JPS5744492A - Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure - Google Patents
Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressureInfo
- Publication number
- JPS5744492A JPS5744492A JP12087080A JP12087080A JPS5744492A JP S5744492 A JPS5744492 A JP S5744492A JP 12087080 A JP12087080 A JP 12087080A JP 12087080 A JP12087080 A JP 12087080A JP S5744492 A JPS5744492 A JP S5744492A
- Authority
- JP
- Japan
- Prior art keywords
- low
- braze material
- vapor pressure
- alloy braze
- type alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Contacts (AREA)
Abstract
PURPOSE:To provide a titled alloy braze material of a low cost by the specific composition contg. Ag, Si, B or Li and consisting of the balance Cu. CONSTITUTION:This Cu-Ag type alloy braze material of a low content of Ag has the following composition by weight %: It has the composition contg. 5-35% Ag, 2.5-13% Si, and 0.001-0.8% >= B and/or Li, and if necessary either one or both of 1-10% >= Sn and/or In and 1-10% >= at least one kind of Fe, Ni, and Co, and consisting of the balance Cu and unavoidable impurities. Although this alloy braze material is relatively low in the content of Ag, it has extremely low vapor pressure and m.p. and has good wettability.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087080A JPS5744492A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
EP81902372A EP0058206B1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
PCT/JP1981/000189 WO1982000790A1 (en) | 1980-09-01 | 1981-08-25 | Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure |
US06/373,498 US4416853A (en) | 1980-09-01 | 1981-08-25 | Cu-Ag base alloy brazing filler material |
DE8181902372T DE3172679D1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12087080A JPS5744492A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5744492A true JPS5744492A (en) | 1982-03-12 |
JPS6113913B2 JPS6113913B2 (en) | 1986-04-16 |
Family
ID=14796985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12087080A Granted JPS5744492A (en) | 1980-09-01 | 1980-09-01 | Cu-ag type alloy braze material of low content of ag having good brazeability and low vapor pressure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5744492A (en) |
-
1980
- 1980-09-01 JP JP12087080A patent/JPS5744492A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6113913B2 (en) | 1986-04-16 |
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