JPS6457997A - Gold alloy filler metal - Google Patents
Gold alloy filler metalInfo
- Publication number
- JPS6457997A JPS6457997A JP21416087A JP21416087A JPS6457997A JP S6457997 A JPS6457997 A JP S6457997A JP 21416087 A JP21416087 A JP 21416087A JP 21416087 A JP21416087 A JP 21416087A JP S6457997 A JPS6457997 A JP S6457997A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- gold alloy
- alloy filler
- flowability
- effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To lower a liquid phase temp. and to enable brazing at a low temp. by specifying the contents of Ag, Cu, Zn, Ga, and Sn in a gold alloy filler metal. CONSTITUTION:The component compsn. of the gold alloy filler metal is specified, by weight %, to 60-75% Au, 5-15% Ag, 5-15% Cu, 3-10% Zn, 0.5-10% Ga, and 0.5-10% Sn. The reason for limiting the component compsn. is to confine Au to a 60-75wt.% range in order to obtain K15-K18 gold alloy filler metal. Ag contributes to an improvement in flowability and brazing strength. There is no effect at <5wt.% and the increase of the m.p. is high when the content exceeds 15wt.%. Cu improves brazing strength. There is no effect at <5wt.% and the increase in the m.p. is high when the content exceeds 15wt.%. Zn lowers the m.p. and improves the flowability thereof. The effect of lowering the m.p. is low at <3wt.% and the brazing strength is degraded if the content exceeds 10wt.%. Ga; Sn lower the m.p. and improve the flowability thereof. 0.5-10% In is incorporated into this gold alloy filler metal at need.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21416087A JPS6457997A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21416087A JPS6457997A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457997A true JPS6457997A (en) | 1989-03-06 |
Family
ID=16651226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21416087A Pending JPS6457997A (en) | 1987-08-29 | 1987-08-29 | Gold alloy filler metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457997A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399794A (en) * | 1989-09-14 | 1991-04-24 | Mikimoto Soushingu:Kk | Gold brazing filler alloy |
JPH06107515A (en) * | 1992-09-29 | 1994-04-19 | Kyushu Univ | Dental gold alloy hardenable by aging at temperature in oral cavity |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139620A (en) * | 1976-05-18 | 1977-11-21 | Ishifuku Metal Ind | Gold blazing alloy |
JPS5691999A (en) * | 1979-12-25 | 1981-07-25 | Mitsubishi Metal Corp | Hard gold-alloy soldering material |
JPS5698436A (en) * | 1979-12-11 | 1981-08-07 | Seiko Epson Corp | Gold solder |
JPS5722896A (en) * | 1980-07-11 | 1982-02-05 | Mitsubishi Metal Corp | Hard au alloy brazing material containing less au and having low melting point |
JPS58202995A (en) * | 1982-05-21 | 1983-11-26 | Sankin Kogyo Kk | Brazing alloy of low karat gold having golden color |
-
1987
- 1987-08-29 JP JP21416087A patent/JPS6457997A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139620A (en) * | 1976-05-18 | 1977-11-21 | Ishifuku Metal Ind | Gold blazing alloy |
JPS5698436A (en) * | 1979-12-11 | 1981-08-07 | Seiko Epson Corp | Gold solder |
JPS5691999A (en) * | 1979-12-25 | 1981-07-25 | Mitsubishi Metal Corp | Hard gold-alloy soldering material |
JPS5722896A (en) * | 1980-07-11 | 1982-02-05 | Mitsubishi Metal Corp | Hard au alloy brazing material containing less au and having low melting point |
JPS58202995A (en) * | 1982-05-21 | 1983-11-26 | Sankin Kogyo Kk | Brazing alloy of low karat gold having golden color |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399794A (en) * | 1989-09-14 | 1991-04-24 | Mikimoto Soushingu:Kk | Gold brazing filler alloy |
JPH06107515A (en) * | 1992-09-29 | 1994-04-19 | Kyushu Univ | Dental gold alloy hardenable by aging at temperature in oral cavity |
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