JPS5764495A - Cu-ag type alloy brazing filler metal of low content of ag - Google Patents
Cu-ag type alloy brazing filler metal of low content of agInfo
- Publication number
- JPS5764495A JPS5764495A JP13953580A JP13953580A JPS5764495A JP S5764495 A JPS5764495 A JP S5764495A JP 13953580 A JP13953580 A JP 13953580A JP 13953580 A JP13953580 A JP 13953580A JP S5764495 A JPS5764495 A JP S5764495A
- Authority
- JP
- Japan
- Prior art keywords
- brazing filler
- alloy brazing
- filler metal
- low content
- type alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To obtain a Cu-Ag type alloy brazing filler metal of a low content of Ag having good brazing property, and low vapor pressure by forming said material of the composition consisting of specific amts. of Ag, Si, and Cu. CONSTITUTION:The alloy brazing filler metal is constituted of the composition consisting of 5-35 Ag, 2.5-13 Si by wt% and the balance Cu and unavoidable impurities or the composition consisting of adding 1-10 of one or >=2 kinds Sn, In to this and the balance Cu and unavoidable impurities. Such Cu-Ag type alloy brazing filler metal of a low content of Ag has good brazing stickability and low vapor pressure despite the extremely low content of Ag as compared to conventional Cu- Ag type and Ag-Cu-Sn alloy brazing filler metals.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13953580A JPS5764495A (en) | 1980-10-06 | 1980-10-06 | Cu-ag type alloy brazing filler metal of low content of ag |
US06/373,498 US4416853A (en) | 1980-09-01 | 1981-08-25 | Cu-Ag base alloy brazing filler material |
DE8181902372T DE3172679D1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
EP81902372A EP0058206B1 (en) | 1980-09-01 | 1981-08-25 | Cu-ag base alloy brazing filler material |
PCT/JP1981/000189 WO1982000790A1 (en) | 1980-09-01 | 1981-08-25 | Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13953580A JPS5764495A (en) | 1980-10-06 | 1980-10-06 | Cu-ag type alloy brazing filler metal of low content of ag |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5764495A true JPS5764495A (en) | 1982-04-19 |
JPS6113915B2 JPS6113915B2 (en) | 1986-04-16 |
Family
ID=15247531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13953580A Granted JPS5764495A (en) | 1980-09-01 | 1980-10-06 | Cu-ag type alloy brazing filler metal of low content of ag |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5764495A (en) |
-
1980
- 1980-10-06 JP JP13953580A patent/JPS5764495A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6113915B2 (en) | 1986-04-16 |
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