JPS57195598A - Ag solder - Google Patents

Ag solder

Info

Publication number
JPS57195598A
JPS57195598A JP8220181A JP8220181A JPS57195598A JP S57195598 A JPS57195598 A JP S57195598A JP 8220181 A JP8220181 A JP 8220181A JP 8220181 A JP8220181 A JP 8220181A JP S57195598 A JPS57195598 A JP S57195598A
Authority
JP
Japan
Prior art keywords
solder
flow
joining
joining strength
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8220181A
Other languages
Japanese (ja)
Inventor
Fujimatsu Takiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP8220181A priority Critical patent/JPS57195598A/en
Publication of JPS57195598A publication Critical patent/JPS57195598A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Contacts (AREA)

Abstract

PURPOSE:To improve and stabilize the flow and joining strength of solder by contg. Ag, Cu, P and In in a specific ratio. CONSTITUTION:This invention relates to Ag solder consisting of 45-75wt% Ag, 12.5-52.5wt% Cu, 0.1-2.5wt% P or further 1-10wt%. In in addition to these. The above-mentioned Ag solder is used for joining electric contact point materials of Ag-oxide type, Ag-Cu type, etc. to a Cu alloy base material. The flow of the solder is good, and the joining strength is high and stable.
JP8220181A 1981-05-29 1981-05-29 Ag solder Pending JPS57195598A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8220181A JPS57195598A (en) 1981-05-29 1981-05-29 Ag solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8220181A JPS57195598A (en) 1981-05-29 1981-05-29 Ag solder

Publications (1)

Publication Number Publication Date
JPS57195598A true JPS57195598A (en) 1982-12-01

Family

ID=13767807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8220181A Pending JPS57195598A (en) 1981-05-29 1981-05-29 Ag solder

Country Status (1)

Country Link
JP (1) JPS57195598A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242787A (en) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd Silver brazing filler metal
JPS6281290A (en) * 1985-10-02 1987-04-14 Tanaka Kikinzoku Kogyo Kk Brazing filler metal for ceramics
JPH02165895A (en) * 1988-12-16 1990-06-26 Kyocera Corp Material for brazing
WO2013016179A1 (en) * 2011-07-21 2013-01-31 Harris Joseph W Method for brazing metal parts comprising copper, silver and/or gold and one part having a layer of such base material and phosphorus
CN103567658A (en) * 2012-08-09 2014-02-12 广东威特真空电子制造有限公司 Silver brazing solder and preparation method of silver brazing solder

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104749A (en) * 1974-01-28 1975-08-19
JPS5133744A (en) * 1974-09-04 1976-03-23 Sumitomo Electric Industries GINKISANKABUTSUBUNSANGATAGOKINSETSUTENNO ROZUKEHOHO

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50104749A (en) * 1974-01-28 1975-08-19
JPS5133744A (en) * 1974-09-04 1976-03-23 Sumitomo Electric Industries GINKISANKABUTSUBUNSANGATAGOKINSETSUTENNO ROZUKEHOHO

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61242787A (en) * 1985-04-22 1986-10-29 Tokuriki Honten Co Ltd Silver brazing filler metal
JPS6281290A (en) * 1985-10-02 1987-04-14 Tanaka Kikinzoku Kogyo Kk Brazing filler metal for ceramics
JPH02165895A (en) * 1988-12-16 1990-06-26 Kyocera Corp Material for brazing
WO2013016179A1 (en) * 2011-07-21 2013-01-31 Harris Joseph W Method for brazing metal parts comprising copper, silver and/or gold and one part having a layer of such base material and phosphorus
US8870053B2 (en) 2011-07-21 2014-10-28 Joseph W. Harris Method for brazing metal parts
CN103567658A (en) * 2012-08-09 2014-02-12 广东威特真空电子制造有限公司 Silver brazing solder and preparation method of silver brazing solder
CN103567658B (en) * 2012-08-09 2016-06-08 广东威特真空电子制造有限公司 A kind of silver solder and its preparation method

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