WO2016159316A1 - Alloy material, contact probe, and connection terminal - Google Patents

Abstract

This alloy material has copper (Cu) as the main component thereof and has added thereto 10-30 wt% silver (Ag) and 0.5-10 wt% nickel (Ni). As a result, an alloy material having no coating and having excellent Sn-corrosion resistance, a contact probe comprising this alloy material, and a connection terminal can be provided.

Description

Alloy materials, contact probes and connection terminals

The present invention relates to, for example, an alloy material, which is made of the alloy material, and includes a contact probe or an electrical contact used for a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit or a liquid crystal display. The present invention relates to a connection terminal to be connected.

Conventionally, when conducting a conduction state inspection or an operation characteristic inspection of an inspection target such as a semiconductor integrated circuit or a liquid crystal panel, electrical connection between the inspection target and a signal processing apparatus having a circuit board for outputting an inspection signal A conductive contact probe is used. In order to perform an accurate conduction state inspection and operation characteristic inspection, it is required to reliably input / output an inspection signal via a contact probe.

The contact probe is used by repeatedly contacting an inspection object such as a semiconductor integrated circuit or a liquid crystal display device. At this time, if the contact probe deteriorates due to repeated use, for example, the inspection result is affected. In particular, when the inspection object is soft, such as a tin (Sn) plating electrode, the Sn plating of the electrode tends to adhere to the contact probe surface, and the resistance value fluctuates due to the Sn plating adhesion, making stable inspection difficult. For this reason, the material used for the contact probe is required to have high hardness, high conductivity, corrosion resistance, and good oxidation resistance as compared with an inspection object that is not easily worn even when repeatedly contacted. In response to this requirement, in order to improve Sn corrosion resistance, for example, a technique of coating the tip of the contact probe pin with a carbon film or a technique of applying rhodium (Rh) plating has been proposed (for example, Patent Document 1, Patent Document 1). 2).

JP-A-10-226874 JP 2002-131334 A

However, with the coating technique and plating technique as described above, the coating film may be peeled off due to repeated contact with the inspection object, and may adhere to the inspection object as a foreign substance, resulting in poor conduction. Therefore, it is desired to produce a contact probe pin with a bulk material that does not cause the coating to peel off.

The present invention has been made in view of the above, and an object of the present invention is to provide an alloy material having no Sn coating and excellent in corrosion resistance to Sn, a contact probe made of this alloy material, and a connection terminal.

In order to solve the above-described problems and achieve the object, the alloy material according to the present invention is mainly composed of copper (Cu), silver (Ag) is 10 to 30 wt%, nickel (Ni) is 0.5 to 0.5%. It is characterized by adding 10 wt%.

Further, the alloy material according to the present invention is characterized in that, in the above-described invention, 5 to 20 wt% of palladium (Pd) is further added.

The alloy material according to the present invention is characterized in that in the above-mentioned invention, 0.5 to 5 wt% of tin (Sn) is further added.

The alloy material according to the present invention is characterized in that, in the above-mentioned invention, 0.01 to 0.1 wt% of any one of iridium (Ir) and ruthenium (Ru) or a combination thereof is further added. And

In addition, the contact probe according to the present invention is a conductive contact probe that comes into contact with the contact object at both ends in the longitudinal direction, and at least a part of the contact probe is formed using the alloy material according to the above invention. Features.

Moreover, the contact probe according to the present invention is the above-described invention, wherein the first conductive plunger that contacts one contact object at one end, the second conductive plunger that contacts the other contact object at one end, A coil spring provided between the first and second plungers to connect the first and second plungers in a telescopic manner, and includes at least one of the first plunger, the second plunger, and the coil spring. One is made of the alloy material.

Further, the connection terminal according to the present invention is a conductive connection terminal that comes into contact with the contact object at both ends in the longitudinal direction, and at least a part of the connection terminal is formed using the alloy material according to the present invention. Features.

According to the present invention, since Cu is the main component, Ag is added in an amount of 10 to 30 wt%, and Ni is added in an amount of 0.5 to 10 wt%, it has no coating, has excellent Sn corrosion resistance, There is an effect that an alloy material excellent in conductivity, workability, and hardness can be obtained for the connection terminal.

FIG. 1 is a perspective view showing a schematic configuration of a socket according to one usage mode of an alloy material according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing a configuration of a main part of the socket according to one usage mode of the alloy material according to the embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing a configuration of a main part of the socket at the time of inspection of the semiconductor integrated circuit of the socket according to one usage mode of the alloy material according to the embodiment of the present invention.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. The drawings referred to in the following description only schematically show the shape, size, and positional relationship so that the contents of the present invention can be understood. That is, the present invention is not limited only to the shape, size, and positional relationship illustrated in each drawing.

The alloy material according to the embodiment of the present invention will be described. The present invention is an alloy material mainly composed of copper (Cu). Cu exhibits high conductivity, but its oxidation resistance is slightly inferior and its hardness is low. Thus, by adding silver (Ag) or nickel (Ni) as an additive element to Cu, the conductivity, hardness, oxidation resistance, and tin (Sn) corrosion resistance were improved.

Ag is excellent in conductivity and oxidation resistance, and by performing an aging treatment, Ag dissolved in Cu is precipitated, and an increase in hardness can be expected. Aging precipitation hardening is difficult to occur when the amount of Ag added is small, so it is desirable to add 10 wt% or more of Ag. However, adding over 30 wt% is not preferable because Sn corrosion resistance deteriorates.

Furthermore, 0.5 to 10 wt% of Ni is added to the alloy material according to the present embodiment. Ni is effective in improving Sn corrosion resistance and increasing hardness. If it is less than 0.5 wt%, Sn corrosion resistance cannot be obtained, and if it exceeds 10 wt%, the workability deteriorates, which is not preferable.

Further, 5 to 20 wt% of palladium (Pd) can be added to the alloy material having the above composition. Pd is excellent in oxidation resistance, and an increase in hardness can be expected by addition. If the amount of Pd added is small, there is no effect in improving the oxidation resistance and increasing the hardness, so it is desirable to add 5 wt% or more of Pd. However, adding over 20 wt% is not preferable because the conductivity and Sn corrosion resistance will decrease.

Further, 0.5 to 5 wt% of Sn can be further added to the alloy material having the above composition. Addition of Sn suppresses external Sn adhesion and can also be expected to increase hardness. If the added amount of Sn is small, there is no effect in improving the Sn corrosion resistance and increasing the hardness. Therefore, it is desirable to add 0.5 wt% or more of Sn. However, adding over 5 wt% is not preferable because the workability will decrease.

Further, 0.01 to 0.1 wt% of any one of iridium (Ir) and ruthenium (Ru) or a combination thereof can be further added to the alloy material having the above-described composition. These additive metals are useful for workability, and fine cracks on the alloy surface are reduced during rolling as compared with those not added, and workability is improved. Since the effect does not change even if the amount of any one of Ir and Ru or a combination thereof exceeds 0.1 wt%, an appropriate amount is 0.01 to 0.1 wt%. Ir and Ru have the effect of refining crystal grains, and if the crystal grains are small, it is difficult to cause grain boundary cracking during rolling.

According to the embodiment described above, Cu is the main component, Ag is added in an amount of 10 to 30 wt%, and Ni is added in an amount of 0.5 to 10 wt%. Therefore, the contact probe has conductivity, hardness, oxidation resistance, An alloy material excellent in Sn corrosion resistance can be obtained.

Next, the case where the alloy material according to the present embodiment is used as a contact probe will be described. FIG. 1 is a perspective view showing a schematic configuration of a socket (contact probe) according to one usage mode of an alloy material according to an embodiment of the present invention. A socket 1 shown in FIG. 1 is a device that is used when an electrical characteristic test is performed on a semiconductor integrated circuit 100 that is an object to be tested, and a circuit board that outputs a test signal to the semiconductor integrated circuit 100 and the semiconductor integrated circuit 100. 200 is an apparatus for electrically connecting to 200.

The socket 1 is in contact with one electrode (contact object) of the semiconductor integrated circuit 100 which is a contacted body on one end side in the longitudinal direction, and the electrode (contact object) on the circuit board 200 on the other end side. A plurality of contact probes 2 (hereinafter simply referred to as “probes 2”) that contact each other, a probe holder 3 that accommodates and holds the plurality of probes 2 according to a predetermined pattern, and a probe holder 3 that is provided around the probe holder 3 for inspection. And a holder member 4 that suppresses the displacement of the semiconductor integrated circuit 100 that contacts the plurality of probes 2 at the time.

FIG. 2 is a partial cross-sectional view showing the configuration of the main part of the socket (contact probe) according to one usage mode of the alloy material of the present embodiment, and shows the detailed configuration of the probe 2 accommodated in the probe holder 3. FIG. When the semiconductor integrated circuit 100 is inspected, the probe 2 shown in FIG. 2 contacts the first plunger 21 that contacts the connection electrode of the semiconductor integrated circuit 100 and the electrode 201 of the circuit board 200 that includes the inspection circuit. And a coil spring 23 provided between the first plunger 21 and the second plunger 22 to connect the first plunger 21 and the second plunger 22 so as to be extendable and contractible. The first plunger 21 and the second plunger 22 and the coil spring 23 constituting the probe 2 have the same axis. When the probe 2 contacts the semiconductor integrated circuit 100, the coil spring 23 expands and contracts in the axial direction, so that the impact on the connection electrode of the semiconductor integrated circuit 100 is reduced, and the semiconductor integrated circuit 100 and the circuit board 200 are reduced. Apply load.

It is preferable that at least one of the first plunger 21, the second plunger 22, and the coil spring 23 is formed using the above-described alloy material, and all members are formed using this alloy material. Further, the coil spring 23 has a contraction amount of the rough winding portion 23b when a predetermined load is applied, for example, in a state where the probe 2 is accommodated in the probe holder 3 when the initial load is applied (see FIG. 1). The diameter of the wire or the diameter of the wire is designed so that the spring characteristic becomes larger than the shortest distance between the proximal end portion of the second plunger 22 and the tightly wound portion 23a. By using the coil spring 23 having this spring characteristic, when a predetermined load is applied to the probe 2, the base end portion is brought into sliding contact with the tightly wound portion 23 a, and the electric power between the proximal end portion and the tightly wound portion 23 a is obtained. Continuity is possible.

The probe holder 3 is formed using an insulating material such as resin, machinable ceramics, or silicon, and a first member 31 located on the upper surface side and a second member 32 located on the lower surface side in FIG. 2 are laminated. Become. The first member 31 and the second member 32 are formed with the same number of holder holes 33 and 34 for receiving the plurality of probes 2, and the holder holes 33 and 34 for receiving the probes 2 have the same axis. It is formed as follows. The formation positions of the holder holes 33 and 34 are determined according to the wiring pattern of the semiconductor integrated circuit 100.

FIG. 3 is a partial cross-sectional view showing the configuration of the main part of the socket at the time of inspection of the semiconductor integrated circuit of the socket (contact probe) according to one use mode of the alloy material of the present embodiment. It is a figure which shows the state at the time of the test | inspection of the used semiconductor integrated circuit. When the coil spring 23 is compressed during the inspection of the semiconductor integrated circuit 100, the proximal end portion of the second plunger 22 is in sliding contact with the inner peripheral side of the tightly wound portion 23a, as shown in FIG. At this time, the inspection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 reaches the connection electrode 101 of the semiconductor integrated circuit 100 via the second plunger 22, the tightly wound portion 23 a, and the first plunger 21. . Thus, in the probe 2, since the first plunger 21 and the second plunger 22 are conducted through the tightly wound portion 23a, the conduction path of the electric signal can be minimized. Therefore, it is possible to prevent a signal from flowing through the rough winding portion 23b during inspection, and to reduce and stabilize the inductance. In the present embodiment, the coil spring has been described as having a coarsely wound portion and a tightly wound portion. However, a coil spring consisting of only a coarsely wound portion may be used.

Further, since the tip of the first plunger 21 is tapered, even if an oxide film is formed on the surface of the connection electrode 101, the oxide film is broken through and the tip of the first plunger 21 is connected. Direct contact with the electrode 101 is possible.

In addition, the structure of the probe 2 demonstrated here is only an example to the last, and it is possible to apply the alloy material mentioned above to various kinds of probes known conventionally. For example, the probe is not limited to a plunger and a coil spring as described above, a probe having a pipe member, a pogo pin, a wire probe that obtains a load by bending a wire into a bow shape, and electrical contacts are connected to each other. A connection terminal (connector) may be used.

Here, the connection terminal connects the electrical contacts to each other. For example, like the probe 2 described above, the conductive two terminals that are in contact with the electrical contacts and the terminals can be slid. A holding elastic member (or holding member). In such a connection terminal, at least the terminal is made of the alloy material described above.

Hereinafter, examples and comparative examples of the alloy material of the present invention will be described in detail. First, the measurement contents of the alloy material according to this example will be described.

The hardness test piece was measured for Vickers hardness (aging material hardness) after solution treatment and aging treatment.

The test piece for electrical conductivity was prepared by solution treatment and aging treatment. Thereafter, the resistance value of the test piece for electrical conductivity was measured using an electrical resistance measuring device to determine the electrical conductivity.

The test piece for Sn corrosion resistance evaluation was produced as follows. The test piece for electrical conductivity prepared earlier was cut so that the tip diameter was 0.1 mm. The test piece was brought into contact with the Sn plating plate with a predetermined spring force, and the tip of the test piece was observed with an SEM. In the evaluation of Sn corrosion resistance, the case where there was no adhesion of Sn in the SEM observation was evaluated as ◯, and the case where the adhesion was observed was evaluated as x.

The workability was evaluated based on whether or not the rolling process at the time of preparing the test piece for electrical conductivity and the processing at the time of the cutting process at the time of preparing the test piece for evaluating Sn corrosion resistance were possible. The evaluation criteria were ○ when it did not break during rolling and was cut into a pin shape and was within the processing dimension tolerance, and × when outside the tolerance.

Next, the weight ratio ratio of each metal of the alloy material according to this example will be described. Table 1 shows the weight ratio (composition) and measurement results of the alloy materials according to Examples 1 to 13 and Comparative Examples 1 to 7. Examples 1 to 13 have compositions within the scope of the present embodiment. Comparative Examples 1 to 7 have compositions outside the range of the present embodiment.

Hereinafter, the measurement results of Examples 1 to 13 and Comparative Examples 1 to 7 will be described. Examples 1 to 13 have compositions in the range of the present embodiment. In Examples 1 to 13, it was confirmed that Sn adhesion was not observed and high Sn corrosion resistance was exhibited. Also, good results were shown in terms of hardness, conductivity, and workability.

Comparative Example 1 has a composition outside the range of the present embodiment with a small amount of Ni added. Comparative Example 1 has more Sn adhesion and lower Sn corrosion resistance than Examples 1-13. From Comparative Example 1, it can be said that if the amount of Ni added is small, Sn corrosion resistance deteriorates, which is not preferable.

Comparative Example 2 has a composition outside the range of the present embodiment with a large amount of Ni added. Comparative Example 2 could not be processed with high accuracy. From Comparative Example 2, it can be said that if the amount of Ni added is large, workability deteriorates and is not preferable.

Comparative Example 3 is a composition outside the range of the present embodiment with a small amount of Ag added. Comparative Example 3 has a lower hardness than Examples 1 to 13 and is not preferable for use as a contact probe.

Comparative Example 4 has a composition outside the range of the present embodiment with a large amount of Ag added. Comparative Example 4 has more Sn adhesion and lower Sn corrosion resistance than Examples 1-13. From Comparative Example 4, it can be said that if the amount of Ag added is large, Sn corrosion resistance deteriorates, which is not preferable.

Comparative Example 5 has a composition outside the range of the present embodiment with a large amount of Pd added. Comparative Example 5 has more Sn adhesion and lower Sn corrosion resistance than Examples 1-13. From Comparative Example 5, it can be said that if the amount of Pd added is large, Sn corrosion resistance deteriorates, which is not preferable.

Comparative Example 6 has a composition outside the range of the present embodiment with a large amount of Sn added. In Comparative Example 6, cracks occurred during the rolling process, and the test piece for electrical conductivity could not be processed. According to Comparative Example 6, it can be said that if the amount of Sn added is large, the workability deteriorates, which is not preferable.

Comparative Example 7 is a composition outside the scope of the present embodiment, which is made of Cu, Ag, Pd, manganese (Mn), and Ir. Comparative Example 7 is larger in hardness than Examples 1 to 13, but inferior in cutting workability and inferior in Sn corrosion resistance. From Comparative Example 7, it can be said that it is not preferable as a contact probe application for a low hardness material such as Sn solder.

As described above, the alloy material according to the present invention, the contact probe and the connection terminal made of the alloy material are useful for contact probes in terms of conductivity, hardness, oxidation resistance, and Sn corrosion resistance.

1 socket 2 contact probe (probe)
DESCRIPTION OF SYMBOLS 3 Probe holder 4 Holder member 21 1st plunger 22 2nd plunger 23 Coil spring 23a Contact | adhering winding part 23b Coarse winding part 31 1st member 32 2nd member 33,34 Holder hole 100 Semiconductor integrated circuit 101 Connection electrode 200 Circuit board 201 electrode

Claims (7)

1. An alloy material comprising copper (Cu) as a main component, silver (Ag) added at 10 to 30 wt%, and nickel (Ni) at 0.5 to 10 wt%.
2. The alloy material according to claim 1, wherein 5 to 20 wt% of palladium (Pd) is further added.
3. The alloy material according to claim 1 or 2, further comprising 0.5 to 5 wt% of tin (Sn).
4. 4. One of iridium (Ir) and ruthenium (Ru) or a combination thereof is further added in an amount of 0.01 to 0.1 wt%, according to any one of claims 1 to 3, Alloy material.
5. Conductive contact probes that come into contact with the contact object at both ends in the longitudinal direction,
   At least a part of the contact probe is formed using the alloy material according to any one of claims 1 to 4.
6. A conductive first plunger in contact with one contact object at one end;
   A conductive second plunger in contact with the other contact object at one end;
   A coil spring provided between the first and second plungers to connect the first and second plungers in a telescopic manner;
   Have
   The contact probe according to claim 5, wherein at least one of the first plunger, the second plunger, and the coil spring is made of the alloy material.
7. Conductive connection terminals that come into contact with the contact object at both ends in the longitudinal direction,
   At least a part of the connection terminal is formed using the alloy material according to any one of claims 1 to 4.

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