JPS5698436A - Gold solder - Google Patents

Gold solder

Info

Publication number
JPS5698436A
JPS5698436A JP16046779A JP16046779A JPS5698436A JP S5698436 A JPS5698436 A JP S5698436A JP 16046779 A JP16046779 A JP 16046779A JP 16046779 A JP16046779 A JP 16046779A JP S5698436 A JPS5698436 A JP S5698436A
Authority
JP
Japan
Prior art keywords
mechanical properties
gold
solder
gold solder
moreover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16046779A
Other languages
Japanese (ja)
Inventor
Takeshi Ito
Kenichi Shimodaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP16046779A priority Critical patent/JPS5698436A/en
Publication of JPS5698436A publication Critical patent/JPS5698436A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)

Abstract

PURPOSE:To provide the gold solder with low m.p. excellent in corrosion resistance and mechanical properties obtained by adding Sn and In extremely decreasing the m.p. to an Au base and, moreover, adding Zn, Cu and Ag as elements enhancing the mechanical properties of Au-Sn-In. CONSTITUTION:The gold solder consists of, in the weight ratio, 50-80% of Au 12K or more, 3-14% of Sn, 2-17% of In, 1-10% of Zn, 6-14% of Cu and the remainder of Ag. Said gold alloy has the mechanical properties equal to that of a conventional hard solder and liquid phase line temp. thereof is low, for example, 600 deg.C, or less and, moreover, corrosion resistance and mechanical properties thereof are excellent.
JP16046779A 1979-12-11 1979-12-11 Gold solder Pending JPS5698436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16046779A JPS5698436A (en) 1979-12-11 1979-12-11 Gold solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16046779A JPS5698436A (en) 1979-12-11 1979-12-11 Gold solder

Publications (1)

Publication Number Publication Date
JPS5698436A true JPS5698436A (en) 1981-08-07

Family

ID=15715569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16046779A Pending JPS5698436A (en) 1979-12-11 1979-12-11 Gold solder

Country Status (1)

Country Link
JP (1) JPS5698436A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457997A (en) * 1987-08-29 1989-03-06 Tokuriki Honten Kk Gold alloy filler metal
JPS6457996A (en) * 1987-08-29 1989-03-06 Tokuriki Honten Kk Gold alloy filler metal
NL9401960A (en) * 1994-11-23 1996-07-01 Schoene Edelmetaal B V Cadmium-free solder alloys for soldering jewellery
RU2697142C1 (en) * 2018-12-05 2019-08-12 Федеральное государственное автономное образовательное учреждение высшего образования "Сибирский федеральный университет" Alloy of white color based on 585 gold
CN113088748A (en) * 2021-04-02 2021-07-09 深圳市荟艺珠宝实业有限公司 Preparation method of gold solder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1469856A (en) * 1974-05-28 1977-04-06 Johnson Matthey Co Ltd Solder alloy

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1469856A (en) * 1974-05-28 1977-04-06 Johnson Matthey Co Ltd Solder alloy

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457997A (en) * 1987-08-29 1989-03-06 Tokuriki Honten Kk Gold alloy filler metal
JPS6457996A (en) * 1987-08-29 1989-03-06 Tokuriki Honten Kk Gold alloy filler metal
NL9401960A (en) * 1994-11-23 1996-07-01 Schoene Edelmetaal B V Cadmium-free solder alloys for soldering jewellery
RU2697142C1 (en) * 2018-12-05 2019-08-12 Федеральное государственное автономное образовательное учреждение высшего образования "Сибирский федеральный университет" Alloy of white color based on 585 gold
CN113088748A (en) * 2021-04-02 2021-07-09 深圳市荟艺珠宝实业有限公司 Preparation method of gold solder

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