JPS57195597A - Silver solder alloy - Google Patents
Silver solder alloyInfo
- Publication number
- JPS57195597A JPS57195597A JP8219881A JP8219881A JPS57195597A JP S57195597 A JPS57195597 A JP S57195597A JP 8219881 A JP8219881 A JP 8219881A JP 8219881 A JP8219881 A JP 8219881A JP S57195597 A JPS57195597 A JP S57195597A
- Authority
- JP
- Japan
- Prior art keywords
- silver solder
- solder alloy
- joining strength
- alloy
- spreadability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To lower a m.p. and to improve spreadability and joining strength by contg. Ag, Cu, In and P in a specific ratio. CONSTITUTION:A silver solder alloy consisting of 75-90wt% Ag, 9-24wt% Cu, 0.5-10wt% In, 0.5-7wt% P, and the balance unavoidable impurities. Such alloy has a lower m.p. than silver solder alloys used heretofore, and has excellent spreadability and joining strength.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8219881A JPS57195597A (en) | 1981-05-29 | 1981-05-29 | Silver solder alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8219881A JPS57195597A (en) | 1981-05-29 | 1981-05-29 | Silver solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57195597A true JPS57195597A (en) | 1982-12-01 |
Family
ID=13767723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8219881A Pending JPS57195597A (en) | 1981-05-29 | 1981-05-29 | Silver solder alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57195597A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105177342A (en) * | 2015-09-24 | 2015-12-23 | 无锡日月合金材料有限公司 | Preparation method of ternary alloy sealing material |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50104749A (en) * | 1974-01-28 | 1975-08-19 | ||
JPS5133744A (en) * | 1974-09-04 | 1976-03-23 | Sumitomo Electric Industries | GINKISANKABUTSUBUNSANGATAGOKINSETSUTENNO ROZUKEHOHO |
-
1981
- 1981-05-29 JP JP8219881A patent/JPS57195597A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50104749A (en) * | 1974-01-28 | 1975-08-19 | ||
JPS5133744A (en) * | 1974-09-04 | 1976-03-23 | Sumitomo Electric Industries | GINKISANKABUTSUBUNSANGATAGOKINSETSUTENNO ROZUKEHOHO |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105177342A (en) * | 2015-09-24 | 2015-12-23 | 无锡日月合金材料有限公司 | Preparation method of ternary alloy sealing material |
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