JPS56144893A - Solder alloy for fitting lead on silver electrode - Google Patents
Solder alloy for fitting lead on silver electrodeInfo
- Publication number
- JPS56144893A JPS56144893A JP4677480A JP4677480A JPS56144893A JP S56144893 A JPS56144893 A JP S56144893A JP 4677480 A JP4677480 A JP 4677480A JP 4677480 A JP4677480 A JP 4677480A JP S56144893 A JPS56144893 A JP S56144893A
- Authority
- JP
- Japan
- Prior art keywords
- silver
- less
- content
- soldering
- liquidus temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To improve the soldering property of Sn-Ag-Sb-Pb solders without harming the characteristics, by specifying the composition. CONSTITUTION:The solder alloy is composed of, by wt., 15-65% Sn, 0.5-3.5% Ag, <=0.5-3.0% Sb, and the remainder of Pb. This solder has a soldering property which can sufficiently be adopted to high speed soldering without harming the silver disolving, heat resistance and solid diffusion of silver. When the Sn content is less or more than the above, the improvement effect of the soldering property becomes less in the former case, and the temperature rises higher than the required liquidus temperature in the latter case, in addition, it is required to add a large amount of silver to prevent silver disolving and, at the same time, it makes the liquidus temperature higher. When the Ag content is less or more than the above mentioned range, the diffusion melting of silver cannot be controlled sufficiently in the former case, furthermore, it raises the liquidus temperature in the latter ease. When the Sb content is less or more than the above mentioned range, no advantageous effect is expected in the adhering strength in the former case, and the soldering property becomes inferior in the latter case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4677480A JPS56144893A (en) | 1980-04-11 | 1980-04-11 | Solder alloy for fitting lead on silver electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4677480A JPS56144893A (en) | 1980-04-11 | 1980-04-11 | Solder alloy for fitting lead on silver electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56144893A true JPS56144893A (en) | 1981-11-11 |
Family
ID=12756667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4677480A Pending JPS56144893A (en) | 1980-04-11 | 1980-04-11 | Solder alloy for fitting lead on silver electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56144893A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869871A (en) * | 1988-03-17 | 1989-09-26 | Toyota Motor Corporation | Pb-Sn-Sb-In solder alloy |
JPH04333392A (en) * | 1991-04-04 | 1992-11-20 | Internatl Business Mach Corp <Ibm> | Solder alloy and metallized structure |
US5690890A (en) * | 1993-11-09 | 1997-11-25 | Matsushita Electric Industrial Co., Ltd. | Solder |
DE19750104B4 (en) * | 1996-11-14 | 2005-12-08 | Senju Metal Industry Co., Ltd. | Use of a solder paste for chip components |
-
1980
- 1980-04-11 JP JP4677480A patent/JPS56144893A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4869871A (en) * | 1988-03-17 | 1989-09-26 | Toyota Motor Corporation | Pb-Sn-Sb-In solder alloy |
JPH04333392A (en) * | 1991-04-04 | 1992-11-20 | Internatl Business Mach Corp <Ibm> | Solder alloy and metallized structure |
US5690890A (en) * | 1993-11-09 | 1997-11-25 | Matsushita Electric Industrial Co., Ltd. | Solder |
DE19750104B4 (en) * | 1996-11-14 | 2005-12-08 | Senju Metal Industry Co., Ltd. | Use of a solder paste for chip components |
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