JPS5321033A - Self-fluxing hard solder material of low melting point - Google Patents

Self-fluxing hard solder material of low melting point

Info

Publication number
JPS5321033A
JPS5321033A JP9481876A JP9481876A JPS5321033A JP S5321033 A JPS5321033 A JP S5321033A JP 9481876 A JP9481876 A JP 9481876A JP 9481876 A JP9481876 A JP 9481876A JP S5321033 A JPS5321033 A JP S5321033A
Authority
JP
Japan
Prior art keywords
self
solder material
hard solder
melting point
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9481876A
Other languages
Japanese (ja)
Other versions
JPS5930518B2 (en
Inventor
Takashi Fukumaki
Tomiro Yasuda
Mamoru Sawahata
Katsuhiro Sonobe
Seiji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51094818A priority Critical patent/JPS5930518B2/en
Publication of JPS5321033A publication Critical patent/JPS5321033A/en
Publication of JPS5930518B2 publication Critical patent/JPS5930518B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:The self-fluxing hard solder material which has been made to hold the bonding strength and toughness of the coupling part of copper and copper alloy by lowering the liquid phase temperature below 650 deg.C while maintaining the self-fluxing property, by adding tin to the ternary alloy of copper-phosphorussilver.
JP51094818A 1976-08-11 1976-08-11 Low melting point self-fusing brazing filler metal Expired JPS5930518B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51094818A JPS5930518B2 (en) 1976-08-11 1976-08-11 Low melting point self-fusing brazing filler metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51094818A JPS5930518B2 (en) 1976-08-11 1976-08-11 Low melting point self-fusing brazing filler metal

Publications (2)

Publication Number Publication Date
JPS5321033A true JPS5321033A (en) 1978-02-27
JPS5930518B2 JPS5930518B2 (en) 1984-07-27

Family

ID=14120625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51094818A Expired JPS5930518B2 (en) 1976-08-11 1976-08-11 Low melting point self-fusing brazing filler metal

Country Status (1)

Country Link
JP (1) JPS5930518B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909489A (en) * 2012-10-30 2013-02-06 江苏科技大学 Quenching solder for connecting hard alloy and steel as well as preparation method and connecting method of same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102909489A (en) * 2012-10-30 2013-02-06 江苏科技大学 Quenching solder for connecting hard alloy and steel as well as preparation method and connecting method of same

Also Published As

Publication number Publication date
JPS5930518B2 (en) 1984-07-27

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