S R L | LEAGUE FOR THE PRODUCTION OF JEWELRY |
WO2014096938A1 (en) * | 2012-12-17 | 2014-06-26 | 1Ktg Srl | Alloy for the production of jewels |
CN113664412A (en) * | 2021-09-01 | 2021-11-19 | 上海科弗新材料科技有限公司 | Material for diamond brazing and preparation method thereof |
CN113664412B (en) * | 2021-09-01 | 2024-02-06 | 上海科弗新材料科技有限公司 | Material for diamond brazing and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS6113910B2 (en) | 1986-04-16 |
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