JPS57171599A - Low melting point cu-ag system alloy solder with excellent wetting property - Google Patents

Low melting point cu-ag system alloy solder with excellent wetting property

Info

Publication number
JPS57171599A
JPS57171599A JP5426681A JP5426681A JPS57171599A JP S57171599 A JPS57171599 A JP S57171599A JP 5426681 A JP5426681 A JP 5426681A JP 5426681 A JP5426681 A JP 5426681A JP S57171599 A JPS57171599 A JP S57171599A
Authority
JP
Japan
Prior art keywords
melting point
low melting
wetting property
system alloy
excellent wetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5426681A
Other languages
Japanese (ja)
Other versions
JPS6216752B2 (en
Inventor
Hideaki Yoshida
Masaki Morikawa
Kunio Kishida
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP5426681A priority Critical patent/JPS57171599A/en
Publication of JPS57171599A publication Critical patent/JPS57171599A/en
Publication of JPS6216752B2 publication Critical patent/JPS6216752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To achieve a low melting point Cu-Ag system alloy solder with excellent wetting property, by including specific amount of Ag, Pd and Si to Cu. CONSTITUTION:The composition of the Cu-Ag system alloy solder is composed of 25-65% Ag, 0.5-25% Pd, 0.25-6.5% Si, and balance is Cu and inevitable impurities. Further, one or >=2 kinds Fe, Ni and Co, one or two kinds 1-10 Sn and In, one or two kinds 1-10 B and Li are added as required. This solder has a low vapor pressure and a low melting point and excellent wetting property is shown in soldering and no base material crack due to the erosion of solder takes place.
JP5426681A 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property Granted JPS57171599A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5426681A JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5426681A JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP7707786A Division JPS6224893A (en) 1986-04-03 1986-04-03 Low melting point cu-ag alloy brazing filler metal having good wettability
JP7707686A Division JPS6224892A (en) 1986-04-03 1986-04-03 Low melting point cu-ag alloy brazing filler metal having good wettability

Publications (2)

Publication Number Publication Date
JPS57171599A true JPS57171599A (en) 1982-10-22
JPS6216752B2 JPS6216752B2 (en) 1987-04-14

Family

ID=12965760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5426681A Granted JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Country Status (1)

Country Link
JP (1) JPS57171599A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008183612A (en) * 2007-01-31 2008-08-14 Jfe Steel Kk Laser brazing method
EP2650077A4 (en) * 2010-12-09 2015-10-21 Nhk Spring Co Ltd Brazing material for bonding in atmosphere, bonded article, and current collector material
WO2016159316A1 (en) * 2015-03-31 2016-10-06 日本発條株式会社 Alloy material, contact probe, and connection terminal
JP2019173094A (en) * 2018-03-28 2019-10-10 住友金属鉱山株式会社 Solder joint electrode and copper alloy target for film formation of solder joint electrode
CN110964941A (en) * 2019-12-27 2020-04-07 东莞正丰科技有限公司 Composite carbon material silver-based electric contact material and preparation method thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008183612A (en) * 2007-01-31 2008-08-14 Jfe Steel Kk Laser brazing method
EP2650077A4 (en) * 2010-12-09 2015-10-21 Nhk Spring Co Ltd Brazing material for bonding in atmosphere, bonded article, and current collector material
WO2016159316A1 (en) * 2015-03-31 2016-10-06 日本発條株式会社 Alloy material, contact probe, and connection terminal
JPWO2016159316A1 (en) * 2015-03-31 2018-03-08 日本発條株式会社 Alloy materials, contact probes and connection terminals
JP2019173094A (en) * 2018-03-28 2019-10-10 住友金属鉱山株式会社 Solder joint electrode and copper alloy target for film formation of solder joint electrode
CN110317969A (en) * 2018-03-28 2019-10-11 住友金属矿山株式会社 The overlay film of solder bonding electrodes and solder bonding electrodes, which is formed, uses copper alloy target
CN110317969B (en) * 2018-03-28 2022-01-14 住友金属矿山株式会社 Solder bonding electrode and copper alloy target for forming coating film of solder bonding electrode
TWI761657B (en) * 2018-03-28 2022-04-21 日商住友金屬鑛山股份有限公司 Copper alloy targets for forming solder joint electrodes and coatings for solder joint electrodes
CN110964941A (en) * 2019-12-27 2020-04-07 东莞正丰科技有限公司 Composite carbon material silver-based electric contact material and preparation method thereof

Also Published As

Publication number Publication date
JPS6216752B2 (en) 1987-04-14

Similar Documents

Publication Publication Date Title
ZA853979B (en) Brazed composite compact implement
JPS5797891A (en) Cu-ag alloy brazing material
JPS57171599A (en) Low melting point cu-ag system alloy solder with excellent wetting property
JPS5579857A (en) Alloy with superior molten zinc corrosion resistance
JPS5760046A (en) Aluminum alloy for brazing
JPS5641096A (en) Low melting point cu-mn system soldering material having excellent wetting property and fluidity
JPS57108235A (en) Copper alloy for lead frame
JPS56165591A (en) Low melting point cu-mn base alloy brazing filler metal having good wetting property
JPS569095A (en) Low melting point hard solder material
JPS56127742A (en) Cu-mn alloy solder material free from generation of pinhole deficiency
JPS5770099A (en) Gold brazing filler metal
JPS56116854A (en) Noncrystalline alloy having low thermal expansion coefficient
JPS6431591A (en) Gold filler metal for brazing
JPS5722897A (en) Au alloy soldering material for stainless steel
JPS5797866A (en) Cu alloy for welding electrode and soldering iron tip of superior molten metal corrosion resistance
JPS5744492A (en) Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure
JPS57115997A (en) Low melting point cu-ag alloy brazing filler metal of good wettability
JPS5764495A (en) Cu-ag type alloy brazing filler metal of low content of ag
JPS5782455A (en) Low expansive alloy
JPS5744493A (en) Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure
SU564128A1 (en) Solder for soldering metallized ceramics with metal
JPS57126959A (en) High strength and high toughness steel for pipe line with excellent hydrogen sulfide crack resistance
JPS56156736A (en) Co alloy with superior erosion resistance to molten zinc
JPS565950A (en) Fe-ni-co alloy with superior stress corrosion crack resistance
JPS56165592A (en) Low melting point silver solder alloy for brazing titanium and titanium alloy