TW201702392A - Alloy material, contact probe and connecting terminal - Google Patents

Abstract

An alloy material of the present invention comprises copper (Cu) as a main component. Further, 10 to 30 wt% of silver (Ag) and 0.5 to 10 wt% of the nickel (Ni) are added therein. Herewith the material alloy that has no film but excellent Sn corrosion resistance is provided. Also, a contact probe and a connecting terminal comprising the material alloy are provided.

Description

Alloy material, contact probe and connection terminal

The present invention relates to, for example, an alloy material, and a contact probe composed of the alloy material for conducting state inspection or operation characteristic inspection of an inspection object such as a semiconductor integrated circuit or a liquid crystal display device, and connecting electric contacts to each other Connection terminal between.

In the past, when conducting a conductive state inspection or an operation characteristic inspection of an inspection object such as a semiconductor integrated circuit or a liquid crystal panel, a conductive contact probe is used, which is intended to perform signal processing of an inspection target and a circuit substrate having an output inspection signal. Electrical connection between the devices. In order to perform an accurate inspection of the conductive state and the inspection of the operational characteristics, it is necessary to surely perform the input and output of the inspection signal through the contact probe.

The contact probe is used in such a manner as to repeatedly contact an object to be inspected such as a semiconductor integrated circuit or a liquid crystal display device. At this time, for example, when the contact probe is deteriorated due to the repeated use, the inspection result is affected. In particular, when the object to be inspected such as a tin-plated (Sn) electrode is relatively soft, the Sn plating of the electrode is likely to adhere to the surface of the contact probe, and the resistance value is changed due to the adhesion of the Sn plating, and it is difficult to perform the stability inspection. Therefore, the contact probe The material to be used must be hard to wear even if it is repeatedly contacted, and has high hardness, high electrical conductivity, corrosion resistance, and good oxidation resistance as compared with the object to be inspected. In order to improve the corrosion resistance of Sn, for example, a technique of applying a carbon film to the tip end portion of the contact probe head or a technique of performing a plating ruthenium (Rh) has been proposed (for example, refer to Patent Documents 1 and 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-226874

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-131334

However, in the coating technique or the plating technique of the above various types, there is a possibility that the film peels off due to the repeated contact with the inspection object, and the foreign matter adheres to the inspection object to cause a conduction failure. Therefore, it is desirable to make a contact probe head with a non-fouling material which has no doubt of peeling off of the film.

The present invention has been made in view of the above problems, and an object of the invention is to provide an alloy material which does not have a film and has excellent Sn corrosion resistance, and a contact probe and a connection terminal formed of the alloy material.

In order to solve the above problems and achieve the object, the alloy material of the present invention contains copper (Cu) as a main component, and 10 to 30% by weight of silver (Ag) and 0.5 to 10% by weight of nickel (Ni) are added.

Further, the alloy material of the present invention is in the above invention, Further, 5 to 20% by weight of palladium (Pd) is added.

Further, in the alloy material of the present invention, in the above invention, 0.5 to 5 wt% of tin (Sn) is further added.

Further, in the alloy material of the present invention, in the above invention, 0.01 to 0.1% by weight of any one of iridium (Ir) and ruthenium (Ru) or a combination of the elements is further added.

Further, the contact probe of the present invention is a conductive contact probe that is in contact with a contact object at both ends in the longitudinal direction, and at least a part thereof is formed using the alloy material of the above invention.

Further, in the above-described invention, the contact probe of the present invention has a conductive first plunger that is in contact with one of the contact objects at one end, and a conductive second plunger that is in contact with the other end at one end. And the coil spring is disposed between the first and second plungers to expand and contract the first and second plungers; and the first plunger, the second plunger, and the coil spring At least one of them is composed of the aforementioned alloy material.

Further, the connection terminal of the present invention is a conductive connection terminal that is in contact with a contact object at both ends in the longitudinal direction, and at least a part thereof is formed using the alloy material of the above invention.

According to the present invention, since Cu is contained as a main component and 10 to 30% by weight of silver (Ag) and 0.5 to 10% by weight of nickel (Ni) are added, the film is not provided, and Sn corrosion resistance is excellent and available. As a contact probe or a connection terminal, an alloy material excellent in electrical conductivity, workability, and hardness is obtained. Effect.

1‧‧‧ socket

2‧‧‧Contact probe (probe)

3‧‧‧ probe holder

4‧‧‧ bracket components

21‧‧‧1st plunger

22‧‧‧2nd plunger

23‧‧‧ coil spring

23a‧‧‧Compact Winding Department

23b‧‧‧ Loose winding department

31‧‧‧1st component

32‧‧‧2nd component

33, 34‧‧‧ bracket holes

100‧‧‧Semiconductor integrated circuit

101‧‧‧Connecting electrode

200‧‧‧ circuit substrate

201‧‧‧ electrodes

Fig. 1 is a perspective view showing a schematic configuration of a socket in which one of the alloy materials according to the embodiment of the present invention is used.

Fig. 2 is a partial cross-sectional view showing the configuration of a main part of a socket in which one of the alloy materials according to the embodiment of the present invention is used.

Fig. 3 is a partial cross-sectional view showing the configuration of a main portion of a socket when one of the alloy materials of the embodiment of the present invention is used, and the semiconductor integrated circuit is inspected.

Hereinafter, the form for carrying out the invention will be described in detail with reference to the drawings. Further, the present invention is not limited to the following embodiments. In addition, in each of the drawings referred to in the following description, the shape, the size, and the positional relationship are schematically shown to the extent that the contents of the present invention can be understood. That is, the present invention is not limited to the shapes, sizes, and positional relationships illustrated in the respective drawings.

The alloy material of the embodiment of the present invention will be described. The present invention is an alloy material mainly composed of copper (Cu). Although Cu exhibits high conductivity, its oxidation resistance is slightly inferior and its hardness is low. Therefore, by adding silver (Ag) or nickel (Ni) as an additive element to Cu, it is attempted to improve conductivity, hardness, oxidation resistance, and tin (Sn) corrosion resistance.

Ag is excellent in conductivity and oxidation resistance, and by performing aging treatment, Ag which has been dissolved in Cu is precipitated, and hardness can be expected Rise. Since the aging precipitation hardening is less likely to occur when the amount of Ag added is small, it is desirable to add 10% by weight or more of Ag. However, when added to more than 30% by weight, Sn corrosion resistance is deteriorated, which is not preferable.

Further, 0.5 to 10% by weight of Ni is added to the alloy material of the present embodiment. Ni has the effect of improving corrosion resistance/hardness of Sn. When it is less than 0.5% by weight, Sn corrosion resistance cannot be obtained, and when it exceeds 10% by weight, workability is deteriorated, which is poor.

Further, in the alloy material of the above composition, 5 to 20% by weight of palladium (Pd) may be further added. Pd is excellent in oxidation resistance, and it is also expected to increase hardness by adding. When the amount of Pd added is small, there is no effect on the improvement in oxidation resistance/hardness increase, and it is expected to add Pwt of 5 wt% or more. However, when added to more than 20% by weight, the conductivity/Sn corrosion resistance is lowered, which is not preferable.

Further, for the alloy material of the above composition, 0.5 to 5 wt% of Sn may be further added. By the addition of Sn, it is possible to suppress the adhesion of Sn from the outside, and it is also expected to increase the hardness. When the amount of Sn added is small, there is no effect on the improvement of Sn corrosion resistance/hardness increase, so it is expected to add 0.5 wt% or more of Sn. However, when added to more than 5% by weight, workability is lowered, which is not preferable.

Further, for the alloy material having the above composition, 0.01 to 0.1% by weight of any one of iridium (Ir) and ruthenium (Ru) or a combination of these elements may be added. These added metals are advantageous for workability, and compared with those which are not added, they reduce minute cracks generated on the surface of the alloy during the calendering process, thereby improving workability. The addition amount of any of Ir, Ru or a combination of these elements does not change the effect even if it exceeds 0.1% by weight, so it is an appropriate amount of 0.01 to 0.1% by weight. Ir and Ru have the effect of refining crystal grains, when crystal grains are compared Small, it is not easy to produce grain boundary cracks during calendering.

According to the above-described embodiment, since Cu is contained as a main component and 10 to 30% by weight of Ag and 0.5 to 10% by weight of Ni are added, an alloy excellent in conductivity, hardness, oxidation resistance, and Sn corrosion resistance can be obtained. The material acts as a contact probe.

Next, the case where the alloy material of this embodiment is used as a contact probe will be described. Fig. 1 is a perspective view showing a schematic configuration of a socket (contact probe) in which one of the alloy materials according to the embodiment of the present invention is used. The socket 1 shown in FIG. 1 is a device used for performing electrical characteristic inspection of the semiconductor integrated circuit 100 as an inspection object, and is electrically connected to the semiconductor integrated circuit 100 and outputs an inspection to the semiconductor integrated circuit 100. A device between the circuit boards 200 with signals.

The socket 1 has a plurality of contact probes 2 (hereinafter referred to as "probe 2"), and is in contact with one electrode (contact object) of the semiconductor integrated circuit 100 as a contacted body on one end side in the longitudinal direction. And contacting the electrode (contact object) of the circuit substrate 200 on the other end side; the probe holder 3 houses and holds the plurality of probes 2 in accordance with a predetermined pattern; and the holder member 4 is disposed on Around the probe holder 3, the positional deviation of the semiconductor integrated circuit 100 that is in contact with the plurality of probes 2 is suppressed at the time of inspection.

Fig. 2 is a partial cross-sectional view showing a configuration of a main portion of a socket (contact probe) in which one of the alloy materials of the present embodiment is used, and shows a detailed configuration of the probe 2 housed in the probe holder 3. Picture. The probe 2 shown in Fig. 2 includes a first plunger 21 and is being carried out. When the semiconductor integrated circuit 100 is inspected, it is in contact with the connection electrode of the semiconductor integrated circuit 100; the second plunger 22 is in contact with the electrode 201 of the circuit substrate 200 having the inspection circuit; and the coil spring 23 is provided in The first plunger 21 and the second plunger 22 are connected to each other between the first plunger 21 and the second plunger 22 so as to be expandable and contractible. The first plunger 21, the second plunger 22, and the coil spring 23 constituting the probe 2 have the same axis. When the probe 2 is in contact with the semiconductor integrated circuit 100, the coil spring 23 expands and contracts in the axial direction to relieve the connection of the connection electrode to the semiconductor integrated circuit 100, and simultaneously the semiconductor integrated circuit 100 and the circuit substrate 200. Apply a load.

At least one of the first plunger 21, the second plunger 22, and the coil spring 23 is formed using the above-described alloy material, and it is preferable that all of the members are formed using the alloy material. Further, the coil spring 23 is designed to have a diameter of the wire and a diameter to be wound in such a manner that the amount of contraction of the loosely wound portion 23b when a predetermined load is applied is when the initial load is applied, for example, When the probe 2 is housed in the state of the probe holder 3 (see FIG. 1 ), the shortest distance between the proximal end portion of the second plunger 22 and the tightly wound portion 23 a is greater. By using the coil spring 23 having the spring characteristic, the base end portion can be slidably engaged in the tightly wound portion 23a when a predetermined load is applied to the probe 2, and the base end portion and the tightly wound portion 23a can be performed. Electrical conduction between.

The probe holder 3 is formed of an insulating material such as a resin, a machinable ceramic, or a crucible, and is formed by laminating a first member 31 on the upper surface side and a second member 32 on the lower surface side in FIG. The first member In the 31 and the second members 32, the same number of holder holes 33 and 34 for accommodating the plurality of probes 2 are respectively formed, and the holder holes 33 and 34 for accommodating the probes 2 are formed so as to coincide with each other. The positions at which the holder holes 33 and 34 are formed are determined in accordance with the wiring pattern of the semiconductor integrated circuit 100.

Fig. 3 is a cross-sectional view showing the configuration of a main portion of a socket in the case where the semiconductor integrated circuit is inspected, and shows the use of the probe holder 3 in the socket (contact probe) in which the alloy material of the embodiment is used. A diagram of the state of the semiconductor integrated circuit 100 at the time of inspection. When the coil integrated circuit is inspected and the coil spring 23 is compressed, as shown in FIG. 3, the proximal end portion of the second plunger 22 is slidably engaged with the inner circumferential side of the tightly wound portion 23a. At this time, the inspection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 reaches the connection electrode 101 of the semiconductor integrated circuit 100 via the second plunger 22, the tightly wound portion 23a, and the first plunger 21 . . As described above, in the probe 2, since the first plunger 21 and the second plunger 22 are electrically conducted through the tightly wound portion 23a, the conductive path of the electrical signal can be minimized. Therefore, during the inspection, the signal is prevented from flowing to the loose winding portion 23b, and the inductance can be lowered and stabilized. Further, in the present embodiment, the coil spring has a loosely wound portion and a tightly wound portion, but a coil spring composed of only a loosely wound portion may be used.

Further, since the tip end of the first plunger 21 is formed to be tapered, even when an oxide film is formed on the surface of the connection electrode 101, the oxide film can be pierced, and the tip end of the first plunger 21 and the connection electrode 101 can be made. direct contact.

In addition, the configuration of the probe 2 described herein is nothing more than In one example, the above alloy material may be applied to various types of probes known in the prior art. For example, it is not limited to the one described above by the plunger and the coil spring, and may be a wire probe that connects the probe, the pogo pin, or the metal wire having the pipe member into a bow shape to obtain a load. Connection terminals (connectors) between the electrical contacts.

Here, the connection terminal is connected to the electrical contacts, for example, the probe 2 described above, and has two conductive terminals that are in contact with the respective electrical contacts, and the elasticity that allows the terminals to slide. Member (or holding member). In such a connection terminal, at least the terminal is composed of the above alloy material.

(Example)

Examples and comparative examples of the alloy material of the present invention will be described in detail below. First, the measurement contents of the alloy material of the present embodiment will be described.

The hardness test piece was measured by Vickers hardness (hardness of aging material) after dissolution treatment and aging treatment.

The test piece for conductivity was produced by a dissolution treatment and a aging treatment. Then, the electric resistance was determined by measuring the electric resistance value of the test piece for the electric conductivity using a resistance measuring machine.

A test piece for evaluation of Sn corrosion resistance was produced in the following manner. The test piece for conductivity prepared in advance was subjected to cutting processing so that the diameter of the tip end was 0.1 mm. The test piece was brought into contact with the Sn-plated plate by a predetermined elastic force, and the front end of the test piece was observed by SEM. The evaluation of the corrosion resistance of Sn was performed by SEM observation, and if no Sn is attached, it is set to ○, and when it is observed that there is an attachment, it is set to ×.

The workability was evaluated in accordance with the calendering process at the time of producing the test piece for conductivity and the processing at the time of cutting in the case of producing a test piece for evaluation of Sn corrosion resistance. The evaluation standard is set to ○ within the machining dimensional tolerance when the rolling process is not broken, and is within the machining dimensional tolerance when the machining is performed into a needle shape, and is set to × outside the tolerance.

Next, the weight ratio of each metal of the alloy material of the present embodiment will be described. Table 1 shows the weight ratio (composition) and measurement results of the alloy materials of Examples 1 to 13 and Comparative Examples 1 to 7. Examples 1 to 13 are compositions within the scope of the present embodiment. Comparative Examples 1 to 7 are compositions which are outside the scope of the present embodiment.

The measurement results of Examples 1 to 13 and Comparative Examples 1 to 7 will be described below. Examples 1 to 13 are compositions within the scope of the present embodiment. From Examples 1 to 13, it was confirmed that Sn adhesion was exhibited without exhibiting adhesion of Sn. Also, good results were obtained for hardness/conductivity/processability.

Comparative Example 1 is a composition in which the amount of Ni added is less than the range of the present embodiment. Compared with Examples 1 to 13, Comparative Example 1 had a large amount of Sn adhesion and a low Sn corrosion resistance. In Comparative Example 1, when the amount of Ni added was small, the corrosion resistance of Sn deteriorated, which was not preferable.

Comparative Example 2 is a composition in which the amount of addition of Ni is larger than the range of the present embodiment. In Comparative Example 2, it was impossible to perform processing with excellent precision. In Comparative Example 2, when the amount of Ni added was large, the workability was deteriorated, which was not preferable.

Comparative Example 3 is a composition in which the amount of Ag added is less than the range of the present embodiment. Compared to Examples 1 to 13, Comparative Example 3 was low in hardness and was not preferable as a contact probe.

Comparative Example 4 is a composition in which the amount of Ag added is more than the range of the present embodiment. Compared with Examples 1 to 13, Comparative Example 4 has a large amount of Sn adhesion and a low Sn corrosion resistance. In Comparative Example 4, when the amount of Ag added was large, the corrosion resistance of Sn deteriorated, which was not preferable.

Comparative Example 5 is a composition in which the amount of Pd added is more than the range of the present embodiment. In Comparative Example 5, Sn was more attached and Sn corrosion resistance was lower than in Examples 1 to 13. In Comparative Example 5, when the amount of Pd added was large, the corrosion resistance of Sn deteriorated, which was not preferable.

Comparative Example 6 is a composition in which the amount of addition of Sn is much larger than the range of the present embodiment. In Comparative Example 6, cracks occurred during the rolling process, and the test piece for conductivity was not processed. According to Comparative Example 6, it can be said that when the amount of addition of Sn is large, the workability is deteriorated, which is not preferable.

Comparative Example 7 is a composition composed of Cu, Ag, Pd, manganese (Mn), and Ir which is outside the range of the present embodiment. Compared with Examples 1 to 13, Comparative Example 7 has a large hardness but poor machinability, and Sn corrosion resistance is also poor. In Comparative Example 7, the use as a contact probe for a low hardness material such as Sn solder is not preferable.

(industrial availability)

As described above, the alloy material of the present invention, the contact probe composed of the alloy material, and the connection terminal can be used as a contact probe in terms of conductivity, hardness, oxidation resistance, and Sn corrosion resistance.

1‧‧‧ socket

2‧‧‧Contact probe (probe)

3‧‧‧ probe holder

4‧‧‧ bracket components

100‧‧‧Semiconductor integrated circuit

200‧‧‧ circuit substrate

Claims (11)

An alloy material containing copper (Cu) as a main component and added with 10 to 30% by weight of silver (Ag) and 0.5 to 10% by weight of nickel (Ni). For example, the alloy material described in claim 1 is further added with 5 to 20% by weight of palladium (Pd). As the alloy material described in claim 2, 0.5 to 5 wt% of tin (Sn) is further added. For example, the alloy material described in claim 1 is further added with 0.5 to 5 wt% of tin (Sn). As the alloy material described in claim 1, the addition of 0.01 to 0.1% by weight of any of Ir(R) and Ru (Ru) or a combination of the elements. As the alloy material described in the second aspect of the patent application, 0.01 to 0.1% by weight of any one of iridium (Ir) and ruthenium (Ru) or a combination of the elements is further added. As the alloy material described in claim 3, 0.01 to 0.1% by weight of any one of iridium (Ir) and ruthenium (Ru) or a combination of the elements is further added. As the alloy material described in claim 4, 0.01 to 0.1% by weight of any of iridium (Ir) and ruthenium (Ru) or a combination of the elements is further added. A contact probe is a conductive contact probe that is in contact with a contact object at both ends in the longitudinal direction, and at least a part thereof is formed using the alloy material according to any one of claims 1 to 8. The contact probe according to claim 9, comprising: a conductive first plunger that is in contact with one of the contact objects at one end; and the electrically conductive second plunger is one end and the other a contact spring contact; and a coil spring that is coupled between the first and second plungers to expand and contract the first and second plungers; wherein the first plunger, the second plunger, and the At least one of the coil springs comprises the aforementioned alloy material. A connection terminal is a conductive connection terminal that is in contact with a contact object at both ends in the longitudinal direction, and at least a part thereof is formed using the alloy material according to any one of claims 1 to 8.