JPS5447845A - Low melting point copper alloys for welding and soldering - Google Patents

Low melting point copper alloys for welding and soldering

Info

Publication number
JPS5447845A
JPS5447845A JP11410377A JP11410377A JPS5447845A JP S5447845 A JPS5447845 A JP S5447845A JP 11410377 A JP11410377 A JP 11410377A JP 11410377 A JP11410377 A JP 11410377A JP S5447845 A JPS5447845 A JP S5447845A
Authority
JP
Japan
Prior art keywords
melting point
soldering
copper alloys
low
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11410377A
Other languages
Japanese (ja)
Inventor
Deiitoritsuhi.Eerushiyureegeru
Hideo Kono
Sadao Nagayama
Yoshinori Bando
Hajime Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP11410377A priority Critical patent/JPS5447845A/en
Publication of JPS5447845A publication Critical patent/JPS5447845A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Arc Welding In General (AREA)

Abstract

PURPOSE:Low-priced low melting point copper alloys for welding and soldering having intermediate melting point between hard and soft solder, obtained by adding one kind or more than two kinds of Mn, Zr, Si, Sn and Ag to Cu. CONSTITUTION:Copper alloys containing Mn; 15-35% and 0.05-4.0% of one kind or two kinds or more of Zr, Si, Sn and Ag per each one element. Melting point of the above alloys is lowered by adding Mn as Cu group hard solder. Si is used to prevent the evaporation of Mn and to improve the wettability of deposited metal and Zr is used for crystal atomizing agent and also, the fluidity of deposited metal is improved, by Sn and Ag. Melting point of the above soldering material is low, for example, 840 deg.C of liquid phase line and 820 deg.C of solid phase line and also, the price is low because of containing a small quantity of Ag.
JP11410377A 1977-09-22 1977-09-22 Low melting point copper alloys for welding and soldering Pending JPS5447845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11410377A JPS5447845A (en) 1977-09-22 1977-09-22 Low melting point copper alloys for welding and soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11410377A JPS5447845A (en) 1977-09-22 1977-09-22 Low melting point copper alloys for welding and soldering

Publications (1)

Publication Number Publication Date
JPS5447845A true JPS5447845A (en) 1979-04-14

Family

ID=14629186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11410377A Pending JPS5447845A (en) 1977-09-22 1977-09-22 Low melting point copper alloys for welding and soldering

Country Status (1)

Country Link
JP (1) JPS5447845A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072695A (en) * 1983-09-28 1985-04-24 Maruyasu Kogyo Kk Brazing alloy for stainless steel
JPS6120695A (en) * 1984-06-22 1986-01-29 アライド・コーポレーシヨン Homogeneous low melting-point brazing filler metal for joining alloy iron and non-ferrous alloy
MD164Z (en) * 2009-04-15 2010-10-31 Институт Прикладной Физики Академии Наук Молдовы Process for brazing sintered hard alloys and carbon steels
CN102828065A (en) * 2012-09-21 2012-12-19 常州武帆合金有限公司 Copper-manganese alloy

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU137386A1 (en) * 1960-05-19 1960-11-30 А.Ф. Каменска Self-flux solder
JPS4834495A (en) * 1971-09-01 1973-05-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU137386A1 (en) * 1960-05-19 1960-11-30 А.Ф. Каменска Self-flux solder
JPS4834495A (en) * 1971-09-01 1973-05-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072695A (en) * 1983-09-28 1985-04-24 Maruyasu Kogyo Kk Brazing alloy for stainless steel
JPS6120695A (en) * 1984-06-22 1986-01-29 アライド・コーポレーシヨン Homogeneous low melting-point brazing filler metal for joining alloy iron and non-ferrous alloy
MD164Z (en) * 2009-04-15 2010-10-31 Институт Прикладной Физики Академии Наук Молдовы Process for brazing sintered hard alloys and carbon steels
CN102828065A (en) * 2012-09-21 2012-12-19 常州武帆合金有限公司 Copper-manganese alloy

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