JPS5723417B2 - - Google Patents
Info
- Publication number
- JPS5723417B2 JPS5723417B2 JP9652676A JP9652676A JPS5723417B2 JP S5723417 B2 JPS5723417 B2 JP S5723417B2 JP 9652676 A JP9652676 A JP 9652676A JP 9652676 A JP9652676 A JP 9652676A JP S5723417 B2 JPS5723417 B2 JP S5723417B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding
- tilting
- header
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To perform high quality bonding by tilting and contacting the bonding surface of a substrate and the surface of a header and causing eutectic alloying to take place from one end of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9652676A JPS5321570A (en) | 1976-08-11 | 1976-08-11 | Bonding method of semiconductor substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9652676A JPS5321570A (en) | 1976-08-11 | 1976-08-11 | Bonding method of semiconductor substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5321570A JPS5321570A (en) | 1978-02-28 |
JPS5723417B2 true JPS5723417B2 (en) | 1982-05-18 |
Family
ID=14167572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9652676A Granted JPS5321570A (en) | 1976-08-11 | 1976-08-11 | Bonding method of semiconductor substrates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5321570A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237509A (en) * | 1985-08-12 | 1987-02-18 | Sanshin Ind Co Ltd | Crankshaft of multi-cylinder internal combustion engine |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6175532A (en) * | 1984-09-20 | 1986-04-17 | Mitsubishi Electric Corp | Soldering method for semiconductor element |
JPH02181447A (en) * | 1989-01-06 | 1990-07-16 | Matsushita Electric Ind Co Ltd | Die bonding device |
JP6413340B2 (en) * | 2014-05-20 | 2018-10-31 | 住友電気工業株式会社 | Optical module manufacturing method and optical module manufacturing apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49122668A (en) * | 1973-03-23 | 1974-11-22 |
-
1976
- 1976-08-11 JP JP9652676A patent/JPS5321570A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49122668A (en) * | 1973-03-23 | 1974-11-22 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237509A (en) * | 1985-08-12 | 1987-02-18 | Sanshin Ind Co Ltd | Crankshaft of multi-cylinder internal combustion engine |
Also Published As
Publication number | Publication date |
---|---|
JPS5321570A (en) | 1978-02-28 |
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