JPS56165587A - Composite silver solder - Google Patents
Composite silver solderInfo
- Publication number
- JPS56165587A JPS56165587A JP6982380A JP6982380A JPS56165587A JP S56165587 A JPS56165587 A JP S56165587A JP 6982380 A JP6982380 A JP 6982380A JP 6982380 A JP6982380 A JP 6982380A JP S56165587 A JPS56165587 A JP S56165587A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- brazing
- silver solder
- product
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Abstract
PURPOSE:To improve workability without spoiling brazing capacity by forming silver solder for brazing with a composite alloy of an Ag base alloy and a Cu base alloy. CONSTITUTION:A brazing alloy is formed by combining an Ag alloy A composed mainly of Ag and containing Zn, Cd, Cu etc. and a Cu alloy B composed mainly of Cu and containing Zn, Mn, Cd etc. The Ag alloy A and Cu alloy B are structured to a composite wire or a clad plate, or wires of the two alloys are twisted. The product is superior in workability and easier to manufacture compared with a product in which metallic components of A and B are formed into an alloy. Further, it is excellent in spreading over the brazed material and mutual diffusibility and increases brazing strength.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982380A JPS56165587A (en) | 1980-05-26 | 1980-05-26 | Composite silver solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6982380A JPS56165587A (en) | 1980-05-26 | 1980-05-26 | Composite silver solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56165587A true JPS56165587A (en) | 1981-12-19 |
Family
ID=13413857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6982380A Pending JPS56165587A (en) | 1980-05-26 | 1980-05-26 | Composite silver solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56165587A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60166194A (en) * | 1984-02-07 | 1985-08-29 | Tanaka Kikinzoku Kogyo Kk | Clad brazing filler metal |
JPS6427769A (en) * | 1987-07-21 | 1989-01-30 | Sumitomo Spec Metals | Method for joining metal or alloy strip |
WO2005118211A1 (en) * | 2004-06-04 | 2005-12-15 | Soutec Soudronic Ag | Method for connecting joining parts by hard-soldering or welding, and system for carrying out said method |
US11618111B2 (en) * | 2016-08-17 | 2023-04-04 | Mitsubishi Electric Corporation | Method of manufacturing plate-shaped solder and manufacturing device |
-
1980
- 1980-05-26 JP JP6982380A patent/JPS56165587A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60166194A (en) * | 1984-02-07 | 1985-08-29 | Tanaka Kikinzoku Kogyo Kk | Clad brazing filler metal |
JPS6427769A (en) * | 1987-07-21 | 1989-01-30 | Sumitomo Spec Metals | Method for joining metal or alloy strip |
WO2005118211A1 (en) * | 2004-06-04 | 2005-12-15 | Soutec Soudronic Ag | Method for connecting joining parts by hard-soldering or welding, and system for carrying out said method |
US11618111B2 (en) * | 2016-08-17 | 2023-04-04 | Mitsubishi Electric Corporation | Method of manufacturing plate-shaped solder and manufacturing device |
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