JP2001337110A - Probe pin and probe card - Google Patents
Probe pin and probe cardInfo
- Publication number
- JP2001337110A JP2001337110A JP2000197280A JP2000197280A JP2001337110A JP 2001337110 A JP2001337110 A JP 2001337110A JP 2000197280 A JP2000197280 A JP 2000197280A JP 2000197280 A JP2000197280 A JP 2000197280A JP 2001337110 A JP2001337110 A JP 2001337110A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe pin
- probe card
- pin
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体や液晶表示
装置あるいは各種配線基板の電気的な評価試験に使用す
るプローブカードおよびそれに好適なプローブピンに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card used for an electrical evaluation test of a semiconductor, a liquid crystal display device or various wiring boards, and a probe pin suitable for the probe card.
【０００２】[0002]
【従来の技術】従来より、半導体や液晶表示装置等の電
気的な評価試験には図１に示すようなニードル型のプロ
ーブピンを使用したプローブカードが使用されている。
プローブカード用プローブピンとしては、試験対象物で
ある半導体や液晶表示装置の電極端子であるパッドが金
である場合、ベリリウム銅やパラジウムあるいはその合
金が使用されている。2. Description of the Related Art Conventionally, a probe card using a needle-type probe pin as shown in FIG. 1 has been used for an electrical evaluation test of a semiconductor or a liquid crystal display device.
As a probe pin for a probe card, beryllium copper, palladium, or an alloy thereof is used when a semiconductor to be tested or a pad as an electrode terminal of a liquid crystal display device is gold.
【０００３】[0003]
【発明が解決しようとする課題】ベリリウム銅を使用し
たプローブピンは、バネ特性は良いものの先端が経時的
に酸化、腐食し接触抵抗が増加するため従来金メッキを
施していたが、使用回数が増えるに従って金メッキが摩
耗し接触抵抗が増加するという不具合があった。一方、
パラジウムやその合金は経時変化による接触抵抗の増加
はないが、バネ特性が悪いという不具合があった。The probe pin using beryllium copper has good spring characteristics, but the tip is oxidized and corroded with time, and the contact resistance is increased. Accordingly, there is a problem that the gold plating wears and the contact resistance increases. on the other hand,
Palladium and its alloys do not increase the contact resistance due to aging, but have the disadvantage of poor spring characteristics.
【０００４】本発明は、上述した従来のプローブカード
用プローブピンの問題点を解決するためになされたもの
で、バネ特性が優れ、また接触抵抗の経時的な増加のな
いプローブピンおよび信頼性の高いプローブカードを提
供することを目的としている。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the conventional probe pins for a probe card, and provides a probe pin which has excellent spring characteristics, does not increase the contact resistance over time, and has high reliability. It aims to provide a high probe card.
【０００５】[0005]
【課題を解決するための手段】本発明に係るプローブピ
ンは、内部が貴金属あるいはその合金よりなり、外周部
はバネ特性の良い金属よりなるクラッド線であることを
特徴としている。また、本発明のプローブカードは内部
が貴金属あるいはその合金よりなり、外周部はバネ特性
の良い金属よりなるクラッド線をプローブピンに使用し
たことを特徴としている。The probe pin according to the present invention is characterized in that the inside is made of a noble metal or an alloy thereof and the outer peripheral portion is a clad wire made of a metal having good spring characteristics. Further, the probe card of the present invention is characterized in that a clad wire made of a metal having good spring characteristics is used for a probe pin in the inside thereof, made of a noble metal or an alloy thereof.
【０００６】プローブピンの内部を貴金属あるいはその
合金とすることにより、電気的な接触部である先端の経
時的な酸化腐食による電気抵抗の増加をなくすことがで
きるとともに、外周部をバネ特性の良い金属材料とする
ことにより電気的特性と機械的特性を併せ持つことがで
きる。By using a noble metal or an alloy thereof for the inside of the probe pin, it is possible to prevent an increase in electric resistance due to oxidative corrosion of the tip which is an electrical contact portion with time, and to provide an outer peripheral portion with good spring characteristics. By using a metal material, both electrical characteristics and mechanical characteristics can be obtained.
【０００７】本発明に係るプローブピンの内部の貴金属
としては、金、白金、パラジウムおよびこれらの合金が
望ましい。また、外周部はバネ特性の良い金属材料であ
れば良く、ステンレス鋼でも良いが、ベリリウム銅が望
ましい。As the noble metal in the probe pin according to the present invention, gold, platinum, palladium and alloys thereof are desirable. The outer peripheral portion may be made of a metal material having good spring characteristics, and may be stainless steel, but beryllium copper is desirable.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施例について説
明する。 ［第１の実施例］外経１．０ｍｍ、内径０．２ｍｍのベ
リリウム銅のパイプに直径０．１８ｍｍのパラジウム線
を挿入後、伸線機で伸線し、直径が０．２ｍｍの外周部
がベリリウム銅で内部がパラジウムよりなるクラッド線
のプローブピン素材を得た。次いで、片側を機械加工で
テーパーをつけた後、図２に模式的に示したように機械
加工した反対側にニッケルメッキを施し、その後機械加
工した側を折り曲げてプローブピンとした。このように
して得たプローブピンを図１に模式的に示したように基
板に接合した後、リード線をハンダ付けしてプローブカ
ードを得た。Embodiments of the present invention will be described below. [First Embodiment] A palladium wire having a diameter of 0.18 mm is inserted into a pipe of beryllium copper having an outer diameter of 1.0 mm and an inner diameter of 0.2 mm, and then drawn with a wire drawing machine to obtain an outer peripheral portion having a diameter of 0.2 mm. A probe pin material of clad wire composed of beryllium copper and palladium inside was obtained. Next, after one side was tapered by machining, the other side machined as shown schematically in FIG. 2 was plated with nickel, and then the machined side was bent to form a probe pin. The probe pins thus obtained were bonded to a substrate as schematically shown in FIG. 1, and then lead wires were soldered to obtain a probe card.
【０００９】このプローブカードを使用して電極端子が
金パッドの半導体の電気的特性評価を行ったところ、プ
ローブピン先端の経時的な接触抵抗の増加がなく、また
バネ特性も優れており、良好な結果を得た。When the electrical characteristics of the semiconductor having the electrode terminals of gold pads were evaluated using this probe card, the contact resistance at the tip of the probe pin did not increase with time, and the spring characteristics were excellent. Results were obtained.
【００１０】［第２の実施例］外経１．０ｍｍ、内径
０．２ｍｍのＳＵＳ３１６ステンレス鋼のパイプに直径
０．１８ｍｍの白金線を挿入後、第１の実施例と同様に
伸線機で伸線し、直径が０．２ｍｍの外周部がＳＵＳ３
１６ステンレス鋼で内部が白金よりなるクラッド線のプ
ローブピン素材を得た。次いで、片側を機械加工でテー
パーをつけた後、機械加工した反対側にニッケルメッキ
を施し、その後機械加工した側を折り曲げてプローブピ
ンとした。このようにして得たプローブピンを第１の実
施例と同様に基板に接合した後、リード線をハンダ付け
してプローブカードを得た。[Second Embodiment] A platinum wire having a diameter of 0.18 mm is inserted into a SUS316 stainless steel pipe having an outer diameter of 1.0 mm and an inner diameter of 0.2 mm, and is then drawn with a wire drawing machine in the same manner as in the first embodiment. Wire drawn, outer circumference of 0.2mm in diameter is SUS3
A probe pin material of clad wire made of platinum and made of 16 stainless steel was obtained. Next, after one side was tapered by machining, the machined side was plated with nickel, and then the machined side was bent to form a probe pin. The probe pins thus obtained were joined to a substrate in the same manner as in the first embodiment, and then lead wires were soldered to obtain a probe card.
【００１１】このプローブカードを使用して電極端子が
金パッドの半導体の電気的特性評価を行ったところ、プ
ローブピン先端の経時的な接触抵抗の増加がなく、また
バネ特性も優れており、良好な結果を得た。When the electrical characteristics of the semiconductor having the electrode terminals of gold pads were evaluated using this probe card, the contact resistance at the tip of the probe pin did not increase with time, and the spring characteristics were excellent. Results were obtained.
【００１２】[0012]
【発明の効果】本発明によれば、従来のベリリウム銅製
プローブピンの不具合であるプローブピン先端の経時的
な接触抵抗の増加がないとともにバネ特性の優れたプロ
ーブピンを得ることができる。また、このプローブピン
を使用して信頼性の高いプローブカードを得ることがで
きる。なお、本発明に係るプローブピンはニードル型の
プローブピンだけでなく、コブラ型等の縦型のプローブ
ピンとしても使用できる。According to the present invention, it is possible to obtain a probe pin having excellent spring characteristics without increasing the contact resistance at the tip of the probe pin with time, which is a defect of the conventional beryllium copper probe pin. Also, a highly reliable probe card can be obtained by using the probe pins. The probe pin according to the present invention can be used not only as a needle type probe pin but also as a vertical type probe pin such as a cobra type.
【図１】ニードル型のプローブピンを使用したプローブ
カードの模式図である。FIG. 1 is a schematic view of a probe card using a needle-type probe pin.
【図２】本発明に係るプローブピンの断面模式図であ
る。FIG. 2 is a schematic sectional view of a probe pin according to the present invention.
１ パラジウム ２ ベリリウム銅 ３ ニッケルメッキ ４ プローブカード基板 ５ リード線 ６ プローブピン DESCRIPTION OF SYMBOLS 1 Palladium 2 Beryllium copper 3 Nickel plating 4 Probe card board 5 Lead wire 6 Probe pin
Claims (2)
において、内部が貴金属あるいはその合金よりなり、外
周部はバネ特性の良い金属よりなるクラッド線であるこ
とを特徴としたプローブピン。1. A probe pin used for a probe card, wherein the inside is made of a noble metal or an alloy thereof and the outer peripheral portion is a clad wire made of a metal having good spring characteristics.
を特徴とするプローブカード。2. A probe card using the claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000197280A JP2001337110A (en) | 2000-05-29 | 2000-05-29 | Probe pin and probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000197280A JP2001337110A (en) | 2000-05-29 | 2000-05-29 | Probe pin and probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001337110A true JP2001337110A (en) | 2001-12-07 |
Family
ID=18695625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000197280A Pending JP2001337110A (en) | 2000-05-29 | 2000-05-29 | Probe pin and probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001337110A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005351846A (en) * | 2004-06-14 | 2005-12-22 | Micronics Japan Co Ltd | Probe needle |
| WO2007017955A1 (en) * | 2005-08-09 | 2007-02-15 | Kabushiki Kaisha Nihon Micronics | Probe for energization test |
| US7244367B2 (en) * | 2001-12-11 | 2007-07-17 | Jds Uniphase Corporation | Metal alloy elements in micromachined devices |
| KR100902019B1 (en) | 2006-09-26 | 2009-06-15 | 가부시키가이샤 니혼 마이크로닉스 | Electrical Test Probe and Electrical Test Probe Assembly |
| WO2010016608A1 (en) * | 2008-08-08 | 2010-02-11 | 日本発條株式会社 | Electric contact member and contact probe |
| KR101029987B1 (en) | 2008-03-25 | 2011-04-20 | 가부시키가이샤 니혼 마이크로닉스 | Contactor for Electrical Test and Method for Manufacturing the Same |
| JPWO2010114164A1 (en) * | 2009-04-03 | 2012-10-11 | 日本発條株式会社 | Spring wire, contact probe and probe unit |
| JPWO2010117058A1 (en) * | 2009-04-09 | 2012-10-18 | 日本発條株式会社 | Contact probe and probe unit |
| JP2013019891A (en) * | 2011-06-15 | 2013-01-31 | Kobe Steel Ltd | Electrical contact member |
| JP2013174471A (en) * | 2012-02-24 | 2013-09-05 | Nidec-Read Corp | Inspection holder and contact piece |
| EP2690447A2 (en) | 2012-07-25 | 2014-01-29 | Nidec-Read Corporation | Inspection jig and contact |
| US11768227B1 (en) | 2019-02-22 | 2023-09-26 | Microfabrica Inc. | Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers |
| US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
| US11802891B1 (en) | 2019-12-31 | 2023-10-31 | Microfabrica Inc. | Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using |
| US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
-
2000
- 2000-05-29 JP JP2000197280A patent/JP2001337110A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7244367B2 (en) * | 2001-12-11 | 2007-07-17 | Jds Uniphase Corporation | Metal alloy elements in micromachined devices |
| JP2005351846A (en) * | 2004-06-14 | 2005-12-22 | Micronics Japan Co Ltd | Probe needle |
| JP4792465B2 (en) * | 2005-08-09 | 2011-10-12 | 株式会社日本マイクロニクス | Probe for current test |
| WO2007017955A1 (en) * | 2005-08-09 | 2007-02-15 | Kabushiki Kaisha Nihon Micronics | Probe for energization test |
| US7629807B2 (en) | 2005-08-09 | 2009-12-08 | Kabushiki Kaisha Nihon Micronics | Electrical test probe |
| KR100963499B1 (en) | 2005-08-09 | 2010-06-17 | 가부시키가이샤 니혼 마이크로닉스 | Probe for Energization Test |
| KR100902019B1 (en) | 2006-09-26 | 2009-06-15 | 가부시키가이샤 니혼 마이크로닉스 | Electrical Test Probe and Electrical Test Probe Assembly |
| KR100903810B1 (en) | 2006-09-26 | 2009-06-25 | 가부시키가이샤 니혼 마이크로닉스 | Electrical Test Probe and Electrical Test Probe Assembly |
| KR101029987B1 (en) | 2008-03-25 | 2011-04-20 | 가부시키가이샤 니혼 마이크로닉스 | Contactor for Electrical Test and Method for Manufacturing the Same |
| TWI399544B (en) * | 2008-03-25 | 2013-06-21 | Nihon Micronics Kk | Contactors for electrical testing and methods for their manufacture |
| EP2322943A4 (en) * | 2008-08-08 | 2014-06-25 | Nhk Spring Co Ltd | Electric contact member and contact probe |
| WO2010016608A1 (en) * | 2008-08-08 | 2010-02-11 | 日本発條株式会社 | Electric contact member and contact probe |
| EP2322943A1 (en) * | 2008-08-08 | 2011-05-18 | NHK Spring Co., Ltd. | Electric contact member and contact probe |
| JPWO2010016608A1 (en) * | 2008-08-08 | 2012-01-26 | 日本発條株式会社 | Work member, electrical contact member, contact probe, and method of manufacturing electrical contact member |
| JPWO2010114164A1 (en) * | 2009-04-03 | 2012-10-11 | 日本発條株式会社 | Spring wire, contact probe and probe unit |
| JPWO2010117058A1 (en) * | 2009-04-09 | 2012-10-18 | 日本発條株式会社 | Contact probe and probe unit |
| JP2013019891A (en) * | 2011-06-15 | 2013-01-31 | Kobe Steel Ltd | Electrical contact member |
| JP2013174471A (en) * | 2012-02-24 | 2013-09-05 | Nidec-Read Corp | Inspection holder and contact piece |
| EP2690447A2 (en) | 2012-07-25 | 2014-01-29 | Nidec-Read Corporation | Inspection jig and contact |
| US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
| US11768227B1 (en) | 2019-02-22 | 2023-09-26 | Microfabrica Inc. | Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers |
| US11802891B1 (en) | 2019-12-31 | 2023-10-31 | Microfabrica Inc. | Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using |
| US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
| US11906549B1 (en) | 2019-12-31 | 2024-02-20 | Microfabrica Inc. | Compliant pin probes with flat extension springs, methods for making, and methods for using |
| US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
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