JPS57149093A - Silver solder material - Google Patents
Silver solder materialInfo
- Publication number
- JPS57149093A JPS57149093A JP3377981A JP3377981A JPS57149093A JP S57149093 A JPS57149093 A JP S57149093A JP 3377981 A JP3377981 A JP 3377981A JP 3377981 A JP3377981 A JP 3377981A JP S57149093 A JPS57149093 A JP S57149093A
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- silver solder
- silver
- constitution
- atmosphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Abstract
PURPOSE:To obtain a silver solder material with the surface smoothed, by causing the silver solder material to contain prescribed quantities of Ag, Cu, Mn or Ni, P, and one or more out of Pd, In, Sn, etc. CONSTITUTION:A silver solder material consists of 50-95% Ag, 5-50% Cu, 0.005-1% Mn or Ni, 0.001-0.5% P, and 0.005-5% one or more out of Pd, In, Sn, Li, Sb, and Ge. This solder material is finished to a smooth surface, and is used in vacuum or an atmosphere.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3377981A JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3377981A JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6438186A Division JPS61216888A (en) | 1986-03-22 | 1986-03-22 | Silver brazing filler metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57149093A true JPS57149093A (en) | 1982-09-14 |
JPS6218276B2 JPS6218276B2 (en) | 1987-04-22 |
Family
ID=12395937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3377981A Granted JPS57149093A (en) | 1981-03-11 | 1981-03-11 | Silver solder material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57149093A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092095A (en) * | 1983-10-26 | 1985-05-23 | Tanaka Kikinzoku Kogyo Kk | Pd solder |
JPS6220792U (en) * | 1985-07-24 | 1987-02-07 | ||
EP1219718A1 (en) * | 2000-12-29 | 2002-07-03 | United Technologies Corporation | Silver braze alloy |
CN103567658A (en) * | 2012-08-09 | 2014-02-12 | 广东威特真空电子制造有限公司 | Silver brazing solder and preparation method of silver brazing solder |
WO2014111538A2 (en) | 2013-01-18 | 2014-07-24 | Umicore Ag & Co. Kg | Alloys |
US10807201B2 (en) * | 2014-11-18 | 2020-10-20 | Baker Hughes Holdings Llc | Braze materials and earth-boring tools comprising braze materials |
-
1981
- 1981-03-11 JP JP3377981A patent/JPS57149093A/en active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6092095A (en) * | 1983-10-26 | 1985-05-23 | Tanaka Kikinzoku Kogyo Kk | Pd solder |
JPH0325276B2 (en) * | 1983-10-26 | 1991-04-05 | Tanaka Precious Metal Ind | |
JPS6220792U (en) * | 1985-07-24 | 1987-02-07 | ||
EP1219718A1 (en) * | 2000-12-29 | 2002-07-03 | United Technologies Corporation | Silver braze alloy |
US6596229B2 (en) | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
US6936218B2 (en) * | 2000-12-29 | 2005-08-30 | United Technologies Corporation | Silver braze alloy |
CN103567658A (en) * | 2012-08-09 | 2014-02-12 | 广东威特真空电子制造有限公司 | Silver brazing solder and preparation method of silver brazing solder |
CN103567658B (en) * | 2012-08-09 | 2016-06-08 | 广东威特真空电子制造有限公司 | A kind of silver solder and its preparation method |
WO2014111538A2 (en) | 2013-01-18 | 2014-07-24 | Umicore Ag & Co. Kg | Alloys |
DE112014000475B4 (en) | 2013-01-18 | 2022-05-25 | Saxonia Technical Materials Gmbh | solder alloys |
US10807201B2 (en) * | 2014-11-18 | 2020-10-20 | Baker Hughes Holdings Llc | Braze materials and earth-boring tools comprising braze materials |
Also Published As
Publication number | Publication date |
---|---|
JPS6218276B2 (en) | 1987-04-22 |
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