JPS6220792U - - Google Patents
Info
- Publication number
- JPS6220792U JPS6220792U JP11238085U JP11238085U JPS6220792U JP S6220792 U JPS6220792 U JP S6220792U JP 11238085 U JP11238085 U JP 11238085U JP 11238085 U JP11238085 U JP 11238085U JP S6220792 U JPS6220792 U JP S6220792U
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- electron tubes
- copper
- vacuum
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図は本考案の使用例を示す半断面図、第２
図はそれに使用するろう材の形状例を示す斜視図
である。
２９……ろう材、Ａ……ろう接部。
Fig. 1 is a half-sectional view showing an example of the use of the present invention;
The figure is a perspective view showing an example of the shape of the brazing material used therein. 29...brazing metal, A...brazing part.
Claims (1)
０．０２乃至０．０５重量％の範囲の燐を含有し
てなる電子管用ろう材。[Claims for Utility Model Registration] A brazing material for vacuum-tight bonding of electron tubes, the brazing material mainly containing silver and copper, and containing phosphorus in the range of 0.02 to 0.05% by weight. Brazing material for electron tubes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11238085U JPS6220792U (en) | 1985-07-24 | 1985-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11238085U JPS6220792U (en) | 1985-07-24 | 1985-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6220792U true JPS6220792U (en) | 1987-02-07 |
Family
ID=30993205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11238085U Pending JPS6220792U (en) | 1985-07-24 | 1985-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6220792U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01150463A (en) * | 1987-12-09 | 1989-06-13 | Toshiba Corp | Soldering method and silver solder material using therefor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149093A (en) * | 1981-03-11 | 1982-09-14 | Tokuriki Honten Co Ltd | Silver solder material |
-
1985
- 1985-07-24 JP JP11238085U patent/JPS6220792U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57149093A (en) * | 1981-03-11 | 1982-09-14 | Tokuriki Honten Co Ltd | Silver solder material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01150463A (en) * | 1987-12-09 | 1989-06-13 | Toshiba Corp | Soldering method and silver solder material using therefor |