JPS5565341A - High temperature solder - Google Patents

High temperature solder

Info

Publication number
JPS5565341A
JPS5565341A JP13576278A JP13576278A JPS5565341A JP S5565341 A JPS5565341 A JP S5565341A JP 13576278 A JP13576278 A JP 13576278A JP 13576278 A JP13576278 A JP 13576278A JP S5565341 A JPS5565341 A JP S5565341A
Authority
JP
Japan
Prior art keywords
alloy
solder
high temperature
temperature solder
solderability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13576278A
Other languages
Japanese (ja)
Inventor
Narutoshi Taguchi
Rikiya Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Nippon Cable System Inc
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Nippon Cable System Inc
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Nippon Cable System Inc, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP13576278A priority Critical patent/JPS5565341A/en
Publication of JPS5565341A publication Critical patent/JPS5565341A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/282—Zn as the principal constituent

Abstract

PURPOSE:To enhance the bonding strength and solderability of a Sn-Zn alloy as high temp. solder by raising the Zn content of the alloy and adding a little Ag. CONSTITUTION:An alloy consisting of Zn 30-70wt%, Ag 0.5-3wt% and the balance Sn. High temp. solder of this alloy compsn. is used, e.g. in joining the inner wire of a control cable with a rope end fitting. By this alloy compsn. the solderability and bonding strength of the solder are enhanced. This solder contains no harmful metal and is excellent in work efficiency.
JP13576278A 1978-11-06 1978-11-06 High temperature solder Pending JPS5565341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13576278A JPS5565341A (en) 1978-11-06 1978-11-06 High temperature solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13576278A JPS5565341A (en) 1978-11-06 1978-11-06 High temperature solder

Publications (1)

Publication Number Publication Date
JPS5565341A true JPS5565341A (en) 1980-05-16

Family

ID=15159263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13576278A Pending JPS5565341A (en) 1978-11-06 1978-11-06 High temperature solder

Country Status (1)

Country Link
JP (1) JPS5565341A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1112803A1 (en) * 1999-12-28 2001-07-04 Kabushiki Kaisha Toshiba Solder material, device using the same and manufacturing process thereof
JP2001246493A (en) * 1999-12-28 2001-09-11 Toshiba Corp Soldering material, device or apparatus using same and its producing method
US7220493B2 (en) 2002-10-24 2007-05-22 Koa Kabushiki Kaisha Lead-free solder, and a lead-free joint
US7248141B2 (en) 2003-07-03 2007-07-24 Koa Kabushiki Kaisha Current fuse and method of making the current fuse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1112803A1 (en) * 1999-12-28 2001-07-04 Kabushiki Kaisha Toshiba Solder material, device using the same and manufacturing process thereof
JP2001246493A (en) * 1999-12-28 2001-09-11 Toshiba Corp Soldering material, device or apparatus using same and its producing method
US7220493B2 (en) 2002-10-24 2007-05-22 Koa Kabushiki Kaisha Lead-free solder, and a lead-free joint
US7248141B2 (en) 2003-07-03 2007-07-24 Koa Kabushiki Kaisha Current fuse and method of making the current fuse

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